Infineon Technologies CY7C1382C-167AC

Overview

CY7C1382C-167AC from Cypress Semiconductor is a 18-Mb (1M × 18) pipelined synchronous SRAM with registered inputs/outputs, 3.3V core supply, 2.5V/3.3V I/O compatibility, and 167 MHz operation (3.4 ns clock-to-output). It supports Intel Pentium–compatible burst sequences and is used in high-speed cache and buffer applications within network processors and DSP subsystems.

For engineers reviewing the CY7C1382C-167AC datasheet, CY7C1382C-167AC pinout, CY7C1382C-167AC application, or CY7C1382C-167AC equivalent, key selection criteria include burst timing compliance, byte-write control granularity, JEDEC-standard TQFP package fit, and synchronous self-timed write cycle behavior under pipelined bus protocols.

Technical Context

The CY7C1382C implements a two-bit internal burst counter synchronized to CLK's rising edge, supporting both interleaved and linear burst modes via the MODE pin. Address strobes ADSP and ADSC register A[1:0] and full address bus on the same clock edge, enabling deterministic pipeline depth.

All write controls-BWE, BWx, and GW-are sampled synchronously on CLK, initiating self-timed writes with guaranteed setup/hold relative to clock. Asynchronous OE and ZZ enable fast output disable and low-power sleep without clock dependency, preserving data integrity during idle periods.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC standard, 0.5 mm pitch, body size 14 × 14 mm. Thermal pad not present; standard PCB land pattern per IPC-7351B.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.

Compared with IDT 72V255L15PF and Renesas R1EX24012AS0C, the CY7C1382C-167AC uniquely combines Intel-compatible burst sequencing, asynchronous OE/ZZ control, and JEDEC TQFP packaging-enabling drop-in replacement in legacy high-speed bus systems without clock domain changes or layout rework.

Availability

CY7C1382C-167AC is available at Aetrix Electronics and suitable for network packet buffering, DSP instruction caching, PCI Express endpoint bridging, and industrial motion controller FIFO applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1382C-167AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications systems, with emphasis on signal integrity and timing reliability.

The CY7C1382C belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for pipelined bus architectures in networking, telecom, and real-time control where deterministic latency and burst efficiency are mandatory.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst sequence type: tied to GND for linear burst, or to VDD/floating for Intel Pentium–style interleaved burst. It is a static strap pin-must be fixed at power-up and remain unchanged during operation. Internal pull-up ensures safe default (interleaved) if left floating; no external driver required.

Can CY7C1382C-167AC operate with 2.5V I/O while using 3.3V core supply?

Yes. The device supports independent 3.3V core (VDD) and 2.5V or 3.3V I/O (VDDQ) supplies. VDDQ pins must be biased at the target I/O voltage; all DQ, BWx, OE, and ZZ pins comply with JESD8-5 levels at either voltage. No level shifters needed when interfacing with 2.5V logic.

How does the ZZ "sleep" mode affect data retention and wake-up timing?

When ZZ is driven HIGH, the device enters low-power sleep with full data retention; standby current drops to ≤70 mA. Wake-up is asynchronous-data becomes valid within one CLK cycle after ZZ returns LOW, with no additional stabilization delay required.

Is JTAG boundary scan supported in the 100-pin TQFP package?

No. JTAG signals (TDO, TDI, TMS, TCK) are not routed to pins in the TQFP package variant. They are available only in the 119-ball BGA and 165-ball fBGA packages. For TQFP-based designs, boundary scan testing must rely on external probing or functional test vectors.