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Infineon Technologies CY7C1382KV33-167AXC

Part No.:
CY7C1382KV33-167AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1382KV33-167AXC.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,348

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Product details

Overview

CY7C1382KV33-167AXC from Cypress Semiconductor is a 18-Mbit synchronous pipelined SRAM organized as 1M × 18, operating at 167 MHz with 3.3 V core and 2.5/3.3 V I/O supplies. It features registered inputs/outputs, synchronous self-timed write, asynchronous output enable, and ZZ sleep mode. Used in high-speed secondary cache subsystems for RISC processors requiring burst-mode memory access.

For engineers reviewing the CY7C1382KV33-167AXC datasheet, CY7C1382KV33-167AXC pinout, CY7C1382KV33-167AXC application, or CY7C1382KV33-167AXC equivalent, key selection criteria include burst address sequencing (linear/interleaved), byte-write control granularity (BWA–BWD + BWE), three-chip-enable depth expansion, and TQFP-100 package compatibility with JEDEC-standard I/O voltage flexibility.

Technical Context

This SRAM implements a two-bit synchronous wraparound burst counter controlled by ADV, ADSP, and ADSC inputs to generate sequential addresses during burst reads/writes. All synchronous signals-including A[1:0], CE1/CE2/CE3, BWX, BWE, GW, and CLK-are registered on the rising edge of CLK.

It supports dual-burst initiation modes: processor-initiated (ADSP) and controller-initiated (ADSC), with priority given to ADSP when both are active. Output data is registered and clocked out with tCO = 3.4 ns (max), enabling deterministic timing in synchronous bus architectures.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18 Mbit (1,048,576 × 18 organization)
Max Clock Frequency167 MHz - defines maximum sustained burst throughput and interface timing margin
Access Time (tCO)3.4 ns - maximum clock-to-output delay for synchronous read data valid timing
Core Supply Voltage3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation
I/O Supply Voltage2.5 V or 3.3 V - selectable for interfacing with mixed-voltage SoCs or FPGAs
Burst Mode ControlMODE pin strapping - selects linear vs. interleaved burst addressing for processor/cache alignment
Write GranularityByte-selectable via BWA–BWD + BWE - enables 1–4 byte writes without masking logic

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-compliant, with exposed thermal pad (not electrically connected).

Pin/TerminalCircuit RoleDesign Meaning
CLKSynchronous clock inputRising-edge-triggered master timing reference for all registered inputs/outputs and burst counter
ADSP / ADSCAddress strobe inputsInitiate burst sequence; ADSP has priority over ADSC for address capture and counter load
ADVAddress advance controlActive-low signal that increments internal two-bit burst counter on next CLK rise
CE1, CE2, CE3Chip enable inputsThree-level synchronous enable hierarchy for depth expansion across multiple SRAM banks
BWA–BWD, BWEByte write controlsFour independent byte masks qualified by BWE; enable partial-word writes without external gating
GWGlobal write enableOverrides all byte write selects to force full 18-bit write on rising CLK edge
OEAsynchronous output enableTri-states DQ/DQP pins immediately when HIGH; masked only during first read cycle after deselect
ZZAsynchronous sleep controlActive-HIGH entry into low-power retention mode; internal pull-down allows floating for normal operation
MODEBurst order configurationStatic strap pin: GND = linear burst, VDD/floating = interleaved burst; must remain stable during operation

Key Features

FeatureDesign Value
Pipelined synchronous interfaceRegistered address/data/control paths eliminate setup/hold violations on high-speed buses up to 167 MHz
Configurable burst addressingMODE pin selects linear or interleaved sequences to match CPU cache line fetch patterns
Flexible I/O voltage supportSeparate VDDQ rail (2.5 V or 3.3 V) enables direct connection to FPGA I/O banks or ASIC cores
Depth-expansion chip enablesCE1 (active-L), CE2 (active-H), CE3 (active-L) allow stacking multiple devices without external decode logic
JTAG boundary scanIEEE 1149.1-compliant test access port (TAP) for board-level interconnect verification (FBGA only)

Applications

Processor Cache InterfaceNetwork Packet Buffer

Use Scenario: High-performance RISC microprocessor (e.g., PowerPC or ARM Cortex-A series) requiring low-latency L2 cache with burst-line fill capability.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM acting as secondary cache memory with deterministic 3.4 ns tCO and 167 MHz burst bandwidth.

Use Value: Enables full-cache-line burst reads matching CPU prefetch width, reducing average memory latency by eliminating per-word address overhead.

Use Scenario: Gigabit Ethernet switch ASIC buffering incoming/outgoing packet headers and metadata in real time.

IC Role / Device Role / Timing Role: Burst-accessible buffer memory supporting parallel header parsing and forwarding decision pipelines.

Use Value: Synchronous self-timed write and registered outputs ensure reliable data capture at line rate without external timing glue logic.

Industrial Motion ControllerTest Equipment Pattern Memory

Use Scenario: Real-time servo drive controller executing multi-axis trajectory interpolation with tight jitter constraints.

IC Role / Device Role / Timing Role: Deterministic-access memory storing motion profile segments and interpolated position tables.

Use Value: ZZ sleep mode reduces idle power while preserving data integrity between motion cycles, extending thermal headroom.

Use Scenario: Automated test equipment (ATE) generating high-speed digital stimulus patterns synchronized to system clock.

IC Role / Device Role / Timing Role: Programmable pattern store delivering deterministic 18-bit parallel vectors at 167 MHz with zero-cycle deselection.

Use Value: Single-cycle chip deselect and asynchronous OE allow rapid pattern switching between test phases without bus contention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102418BLL-167BLI18-Mbit (1M × 18), 167 MHz, 3.3 V core/I/O, no ZZ sleep or JTAG, different pinoutLacks sleep mode and burst-mode flexibility; simpler interface but less power-awarePreferred where lowest cost and minimal feature set suffice; requires redesign for CE/ADV/BW pin mapping
MT55LCS018A-167B118-Mbit (1M × 18), 167 MHz, 3.3 V core/I/O, supports linear burst only, no MODE pinNo interleaved burst option; lacks ADSC/ADSP dual-strobe architectureAppropriate for fixed-architecture systems using linear burst only; not suitable for mixed-processor environments

Compared with IS61WV102418BLL-167BLI and MT55LCS018A-167B1, CY7C1382KV33-167AXC provides unique configurability in burst ordering, dual-address-strobe initiation, and low-power ZZ mode-critical for adaptive cache and real-time control designs.

Availability

CY7C1382KV33-167AXC is available at Aetrix Electronics and suitable for processor cache interfaces, network packet buffers, industrial motion controllers, and ATE pattern memory applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1382KV33-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

The CY7C138xKV33 product line was designed specifically for high-bandwidth, low-latency synchronous cache and buffer applications in networking, computing, and industrial control systems requiring deterministic burst access and flexible voltage operation.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst address sequence: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin-must remain stable during operation and cannot be toggled dynamically. Internal pull-up ensures safe default behavior if left unconnected.

Does CY7C1382KV33-167AXC support both 2.5 V and 3.3 V I/O simultaneously?

No. VDDQ must be set to either 2.5 V or 3.3 V-not both-and must match the voltage level of the connected controller or FPGA I/O bank. The device does not support mixed-voltage I/O on a single interface; VDDQ is a single-supply rail for all DQ/DQP pins.

How does the ZZ sleep mode affect data retention and wake-up timing?

In ZZ mode (pin HIGH), the device enters a non-time-critical sleep state with full data retention and reduced current draw (~20 µA typical). Wake-up occurs synchronously on the next rising CLK edge after ZZ returns LOW; no additional stabilization delay is required before issuing commands.

Can ADSP and ADSC be used concurrently, and what happens if both are asserted?

ADSP and ADSC are mutually exclusive: when both are asserted LOW, only ADSP is recognized and processed. ADSC is ignored in that condition. This prioritization ensures deterministic address capture in systems where both processor and controller may attempt burst initiation.

CY7C1382KV33-167AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1382KV33-167AXC FAQ

1.How can I place an order for CY7C1382KV33-167AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1382KV33-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1382KV33-167AXC reliable?

The price and inventory of CY7C1382KV33-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1382KV33-167AXC is usually 5 days.

3.What payment methods are accepted for CY7C1382KV33-167AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1382KV33-167AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1382KV33-167AXC?

CY7C1382KV33-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1382KV33-167AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1382KV33-167AXC?

For technical support, including CY7C1382KV33-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1382KV33-167AXC requirements.

6.How does Aetrix verify that CY7C1382KV33-167AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1382KV33-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1382KV33-167AXC meets industry standards.

7.What is the process for return or replacement of CY7C1382KV33-167AXC?

All CY7C1382KV33-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1382KV33-167AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1382KV33-167AXC part is unused and in its original packaging.

Return procedure for CY7C1382KV33-167AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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