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Infineon Technologies CY7C1381D-133AXCT
- Part No.:
- CY7C1381D-133AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1381D-133AXCT.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,238
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Product details
Overview
CY7C1381D-133AXCT from Cypress Semiconductor is a 18-Mbit (512K × 36) synchronous flow-through SRAM with 133 MHz bus operation, 3.3 V core supply (VDD), 2.5 V/3.3 V I/O supply (VDDQ), and 6.5 ns clock-to-output delay. It supports Intel Pentium–compatible interleaved or linear burst sequences via MODE pin selection and is used in high-speed cache and buffer applications interfacing with microprocessors requiring minimal glue logic.
For engineers reviewing the CY7C1381D-133AXCT datasheet, CY7C1381D-133AXCT pinout, CY7C1381D-133AXCT application, or CY7C1381D-133AXCT equivalent, key selection criteria include burst address sequencing mode (interleaved vs. linear), dual-voltage I/O support (VDDQ = 2.5 V or 3.3 V), ZZ sleep mode behavior, JTAG boundary-scan compatibility, and TQFP-100 package pin mapping for PCB layout verification.
Technical Context
This SRAM implements synchronous, clock-driven address capture on rising CLK edge when ADSP or ADSC is active, with internal 2-bit burst counter (A[1:0]) auto-incrementing addresses during ADV-triggered bursts. All write operations are self-timed and synchronous, while OE remains fully asynchronous for output control.
The device features three chip enables (CE1 active LOW, CE2 active HIGH, CE3 active LOW), four byte-write controls (BWA–BWD), global write (GW), and separate processor/controller address strobes-enabling flexible depth expansion and multi-controller system integration without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 organization) |
| Max Clock Frequency | 133 MHz - defines maximum sustained burst throughput and interface timing margin |
| Access Time (tCO) | 6.5 ns - guaranteed clock-to-output delay at 133 MHz, critical for setup timing to downstream logic |
| VDD Supply | 3.3 V ± 0.3 V - core voltage rail powering memory array and internal registers |
| VDDQ Supply | 2.5 V or 3.3 V - selectable I/O voltage enabling interoperability with 2.5 V or 3.3 V bus systems |
| Burst Mode Control | MODE pin - HIGH = Intel Pentium–style interleaved burst; LOW = linear burst sequence |
| Sleep Mode | ZZ pin (active HIGH) - places device in low-power state with data retention; requires external grounding per errata |
Pinout & Package
Package: JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[1:0] | Synchronous address inputs | Sampled on CLK rise when ADSP/ADSC active; initialize 2-bit burst counter for address incrementing |
| ADSP / ADSC | Address strobe inputs | ADSP = processor-initiated access; ADSC = controller-initiated; ADSP takes priority when both asserted |
| ADV | Burst advance control | Asserted LOW on CLK rise to auto-increment burst address; enables 2-1-1-1 access pattern |
| CE1, CE2, CE3 | Chip enable signals | Three-level decode: CE1 (LOW), CE2 (HIGH), CE3 (LOW); enables depth expansion across multiple devices |
| BWA–BWD, BWE | Byte write controls | BWE enables byte writes; BWA–BWD select individual 9-bit bytes (DQA–DQD groups) for partial writes |
| DQs / DQPX | Data I/O and parity I/O | 36-bit bidirectional data (DQA–DQD) + 4-bit parity (DQPA–DQPD); direction controlled by OE |
| ZZ | Asynchronous sleep input | Active HIGH; must be externally tied to GND per errata (Pin 64); internal pull-down ensures safe default |
| OE | Asynchronous output enable | Active LOW; overrides synchronous timing to tristate outputs immediately, independent of CLK |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Eliminates pipeline latency between consecutive burst reads/writes; supports continuous 133 MHz data streaming |
| User-selectable burst sequence | MODE pin configures interleaved (Pentium-compatible) or linear addressing-no firmware change required |
| Dual-voltage I/O (VDDQ) | Supports mixed-voltage system design: interfaces directly to 2.5 V ASICs or 3.3 V FPGAs without level shifters |
| IEEE 1149.1 JTAG boundary scan | Enables in-circuit testability and board-level diagnostics; BYPASS mode required per errata |
| Synchronous self-timed write | Internal write cycle completes autonomously after CLK edge; no external wait-state generation needed |
Applications
| High-Speed CPU Cache Buffer | Network Packet Buffer |
|---|---|
Use Scenario: L2/L3 cache buffer between Pentium-class microprocessor and main memory subsystem. IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing zero-wait-state burst reads with 2-1-1-1 access pattern aligned to processor bus timing. Use Value: 6.5 ns tCO and 133 MHz operation meet tight setup/hold margins of 100+ MHz front-side buses; MODE pin allows seamless switch between Intel and custom burst protocols. | Use Scenario: Temporary storage for variable-length Ethernet or ATM packets in line-card ASIC interfaces. IC Role / Device Role / Timing Role: Burst-capable SRAM buffering incoming packet payloads before DMA transfer to host memory. Use Value: Separate ADSP/ADSC strobes allow concurrent CPU and DMA controller access; CE2/CE3 enable banked memory partitioning for parallel ingress/egress paths. |
| Industrial Motion Controller Memory | Video Frame Buffer Interface |
Use Scenario: Real-time trajectory buffer in CNC or robotics motion controllers requiring deterministic read/write latency. IC Role / Device Role / Timing Role: Deterministic-access SRAM holding interpolated position commands synchronized to servo loop clock. Use Value: Asynchronous OE and ZZ sleep enable rapid output disable and power gating between motion segments; VDDQ = 2.5 V matches FPGA I/O banks driving DACs. | Use Scenario: Intermediate frame store between image sensor interface and video encoder ASIC in broadcast equipment. IC Role / Device Role / Timing Role: High-bandwidth pixel buffer supporting 720p60 YUV422 streaming with burst-aligned writes. Use Value: 36-bit DQ width maps directly to 16-bit RGB + 20-bit metadata; 133 MHz clock sustains >4 Gbps effective bandwidth for uncompressed video pipelines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-133TQLI | 18-Mbit (1M × 18), 133 MHz, 3.3 V core, but only 18-bit data width and no MODE-selectable burst type | Requires two devices for 36-bit width; lacks interleaved burst support - limits Pentium compatibility | Select if 18-bit bus width suffices and burst sequence is fixed linear only |
| AS7C31026B-133BIN | 16-Mbit (512K × 32), 133 MHz, 3.3 V core, no VDDQ flexibility (fixed 3.3 V I/O), no ZZ sleep mode | Lower density (16 Mbit), missing parity I/O (DQPX), no low-power sleep - unsuitable for power-constrained embedded systems | Select only for cost-sensitive designs where parity and sleep are unnecessary and 32-bit width is acceptable |
Compared with IS61WV102436BLL-133TQLI and AS7C31026B-133BIN, CY7C1381D-133AXCT uniquely delivers 512K × 36 organization with MODE-configurable burst, dual-VDDQ support, and ZZ sleep - making it the sole option for Pentium-compatible cache buffers needing 36-bit width, parity, and power-aware operation.
Availability
CY7C1381D-133AXCT is available at Aetrix Electronics and suitable for high-speed CPU cache buffers, network packet processors, industrial motion controllers, and video frame buffer interfaces requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1381D-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, PSoC, USB, and programmable solutions for embedded systems.
CY7C1381D belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-oriented memory interfacing in microprocessor-based systems where glueless connectivity and deterministic timing are mandatory.
FAQ
What is the required connection for the ZZ pin on CY7C1381D-133AXCT?
The ZZ pin (Pin 64 in TQFP) must be externally connected to ground per documented errata. Although it has an internal pull-down, Cypress specifies mandatory external grounding to ensure reliable entry/exit from sleep mode and prevent undefined current draw during power-up. Leaving it floating or pulling up violates the device's operational specification.
Can CY7C1381D-133AXCT operate with VDDQ = 2.5 V while VDD = 3.3 V?
Yes - the device is explicitly rated for simultaneous 3.3 V core (VDD) and 2.5 V I/O (VDDQ) operation. This dual-supply configuration is validated in the datasheet's DC characteristics table and enables direct interfacing with 2.5 V logic families (e.g., older FPGAs or ASICs) without level-shifting circuitry, preserving signal integrity and reducing BOM count.
Does CY7C1381D-133AXCT support true pipelined reads like ZBT SRAMs?
No - it is a flow-through (not pipelined) SRAM. Read data appears on DQs after a fixed 6.5 ns clock-to-output delay (tCO) with no additional pipeline register stage. Unlike ZBT devices, it does not support concurrent address registration and data output on the same clock edge; each read cycle consumes one full CLK period for address setup and data delivery.
Is JTAG boundary scan functional on CY7C1381D-133AXCT per the datasheet?
JTAG is implemented per IEEE 1149.1 but is not guaranteed for production testing. The datasheet errata explicitly states that JTAG testing must be performed in BYPASS mode only, and functionality is not characterized. For board-level test, rely on functional I/O verification rather than JTAG-based structural test vectors.
CY7C1381D-133AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1381D-133AXCT FAQ
1.How can I place an order for CY7C1381D-133AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1381D-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1381D-133AXCT reliable?
The price and inventory of CY7C1381D-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1381D-133AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1381D-133AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1381D-133AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1381D-133AXCT?
CY7C1381D-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1381D-133AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1381D-133AXCT?
For technical support, including CY7C1381D-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1381D-133AXCT requirements.
6.How does Aetrix verify that CY7C1381D-133AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1381D-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1381D-133AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1381D-133AXCT?
All CY7C1381D-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1381D-133AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1381D-133AXCT part is unused and in its original packaging.
Return procedure for CY7C1381D-133AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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