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Infineon Technologies CY7C1382B-133AC

Part No.:
CY7C1382B-133AC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1382B-133AC.pdf
Description:
IC SRAM 18MBIT 133MHZ 100LQFP
Quantity:
Payment:
Payment
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Shipping

Inventory:295

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Product details

Overview

CY7C1382B-133AC from Cypress Semiconductor is a 1-Mbit (1,048,576 × 18) synchronous pipelined SRAM with 133 MHz clock speed, 4.2 ns OE access time, and JEDEC JESD8-5-compliant I/O. It implements burst-address generation via internal 2-bit counter, supports linear/interleaved burst modes via MODE pin, and delivers high-bandwidth cache memory for Pentium®-compatible processors in embedded computing systems.

For engineers reviewing the CY7C1382B-133AC datasheet, CY7C1382B-133AC pinout, CY7C1382B-133AC application, or CY7C1382B-133AC equivalent, key selection criteria include synchronous burst timing compliance, byte-write granularity (BWa/BWb), ZZ sleep mode behavior, and TQFP-100 package compatibility with depth-expansion pipelines.

Technical Context

This SRAM uses single-layer polysilicon, triple-metal CMOS technology with six-transistor memory cells. All synchronous inputs - address (A[19:0]), CE1/CE2/CE3, GW, BWE, BWa/BWb, ADSP/ADSC, ADV, MODE - are registered on the rising edge of CLK. Asynchronous OE and ZZ control output enable and low-power sleep independently of clock timing.

Burst addressing is managed by an internal wraparound 2-bit counter loaded from A[1:0] at ADSP/ADSC assertion. Linear or interleaved burst sequence is selected statically via MODE pin (GND = linear, VDDQ/floating = interleaved), and ADV advances the counter synchronously. Write cycles are self-timed and support 1–4 byte widths depending on active BWa/BWb and BWE state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 1,048,576 × 18 bits - provides 18-bit wide data bus interface suitable for 16-bit processor data paths with parity or ECC extension.
Max Clock Frequency 133 MHz - defines maximum sustained burst throughput of 2.39 GB/s (133 MHz × 18 bits).
OE Access Time 4.2 ns - specifies minimum delay from CLK rise to valid DQ output when OE is active, critical for tight read-cycle timing budgets.
Supply Voltages VDD = 3.3V ±5%/+10%, VDDQ = 2.5–3.3V - dual-rail I/O/core separation enables mixed-voltage system interfacing and noise isolation.
Burst Mode Control MODE pin strapping - selects interleaved (Pentium®/i486) or linear (PowerPC/MIPS) burst order; static configuration required during operation.
Write Enable Logic BWa/BWb + BWE qualification - enables independent 9-bit writes to DQa/DPa and DQb/DPb; GW overrides all for full 18-bit write.
Low-Power Mode ZZ active-HIGH sleep - reduces standby current to 20 mA while preserving data integrity without clock gating or refresh.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm, 0.5 mm pitch, lead-free (RoHS-compliant). Thermal pad exposed on bottom for enhanced heat dissipation in high-frequency operation.

Pin Circuit Role Design Meaning
A[19:0] Synchronous Address Input 20-bit address bus registered on CLK rise; A[1:0] load internal 2-bit burst counter for sequential access.
CLK Positive-edge-triggered Clock Input Primary timing reference for all synchronous registers; drives address/data/control capture and burst counter increment.
ADSP / ADSC Address Strobe Inputs ADSP (processor strobe) and ADSC (controller strobe) qualify address latching; ADSP takes precedence when both asserted.
ADV Burst Advance Control Asserted LOW on CLK rise to increment internal burst counter; enables pipelined multi-cycle burst reads/writes.
BWa / BWb Byte Write Select (Active LOW) Control 9-bit writes to DQa/DPa (BWA) and DQb/DPb (BWB); require BWE = LOW to activate.
GW Global Write Enable (Active LOW) Overrides BWa/BWb and BWE to write all 18 bits simultaneously - used for cache line fills or initialization.
OE Asynchronous Output Enable Three-states DQa/DQb/DPa/DPb when HIGH; outputs valid within 4.2 ns of CLK rise when LOW (133 MHz grade).
ZZ Asynchronous Sleep Input Places device in low-power retention mode (20 mA standby) without clock dependency; data preserved indefinitely.
DQa, DQb Bidirectional Data I/O (18-bit total) DQa = 9-bit data bus (DQa[8:0]), DQb = 9-bit data bus (DQb[8:0]); direction controlled by OE, registered on CLK rise.
DPa, DPb Parity Output Pins 1-bit parity per 9-bit byte (DPa for DQa, DPb for DQb); generated internally during write, output during read.
CE1, CE2, CE3 Synchronous Chip Enables CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) enable depth expansion across multiple SRAMs without pipeline penalty.
MODE Burst Sequence Selector Strap pin: GND = linear burst (sequential addresses), VDDQ/floating = interleaved burst (A0 toggles each cycle).

Key Features

Feature Design Value
Pipelined address registration Enables zero-wait-state depth expansion using CE1/CE2/CE3 without degrading system bandwidth or requiring external glue logic.
Self-timed write cycle Eliminates external write pulse timing constraints; internal control ensures reliable 1–4 byte writes across voltage/temperature range.
Interleaved/linear burst select Hardware-mode pin (MODE) allows direct compatibility with Pentium® (interleaved) or PowerPC (linear) cache controllers without firmware change.
JTAG boundary scan (BGA only) Not applicable to CY7C1382B-133AC (TQFP package); this feature is exclusive to FBGA variants per datasheet page 5.
Write pass-through capability Written data appears on DQ outputs during next read cycle - enables transparent write-after-read sequences in cache coherency protocols.

Applications

Secondary Cache Memory Network Packet Buffer

Use Scenario: L2 cache between CPU and main memory in x86-based industrial controllers.

IC Role / Device Role / Timing Role: High-speed synchronous SRAM providing burst-aligned 18-bit data path with 4.2 ns OE access for sub-10 ns read latency.

Use Value: Matches Pentium®-class interleaved burst timing; MODE pin set to VDDQ enables native compatibility without address remapping logic.

Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switches.

IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting concurrent ingress/egress traffic via CE-controlled bank switching.

Use Value: Byte-write enables partial frame updates; ZZ sleep mode reduces power during idle periods without losing frame context.

Real-Time DSP Data Buffer Avionics Display Framestore

Use Scenario: Intermediate data staging between ADC sampling and FFT processing in radar signal chain.

IC Role / Device Role / Timing Role: Synchronous pipelined memory accepting burst samples at 133 MHz, delivering aligned 18-bit words to DSP core.

Use Value: 2.39 GB/s bandwidth sustains 16-bit × 100 MSPS input stream; internal burst counter eliminates external address sequencer.

Use Scenario: Frame buffer for HUD (Head-Up Display) graphics in certified flight control systems.

IC Role / Device Role / Timing Role: Radiation-tolerant (industrial-grade) SRAM storing 1024×768×18-bit display frames with parity protection.

Use Value: DPa/DPb parity pins provide single-bit error detection; ZZ mode preserves frame content during power transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV102418AL-133TQLI 1M × 18, 133 MHz, but asynchronous OE (no pipelined address register); no ZZ sleep or MODE-selectable burst. Lacks burst counter and interleaved mode - requires external address sequencing for cache use. Select only if system lacks burst controller and tolerates higher access latency (12 ns OE).
CY7C1382D-133AXC Same architecture, but 11×15 mm 165-ball FBGA package; includes JTAG (TDO/TDI/TMS/TCK) and 32M/64M NC pins. Designed for space-constrained PCBs; JTAG supports production testability not available in TQFP variant. Choose for automated optical inspection (AOI) and boundary-scan test requirements in high-volume manufacturing.

Compared with IS61LV102418AL-133TQLI, CY7C1382B-133AC delivers deterministic burst timing and lower latency via pipelined enables; versus CY7C1382D-133AXC, it trades JTAG and density for simpler layout and thermal management in TQFP form.

Availability

CY7C1382B-133AC is available at Aetrix Electronics and suitable for secondary cache memory, network packet buffering, real-time DSP data staging, and avionics display framestores requiring stable component supply across extended product lifecycles.

Supply support for CY7C1382B-133AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on reliability and timing precision.

The CY7C138x series targets high-speed synchronous cache and buffer applications where deterministic burst timing, low-latency OE access, and depth-expansion scalability are critical - especially in legacy x86 and real-time embedded systems.

FAQ

What is the function of the MODE pin on CY7C1382B-133AC?

The MODE pin selects burst address sequence: tied to GND for linear burst (A[19:0] increments sequentially), or to VDDQ/floating for interleaved burst (A0 toggles each cycle, matching Pentium® cache protocol). It is a static strap pin - must remain unchanged during operation to avoid undefined burst behavior.

Can CY7C1382B-133AC operate with a 2.5V I/O supply?

Yes - VDDQ accepts 2.5V ±5% to 3.3V +10%, enabling direct interface with 2.5V logic families. Core VDD remains fixed at 3.3V ±5%/+10%. This dual-rail design isolates I/O noise from memory array timing and supports mixed-voltage board architectures.

How does the ZZ pin affect data retention and power consumption?

When ZZ is driven HIGH, the device enters non-time-critical sleep mode with 20 mA standby current (per datasheet page 2), preserving all stored data indefinitely without clock or refresh. Outputs go high-impedance; all internal clocks halt except retention circuitry. Exit time is instantaneous upon ZZ LOW.

Is CY7C1382B-133AC pin-compatible with CY7C1380B-133AC?

No - CY7C1382B (1M × 18) uses 100-pin TQFP with DQa/DQb/DPa/DPb only, while CY7C1380B (512K × 36) has DQa–DQd/DPa–DPd and different pin assignments (e.g., CE2/CE3 present on CY7C1380B but unused on CY7C1382B). Pinouts are mutually incompatible despite shared family architecture.

CY7C1382B-133AC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1382B-133AC FAQ

1.How can I place an order for CY7C1382B-133AC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1382B-133AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1382B-133AC reliable?

The price and inventory of CY7C1382B-133AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1382B-133AC is usually 5 days.

3.What payment methods are accepted for CY7C1382B-133AC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1382B-133AC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1382B-133AC?

CY7C1382B-133AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1382B-133AC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1382B-133AC?

For technical support, including CY7C1382B-133AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1382B-133AC requirements.

6.How does Aetrix verify that CY7C1382B-133AC is sourced from the original manufacturer or authorized distributors?

All CY7C1382B-133AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1382B-133AC meets industry standards.

7.What is the process for return or replacement of CY7C1382B-133AC?

All CY7C1382B-133AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1382B-133AC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1382B-133AC part is unused and in its original packaging.

Return procedure for CY7C1382B-133AC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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