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Infineon Technologies CY7C1382KV33-200AXC
- Part No.:
- CY7C1382KV33-200AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1382KV33-200AXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,992
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Product details
Overview
CY7C1382KV33-200AXC from Cypress Semiconductor is a 18-Mbit synchronous pipelined SRAM organized as 1M × 18, operating at 200 MHz with 3.3 V core and 2.5/3.3 V I/O supply, supporting 3-1-1-1 burst access for high-speed cache in RISC processors and network packet buffers.
For engineers reviewing the CY7C1382KV33-200AXC datasheet, CY7C1382KV33-200AXC pinout, CY7C1382KV33-200AXC application, or CY7C1382KV33-200AXC equivalent, key selection criteria include clock-to-output time (3.0 ns), synchronous self-timed write, dual address strobe support (ADSP/ADSC), and JEDEC-compliant 100-pin TQFP packaging.
Technical Context
This SRAM implements a two-bit synchronous wraparound burst counter controlled by ADV, with address latching triggered on CLK's rising edge when ADSP or ADSC is active. All inputs except OE and ZZ are registered, enabling precise timing control in high-frequency bus systems.
It supports both linear and interleaved burst sequences selected via the static MODE pin, and provides byte-write capability using BWA–BWD and BWE, plus global write via GW. Output enable (OE) operates asynchronously to allow fast output tri-state control independent of clock phase.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1,048,576 × 18 organization) |
| Max Clock Frequency | 200 MHz - enables 5 ns clock period timing closure in high-speed bus interfaces |
| Access Time (tCO) | 3.0 ns - defines minimum clock-to-output delay for read data valid window |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation |
| I/O Supply Voltage | 2.5 V or 3.3 V - selectable interface voltage matching host processor I/O domain |
| Burst Access Rate | 3-1-1-1 - delivers first word in 3 clocks, subsequent words every 1 clock for sustained bandwidth |
| Write Control | Synchronous self-timed write - eliminates external write pulse timing constraints |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-standard footprint compatible with automated SMT assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Input clock | Rising-edge-triggered master timing reference for all synchronous registers and burst counter |
| ADSP / ADSC | Address strobe inputs | Asynchronous-selectable address capture triggers: ADSP for processor-initiated accesses, ADSC for controller-initiated accesses |
| ADV | Advance control | Drives internal burst counter increment; enables automatic address progression during burst reads/writes |
| CE1, CE2, CE3 | Chip enable inputs | Three-level synchronous chip select hierarchy for multi-bank memory mapping and bank isolation |
| OE | Output enable | Asynchronous control of I/O direction: LOW enables output drivers, HIGH places DQ/DQP in high-impedance state |
| ZZ | Sleep mode input | Asynchronous HIGH entry into low-power sleep mode with data retention; internal pull-down ensures safe default LOW state |
| MODE | Burst sequence selector | Static strap pin determining burst order: GND = linear, VDD/floating = interleaved; must remain stable during operation |
| DQx / DQPx | Data I/O lines | 18-bit bidirectional data bus with parity (DQP) - registered on CLK rise for synchronous I/O timing |
Key Features
| Feature | Design Value |
|---|---|
| Registered I/O architecture | Eliminates setup/hold timing violations on high-speed buses by synchronizing all data/address/control signals to CLK |
| 3-1-1-1 burst access | Delivers sustained 200 MHz throughput with minimal latency overhead-critical for L2 cache line fills |
| Byte-selectable write (BWA–BWD + BWE) | Enables partial-word writes without read-modify-write cycles, reducing bus traffic and power in embedded control applications |
| IEEE 1149.1 JTAG boundary scan | Supports in-circuit test and debug of PCB interconnects; available only on FBGA package variants |
| Synchronous self-timed write | Removes need for external write pulse generation-simplifies timing design and improves reliability across voltage/temperature corners |
Applications
| Network Packet Buffering | High-Performance CPU Cache |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches and routers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly to packet processing ASICs via synchronous parallel bus. Use Value: 3-1-1-1 burst mode enables full 18-bit word transfer per clock cycle after initial latency, maximizing packet throughput at 200 MHz. | Use Scenario: Serving as secondary (L2) cache for MIPS or ARM-based microprocessors in telecom baseband units. IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic access timing synchronized to CPU clock domain via ADSP/ADSC handshake. Use Value: Registered inputs and outputs eliminate timing skew across wide data buses, ensuring reliable operation at 200 MHz with 3.0 ns tCO. |
| Industrial Motion Controller Memory | Test Equipment Pattern Memory |
Use Scenario: Holding real-time trajectory tables and servo loop coefficients in CNC controllers requiring deterministic memory access. IC Role / Device Role / Timing Role: Deterministic-latency SRAM interfaced to FPGA-based motion sequencers using synchronous burst reads. Use Value: Synchronous self-timed write and byte-select capability allow atomic updates of motion parameters without bus contention or lock cycles. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-reliability, high-speed memory storing multi-cycle test patterns synchronized to system clock and ADV-controlled burst sequencing. Use Value: Interleaved or linear burst modes (via MODE pin) match ATE vector memory addressing schemes, reducing pattern load time by >40% vs. random access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-20JC | 512K × 32 organization, 20 ns async access, no pipelining or burst counter | Lacks ADSP/ADSC/ADV interface; suited for simpler glue logic or legacy bus designs | Select when synchronous burst timing is unnecessary and cost-sensitive non-pipelined SRAM suffices |
| IS61WV102418BLL-200BLI | 1M × 18, 200 MHz, but uses single CE and lacks ADSP/ADSC dual-strobe architecture | No processor/controller address strobe separation; less flexible in heterogeneous bus environments | Prefer when board space favors 165-ball FBGA and system uses unified address strobe logic |
Compared with AS7C3256A-20JC and IS61WV102418BLL-200BLI, CY7C1382KV33-200AXC uniquely supports dual-address-strobe arbitration and programmable burst sequencing-enabling tighter integration with RISC CPUs and network processors requiring deterministic pipeline alignment.
Availability
CY7C1382KV33-200AXC is available at Aetrix Electronics and suitable for network packet buffering, high-performance CPU cache, and industrial motion controller memory requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1382KV33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.
The CY7C138xKV33 product line was designed specifically for synchronous burst-cache applications in high-end networking and embedded computing systems requiring deterministic timing, low-latency pipelining, and JEDEC-compliant parallel interfaces.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst sequence order: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin-must be set before device operation and held stable during use. Internal pull-up ensures safe default interleaved behavior if left unconnected. Incorrect configuration causes misaligned burst addresses and data corruption.
Can CY7C1382KV33-200AXC operate with only 2.5 V I/O supply while maintaining 3.3 V core?
Yes-the device supports independent 3.3 V core (VDD) and 2.5 V I/O (VDDQ) supplies simultaneously. This allows direct interfacing with 2.5 V logic families while preserving internal SRAM cell stability. VSSQ must be connected to the same ground as VSS, and decoupling capacitors must be placed per JEDEC layout guidelines for each supply domain.
How does the ZZ sleep mode affect power consumption and data retention?
When ZZ is driven HIGH, the device enters a non-time-critical sleep mode with typical standby current reduced to <50 µA while retaining all stored data. The internal pull-down ensures safe default operation when ZZ is unconnected. Exit from sleep requires ZZ return to LOW followed by one valid CLK cycle before normal operation resumes.
Is JTAG boundary scan supported on the 100-pin TQFP package of CY7C1382KV33-200AXC?
No-JTAG pins (TCK, TMS, TDI, TDO) are not bonded out on the 100-pin TQFP package. Boundary scan functionality is available only on the 165-ball FBGA variant. For TQFP users, functional testing must rely on standard I/O access and external test fixtures rather than IEEE 1149.1 scan chains.
CY7C1382KV33-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1382KV33-200AXC FAQ
1.How can I place an order for CY7C1382KV33-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1382KV33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1382KV33-200AXC reliable?
The price and inventory of CY7C1382KV33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1382KV33-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1382KV33-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1382KV33-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1382KV33-200AXC?
CY7C1382KV33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1382KV33-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1382KV33-200AXC?
For technical support, including CY7C1382KV33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1382KV33-200AXC requirements.
6.How does Aetrix verify that CY7C1382KV33-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1382KV33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1382KV33-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1382KV33-200AXC?
All CY7C1382KV33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1382KV33-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1382KV33-200AXC part is unused and in its original packaging.
Return procedure for CY7C1382KV33-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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