Infineon Technologies CY7C1381KV33-100AXC

Overview

CY7C1381KV33-100AXC from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with on-chip ECC, configured as 512K × 36, operating at 133 MHz with 6.5 ns clock-to-output delay, 3.3 V core supply (VDD), and 2.5/3.3 V I/O supply (VDDQ), used in high-speed cache and buffer subsystems of network processors and telecom line cards.

For engineers reviewing the CY7C1381KV33-100AXC datasheet, CY7C1381KV33-100AXC pinout, CY7C1381KV33-100AXC application, or CY7C1381KV33-100AXC equivalent, key selection criteria include burst mode support (interleaved/linear), dual-voltage I/O compatibility, JTAG boundary scan capability, and synchronous self-timed write timing.

Technical Context

This SRAM implements a synchronous, clock-driven interface with separate processor (ADSP) and controller (ADSC) address strobes, a 2-bit internal burst counter, and asynchronous OE and ZZ controls. All address, data, and control inputs (except OE, ZZ, MODE) are registered on the rising edge of CLK.

The device supports both interleaved and linear burst sequences via the static MODE pin, enables byte-level writes using four active-low BWx signals qualified by BWE, and integrates ECC encoding/decoding to reduce soft error rate without external logic.

Key Specifications

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with IS61WV102436BLL-10BLI and MT28EW128Axx-100, CY7C1381KV33-100AXC uniquely delivers ECC-protected, 133 MHz flow-through performance with dual-voltage I/O-critical for telecom, radar, and industrial real-time buffers where data integrity and deterministic timing coexist.

Availability

CY7C1381KV33-100AXC is available at Aetrix Electronics and suitable for telecom line card buffering, network processor caching, and radar signal processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1381KV33-100AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets.

CY7C1381KV33 belongs to Cypress's synchronous SRAM product line, engineered specifically for zero-wait-state, ECC-enabled buffering in high-speed digital signal chains where soft errors and timing jitter must be eliminated.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst address sequence: HIGH (or floating, due to internal pull-up) enables interleaved bursts; LOW (tied to GND) enables linear bursts. It is a static strap pin-configuration must be fixed before device operation and cannot change dynamically. Incorrect strapping causes misaligned burst reads/writes and data corruption.

Does CY7C1381KV33-100AXC support 2.5 V-only I/O operation?

Yes-VDDQ may be supplied at 2.5 V while VDD remains at 3.3 V, enabling direct connection to 2.5 V FPGA or ASIC I/O banks. All I/O pins (DQs, DQP, BWx, etc.) are JESD8-5 compliant at 2.5 V, with guaranteed AC/DC specifications including 6.5 ns access time and setup/hold margins preserved.

How does the ZZ sleep mode affect timing and power consumption?

When ZZ is driven HIGH, the device enters a non-time-critical sleep state: core clocks halt, outputs go high-Z, and ICC drops to ≤5 mA (typical). Data retention is guaranteed across full temperature range. Exit time to valid operation is 100 ns after ZZ returns LOW-no reinitialization or resynchronization required.

Can the JTAG interface be used on the 100-pin TQFP package?

No-TDO, TDI, TMS, and TCK pins are not bonded out in the 100-pin TQFP package (CY7C1381KV33-100AXC); they are only available on the 165-ball FBGA variant. Boundary scan testing is therefore unavailable for this specific package, though functional testing via ADSP/ADSC remains fully supported.