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Infineon Technologies CY7C1381D-100AXCT

Part No.:
CY7C1381D-100AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1381D-100AXCT.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,788

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Product details

Overview

CY7C1381D-100AXCT from Cypress Semiconductor is a 18-Mbit (512K × 36) synchronous flow-through SRAM with 133 MHz bus operation, 6.5 ns clock-to-output delay, 3.3 V core supply (VDD), 2.5/3.3 V I/O supply (VDDQ), and JEDEC-standard Pb-free 100-pin TQFP packaging. It serves as high-speed cache or buffer memory in Pentium-class processor systems requiring burst-mode interfacing with minimal glue logic.

For engineers reviewing the CY7C1381D-100AXCT datasheet, CY7C1381D-100AXCT pinout, CY7C1381D-100AXCT application, or CY7C1381D-100AXCT equivalent, key selection criteria include burst sequence mode (interleaved/linear), ZZ sleep control behavior, VDDQ voltage tolerance, CE1/CE2/CE3 enable timing, and JTAG boundary-scan limitations per errata.

Technical Context

The CY7C1381D-100AXCT implements a synchronous, clock-driven architecture where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. A 2-bit on-chip burst counter captures A[1:0] at ADSP/ADSC assertion and auto-increments for subsequent burst cycles controlled by ADV.

It supports dual-burst initiation via processor (ADSP) or controller (ADSC) strobes, with asynchronous OE enabling tristate output control and asynchronous ZZ enabling non-time-critical sleep. The device uses separate byte write enables (BWA–BWD) qualified by BWE and global write (GW), and features IEEE 1149.1 JTAG boundary scan-though errata require BYPASS mode during testing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18 Mbit (512K × 36 organization)
Max Clock Frequency133 MHz - defines maximum sustained burst throughput without wait states
Access Time (tCO)6.5 ns - clock-to-output delay determines minimum read cycle latency
VDD Supply3.3 V ± 0.3 V - core voltage rail powering internal logic and array; requires stable regulation
VDDQ Supply2.5 V or 3.3 V - selectable I/O voltage supporting mixed-voltage system interfacing
Burst ModeUser-selectable interleaved or linear via MODE pin - matches Pentium or custom controller addressing schemes
Package100-pin TQFP (14 × 20 × 1.4 mm), Pb-free - surface-mount compatible with standard reflow profiles

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, with exposed thermal pad (not electrically connected).

Pin/TerminalCircuit RoleDesign Meaning
A0, A1, A[2:18]Synchronous Address InputSampled on CLK rise when ADSP/ADSC active; A[1:0] load 2-bit burst counter
CLKSystem Clock InputEdge-triggered master timing reference for all synchronous inputs and burst advancement
ADSP / ADSCAddress Strobe InputsADSP (processor) takes priority over ADSC (controller); both qualify address capture and counter load
ADVBurst Address AdvanceAsserted LOW on CLK rise to increment internal burst counter for next location
CE1, CE2, CE3Chip Enable InputsCE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); decoded together for depth expansion
BWA–BWD, BWE, GWWrite Control InputsByte-write select + enable (BWE) or global write (GW); all sampled synchronously on CLK rise
OEAsynchronous Output EnableActive LOW enables DQ/DQP outputs; masked during first read clock after deselection
ZZAsynchronous Sleep InputActive HIGH enters low-power sleep; errata require external grounding (Pin 64)
DQs / DQPXBidirectional Data I/O36-bit data + 4-bit parity (DQPA–DQPD); direction controlled by OE; tristated during writes

Key Features

FeatureDesign Value
Flow-through burst architectureEliminates pipeline stalls during consecutive reads/writes; supports 2-1-1-1 access rate
User-selectable burst sequenceMODE pin configures Intel Pentium interleaved or linear addressing without firmware change
Dual-strobe address captureIndependent ADSP (CPU) and ADSC (cache controller) inputs enable flexible system-level memory arbitration
Separate VDD/VDDQ suppliesAllows interfacing with 2.5 V or 3.3 V I/O domains while maintaining 3.3 V core integrity
JTAG boundary scan (IEEE 1149.1)Enables board-level testability; must operate in BYPASS mode per silicon errata

Applications

High-Performance CPU CacheNetwork Packet Buffer

Use Scenario: L2 cache memory for x86-compatible microprocessors operating at 133 MHz bus speed.

IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing zero-wait-state burst reads aligned to processor ADSP timing.

Use Value: 6.5 ns tCO and 2-1-1-1 access rate reduce average memory latency versus asynchronous SRAM alternatives.

Use Scenario: Temporary storage for variable-length Ethernet frames in switch fabric ASIC interfaces.

IC Role / Device Role / Timing Role: Burst-capable buffer accepting interleaved writes from ingress pipeline and linear reads to egress scheduler.

Use Value: MODE-selectable burst mode adapts to upstream/downstream controller addressing requirements without hardware redesign.

Industrial Motion Controller MemoryAvionics Data Acquisition Buffer

Use Scenario: Real-time position lookup table storage in servo drive systems with deterministic timing constraints.

IC Role / Device Role / Timing Role: Deterministic-access SRAM holding trajectory data; ZZ pin enables power-gated idle periods between motion segments.

Use Value: Asynchronous ZZ sleep preserves data while reducing standby current to ≤70 mA, critical for thermally constrained enclosures.

Use Scenario: High-integrity buffering of sensor telemetry streams in DO-254-compliant flight control modules.

IC Role / Device Role / Timing Role: Parity-enabled (DQPX) memory ensuring single-bit error detection during ADC sample buffering.

Use Value: Integrated DQ/DQP bidirectional I/O with synchronous write qualification (BWE + BWx) guarantees atomic sample writes under EMI stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C33128A-10BIN16-Mbit (512K × 32), 10 ns access, no ZZ sleep, no JTAG, 3.3 V only VDDQLacks burst mode selection and sleep control; limited to fixed-linear burstsChoose when JTAG testability and low-power sleep are unnecessary and cost is primary driver
IS61WV102432BLL-10MLI32-Mbit (1M × 32), 10 ns access, no MODE pin, no ZZ, no JTAG, supports 2.5 V VDDQHigher density but no user-configurable burst type or sleep mode; simpler interfaceChoose when larger capacity is required and system controller handles burst sequencing externally

Compared with AS7C33128A-10BIN and IS61WV102432BLL-10MLI, CY7C1381D-100AXCT uniquely provides configurable burst mode, asynchronous sleep control, and IEEE 1149.1 boundary scan-critical for Pentium-compatible designs requiring debug visibility and power-aware operation.

Availability

CY7C1381D-100AXCT is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffering, and industrial motion control systems requiring stable component supply, long-lifecycle support, and Pb-free compliance.

Supply support for CY7C1381D-100AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip (PSoC), memory, and USB solutions for industrial, automotive, and consumer applications.

CY7C1381D belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for cache and buffer applications in microprocessor-based systems requiring burst-mode compatibility and low-latency deterministic access.

FAQ

What is the correct handling of the ZZ pin per official errata?

The ZZ pin (Pin 64 in TQFP) must be externally connected to ground for reliable operation. Although internally pulled down, Cypress errata (Document 38-05544 Rev. *V, page 32) explicitly requires this external connection to prevent unintended sleep entry. Leaving ZZ floating or driving it HIGH may cause intermittent data retention failure during active operation.

Can CY7C1381D-100AXCT operate with 2.5 V VDDQ while using 3.3 V VDD?

Yes - the device is specified to operate with 3.3 V core (VDD) and independently supplied 2.5 V or 3.3 V I/O (VDDQ). This dual-supply capability allows direct interfacing with 2.5 V logic families while maintaining full 133 MHz performance and 6.5 ns tCO, as confirmed in the DC and AC electrical characteristics tables (pages 20–23).

Is JTAG boundary scan functional on CY7C1381D-100AXCT?

JTAG is physically implemented per IEEE 1149.1, but Cypress errata mandates use only in BYPASS mode. Functional testing in EXTEST or SAMPLE/PRELOAD modes is not guaranteed due to silicon-level issues. For production test, rely on functional verification via ADSP/ADSC timing rather than JTAG scan chains.

How does burst addressing work when both ADSP and ADSC are asserted simultaneously?

ADSP has strict priority over ADSC: when both are active LOW, only ADSP is recognized and the address is captured from the processor bus. The ADSC signal is ignored in that cycle. This prioritization ensures deterministic arbitration in systems where CPU and cache controller share the same SRAM bus.

CY7C1381D-100AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1381D-100AXCT FAQ

1.How can I place an order for CY7C1381D-100AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1381D-100AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1381D-100AXCT reliable?

The price and inventory of CY7C1381D-100AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1381D-100AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1381D-100AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1381D-100AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1381D-100AXCT?

CY7C1381D-100AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1381D-100AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1381D-100AXCT?

For technical support, including CY7C1381D-100AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1381D-100AXCT requirements.

6.How does Aetrix verify that CY7C1381D-100AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1381D-100AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1381D-100AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1381D-100AXCT?

All CY7C1381D-100AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1381D-100AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1381D-100AXCT part is unused and in its original packaging.

Return procedure for CY7C1381D-100AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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