Infineon Technologies CY7C1381KV33-133AXC
- Part No.:
- CY7C1381KV33-133AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1381KV33-133AXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,665
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1381KV33-133AXC from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with on-chip ECC, configured as 512K × 36 common I/O, supporting 133 MHz bus operations with 6.5 ns clock-to-output delay. It operates from a 3.3 V core supply (VDD) and 2.5 V/3.3 V I/O supply (VDDQ), and features interleaved/linear burst modes, JTAG boundary scan, and ZZ sleep mode - deployed in high-speed cache and memory subsystems for telecom line cards and network processors.
For engineers reviewing the CY7C1381KV33-133AXC datasheet, CY7C1381KV33-133AXC pinout, CY7C1381KV33-133AXC application, or CY7C1381KV33-133AXC equivalent, key selection criteria include burst address sequencing (MODE pin), synchronous write timing with ADSP/ADSC strobes, ECC-enabled soft error resilience, and compatibility with JEDEC-standard 100-pin TQFP packaging.
Technical Context
This SRAM implements a synchronous, flow-through architecture with dual address strobe inputs (ADSP and ADSC), enabling seamless integration with both processor and cache controller interfaces. All address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK, and internal 2-bit burst counter increments addresses automatically during burst sequences.
Burst order is statically selected via MODE pin (interleaved when HIGH, linear when LOW); byte writes are controlled by four active-low BWx signals qualified by BWE, while global write is enabled by GW. On-chip ECC encoder/decoder reduces soft error rate without external logic overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 configuration) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns cycle time for high-bandwidth burst transfers |
| Access Time (tCO) | 6.5 ns - defines minimum clock-to-output delay for read data valid window |
| VDD Supply | 3.3 V ± 0.3 V - core voltage rail powering memory array and logic |
| VDDQ Supply | 2.5 V or 3.3 V - selectable I/O voltage supporting mixed-voltage system interfacing |
| ECC Support | On-chip single-bit error correction / double-bit error detection - eliminates need for external ECC logic |
| Package | JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) - surface-mount compatible with standard reflow profiles |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, lead-free, with exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:18] | Synchronous Address Inputs | Sampled on CLK rising edge when ADSP/ADSC active; A[1:0] load 2-bit burst counter |
| CLK | System Clock Input | Edge-triggered master timing reference for all synchronous registers and burst counter |
| ADSP / ADSC | Address Strobe Inputs | ADSP prioritized over ADSC; both capture address and initiate burst sequence on rising CLK |
| ADV | Burst Address Advance | Asserted LOW on CLK rising edge to increment internal burst counter for next address |
| BWA–BWD, BWE | Byte Write Controls | Four independent byte masks + enable; support partial-word writes without read-modify-write |
| DQ[0:35], DQP[0:3] | Data & Parity I/O | 36-bit bidirectional data bus with 4-bit parity; direction controlled by OE; tristated automatically during writes |
| OE | Asynchronous Output Enable | Active LOW; overrides synchronous timing to force output driver enable/disable immediately |
| ZZ | Asynchronous Sleep Control | Active HIGH; places device in low-power state with data retention; internal pull-down allows floating for normal operation |
| MODE | Burst Sequence Selector | Static strap pin: HIGH = interleaved burst, LOW = linear burst; internal pull-up ensures default interleaved mode |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous interface | Eliminates pipeline stalls in burst reads/writes - supports 2-1-1-1 access pattern for sustained bandwidth |
| User-selectable burst mode | Interleaved or linear addressing via MODE pin - matches Intel Pentium or Motorola PowerPC cache controller requirements |
| Integrated ECC engine | Single-bit correction/double-bit detection implemented entirely on-die - reduces SER by >90% without external logic or latency penalty |
| Three-chip-enable architecture | CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) - enables flexible depth expansion across multiple SRAMs |
| JTAG boundary scan (IEEE 1149.1) | Full scan chain support on FBGA variant; TQFP excludes TDO/TDI/TMS/TCK pins - simplifies board-level testability |
Applications
| Telecom Line Card Buffering | Network Processor Cache |
|---|---|
Use Scenario: High-throughput packet buffering in 10Gbps+ line cards where deterministic latency and data integrity are critical. IC Role / Device Role / Timing Role: Primary burst-access SRAM buffer between SerDes PHY and packet classifier ASIC, operating at 133 MHz with zero-wait-state reads. Use Value: Flow-through architecture delivers 2-1-1-1 access rate; on-chip ECC prevents silent corruption in neutron-rich environments near RF amplifiers. | Use Scenario: L2 cache for multi-core network processors handling deep packet inspection and QoS scheduling. IC Role / Device Role / Timing Role: Synchronous SRAM serving as low-latency instruction/data cache, interfaced via ADSP-strobed address bus with burst counter auto-increment. Use Value: 6.5 ns tCO and dual ADSP/ADSC strobes allow tight coupling with processor's burst fetch protocol; MODE pin configures interleaved bursts matching cache line layout. |
| Industrial Motion Controller Memory | Radar Signal Processing Buffer |
Use Scenario: Real-time trajectory computation in CNC controllers requiring deterministic memory access under EMI-heavy factory conditions. IC Role / Device Role / Timing Role: Dedicated SRAM for motion profile lookup tables and interpolation buffers, powered by isolated 3.3 V core and 2.5 V I/O rails. Use Value: ZZ sleep mode reduces idle power by >85%; ECC mitigates bit flips induced by motor drive switching noise. | Use Scenario: Intermediate storage for ADC samples in pulsed-Doppler radar front-ends before FFT processing. IC Role / Device Role / Timing Role: High-speed circular buffer capturing 12-bit I/Q data streams at 100+ MSPS using synchronous burst writes triggered by ADSC. Use Value: 512K × 36 organization maps directly to 32K-sample × 36-bit word depth; ADV-controlled burst increment aligns with sample clock domain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102432BLL-133BLI | 1024K × 32 (32 Mbit), no on-chip ECC, 3.3 V only VDDQ, no ZZ sleep | Lacks ECC and low-power sleep - requires external error handling and higher standby current | Select when raw density and cost outweigh reliability and power constraints |
| MT28EW128AABA1HCS-0SIT | 128 Mbit Quad SPI NAND-based pseudo-SRAM, asynchronous interface, built-in ECC | Non-synchronous command-set interface; higher latency; not pin-compatible | Select only for space-constrained designs accepting software-managed burst emulation and longer read cycles |
Compared with IS61WV102432BLL-133BLI and MT28EW128AABA1HCS-0SIT, CY7C1381KV33-133AXC uniquely combines true synchronous flow-through timing, hardware ECC, and dual-voltage I/O in a drop-in 100-pin TQFP package - essential for deterministic real-time systems where latency predictability and radiation tolerance are non-negotiable.
Availability
CY7C1381KV33-133AXC is available at Aetrix Electronics and suitable for telecom infrastructure, network processor design, industrial motion control, and radar signal processing requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1381KV33-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
The CY7C1381K series targets high-speed, ECC-protected memory subsystems in mission-critical networking and industrial equipment - emphasizing deterministic timing, radiation-hardened reliability, and seamless microprocessor coherency.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst address sequence: HIGH (or floating, due to internal pull-up) enables interleaved burst; LOW (tied to GND) enables linear burst. It is a static strap pin - must be fixed before operation and cannot be changed dynamically. Incorrect configuration causes misaligned burst reads/writes and data corruption.
Does CY7C1381KV33-133AXC support both 2.5 V and 3.3 V I/O simultaneously?
No - VDDQ is a single supply pin that must be set to either 2.5 V or 3.3 V, not both. The device supports interface to either voltage domain, but all DQ/DQP pins share the same VDDQ rail. Mixing voltages on VDDQ violates absolute maximum ratings and risks latch-up.
How does the ZZ sleep mode affect timing and data retention?
When ZZ is driven HIGH, the device enters a non-time-critical sleep state with full data retention and reduced ICC. All outputs go high-impedance, clocks are ignored, and internal logic halts - but memory cell contents remain intact. Exit time from ZZ is asynchronous and requires no setup; data is valid within tZZD (max 20 ns) after ZZ returns LOW.
Can ADSP and ADSC be used concurrently, and what happens if both are asserted?
No - ADSP and ADSC are mutually exclusive. When both are asserted LOW, the device recognizes only ADSP and ignores ADSC. This priority ensures deterministic behavior in systems where both processor and controller may attempt address capture; designers must ensure only one strobe is active per cycle to avoid ambiguous address latching.
CY7C1381KV33-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1381KV33-133AXC FAQ
1.How can I place an order for CY7C1381KV33-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1381KV33-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1381KV33-133AXC reliable?
The price and inventory of CY7C1381KV33-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1381KV33-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1381KV33-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1381KV33-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1381KV33-133AXC?
CY7C1381KV33-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1381KV33-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1381KV33-133AXC?
For technical support, including CY7C1381KV33-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1381KV33-133AXC requirements.
6.How does Aetrix verify that CY7C1381KV33-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1381KV33-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1381KV33-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1381KV33-133AXC?
All CY7C1381KV33-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1381KV33-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1381KV33-133AXC part is unused and in its original packaging.
Return procedure for CY7C1381KV33-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1381KV33-133AXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

