Infineon Technologies CY7C1381KV33-133AXI

Overview

CY7C1381KV33-133AXI from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with on-chip ECC, configured as 512K × 36, operating at 133 MHz with 6.5 ns clock-to-output delay, 3.3 V core supply (VDD), and dual-voltage I/O (2.5 V/3.3 V VDDQ), used in high-speed cache and buffer subsystems of network processors and telecom line cards.

For engineers reviewing the CY7C1381KV33-133AXI datasheet, CY7C1381KV33-133AXI pinout, CY7C1381KV33-133AXI application, or CY7C1381KV33-133AXI equivalent, key selection criteria include burst mode control (interleaved/linear via MODE pin), synchronous self-timed write timing, JTAG boundary scan support, and ZZ sleep mode for low-power standby in memory-intensive embedded systems.

Technical Context

This SRAM implements a synchronous, flow-through architecture with a 2-bit internal burst counter that captures A[1:0] on ADSP/ADSC assertion and auto-increments addresses during burst sequences. All address, data, and control inputs (CE1/CE2/CE3, BWx, BWE, GW, ADV) are registered on the rising edge of CLK.

Asynchronous signals OE and ZZ operate independently of CLK: OE enables tristate output control, while ZZ places the device in non-time-critical sleep with data retention. ECC encoding/decoding occurs on-the-fly for all read/write operations to reduce soft error rate (SER).

Key Specifications

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102436BLL-133TQLI and MT48LC32M32B2-75:G, CY7C1381KV33-133AXI uniquely delivers deterministic 2-1-1-1 burst timing, integrated ECC, and dual-strobe (ADSP/ADSC) arbitration-critical for cache-coherent, low-jitter, mission-critical memory subsystems.

Availability

CY7C1381KV33-133AXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and high-speed test equipment requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY7C1381KV33-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure.

This device belongs to Cypress's legacy synchronous SRAM product line, engineered specifically for zero-wait-state, high-bandwidth interfacing with microprocessors, network ASICs, and DSPs in latency-sensitive systems.

FAQ

What is the function of the MODE pin, and how must it be biased?

The MODE pin selects burst sequence type: HIGH (or floating, due to internal pull-up) enables interleaved burst; LOW (tied to GND) enables linear burst. It is a static strap pin-must remain stable during operation and cannot be toggled dynamically. Incorrect biasing causes invalid burst address generation and data corruption.

Does CY7C1381KV33-133AXI support true dual-port operation?

No-it is a single-port synchronous SRAM with common I/O pins. While CE1/CE2/CE3 allow depth expansion across multiple devices, and ADSP/ADSC provide separate address strobe inputs, the device lacks independent read/write ports or simultaneous access capability. True dual-port operation requires discrete dual-port SRAMs like CY7C1356.

Can VDDQ be operated at 2.5 V while VDD remains at 3.3 V?

Yes-VDDQ is independently supplied and rated for 2.5 V ± 0.2 V or 3.3 V ± 0.3 V. This allows direct interfacing with 2.5 V logic (e.g., older FPGAs) while maintaining 3.3 V core performance. VDDQ must be powered before or simultaneously with VDD; sequencing violations may cause initialization failure.

Is JTAG boundary scan functional on the 100-pin TQFP package?

No-TDO, TDI, TMS, and TCK pins are not bonded out in the 100-pin TQFP package (CY7C1381KV33-133AXI). JTAG is only available on the 165-ball FBGA variant (CY7C1381KV33-133BZI). The TQFP version omits these pins entirely; no trace routing or pull-up/down is required.