Infineon Technologies CY7C1383C-100AC
- Part No.:
- CY7C1383C-100AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1383C-100AC.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,158
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Product details
Overview
CY7C1383C-100AC from Cypress Semiconductor is a 3.3V, 1-Mbit × 18-bit synchronous flow-through SRAM optimized for high-speed cache and buffer applications in Pentium-class microprocessor systems. It delivers 8.5 ns clock-to-output access time at 100 MHz, supports dual-burst modes (interleaved/linear), and operates with 2.5V or 3.3V I/O supply (VDDQ) while maintaining 3.3V ±5%/+10% core power (VDD). Its JEDEC-standard 100-pin TQFP package integrates separate ADSP/ADSC strobes, synchronous burst counter, and asynchronous ZZ sleep mode.
For engineers reviewing the CY7C1383C-100AC datasheet, CY7C1383C-100AC pinout, CY7C1383C-100AC application, or CY7C1383C-100AC equivalent, key selection criteria include burst sequence control via MODE pin, 2.5V/3.3V I/O flexibility, 100-MHz timing compliance, and compatibility with Intel Pentium-style address pipelining and depth-expansion chip enables (CE1–CE3).
Technical Context
The CY7C1383C-100AC implements a synchronous flow-through architecture where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. A 2-bit internal burst counter captures A[1:0] at the first clock and auto-increments addresses during burst cycles controlled by ADV, supporting both interleaved (MODE = HIGH) and linear (MODE = LOW) sequences.
It features dual asynchronous controls: OE enables tri-state output control independent of clock, and ZZ places the device in low-power sleep mode while preserving data integrity. The memory array uses synchronous self-timed write with byte-write enable (BWE) and four independent byte-write selects (BWA–BWD), allowing granular 18-bit data updates without full-word overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1 M × 18-bit (18-Mb total), enabling single-word access to 18-bit data paths in cache controllers. |
| Access Time (tCO) | 8.5 ns at 100 MHz - defines maximum clock-to-output delay for timing-critical read cycles. |
| VDD Supply Range | 3.3 V ±5% / +10% - ensures stable core operation across industrial voltage tolerances. |
| VDDQ Supply Options | 2.5 V or 3.3 V - allows direct interfacing with mixed-voltage SoCs or FPGAs without level shifters. |
| Burst Mode Control | MODE pin selects Intel Pentium interleaved (HIGH) or linear (LOW) addressing - critical for cache line alignment. |
| Chip Enable Architecture | Three independent enables (CE1 active LOW, CE2 active HIGH, CE3 active LOW) - supports depth expansion in multi-SRAM systems. |
| Power Management | ZZ pin enables non-time-critical sleep mode with data retention - reduces standby current to 70 mA. |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-compliant, 0.5 mm pitch, RoHS-compliant.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A[17:0] | Synchronous Address Input | 18-bit address bus sampled on CLK rise when ADSP or ADSC is active; A[1:0] load burst counter. |
| DQ[17:0] | Bidirectional Data I/O | 18-bit main data path; direction controlled by OE; automatically tri-stated during writes and deselection. |
| BWA–BWD | Byte Write Select | Four active-LOW signals enabling selective 4.5-bit byte writes within 18-bit word - matches Pentium byte lanes. |
| CE1, CE2, CE3 | Depth-Expansion Chip Enables | Three enables allow stacking multiple CY7C1383C devices for wider memory maps; CE2 is active HIGH, others active LOW. |
| ADSP / ADSC | Address Strobe Inputs | Separate processor (ADSP) and controller (ADSC) strobes enable glueless integration with dual-bus architectures. |
| ADV | Address Advance | Asserted LOW on CLK rise to increment burst address - eliminates external counter logic in burst transfers. |
| MODE | Burst Sequence Selector | Static strap pin (internal pull-up); determines cache-line addressing pattern required by host CPU. |
| ZZ | Asynchronous Sleep Control | Active-HIGH signal placing SRAM in low-power state with zero clock dependency - simplifies power sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous interface | Eliminates pipeline stalls by aligning read data output with clock edge - enables 2-1-1-1 access rate for sustained bandwidth. |
| User-selectable burst order | Hardware-mode pin (MODE) directly configures Intel Pentium interleaved or linear burst - no firmware overhead or register writes. |
| Flexible I/O voltage support | VDDQ selectable between 2.5 V and 3.3 V - permits seamless integration with legacy 2.5V ASICs or modern 3.3V FPGAs. |
| JEDEC-standard JTAG boundary scan | Available on BGA/fBGA variants (TDO/TDI/TMS/TCK) - enables production testability without custom probe fixtures. |
| Asynchronous output enable & sleep | OE and ZZ operate independently of CLK - supports dynamic power gating and partial system suspend without clock coordination. |
Applications
| Level-1 Cache Buffer | Pentium-Class CPU Interface |
|---|---|
|
Use Scenario: High-speed L1 cache tag/data storage in embedded x86-compatible processors requiring sub-10 ns access. IC Role / Device Role / Timing Role: Primary synchronous SRAM buffer delivering 18-bit aligned data on every clock cycle with deterministic 8.5 ns tCO. Use Value: Eliminates wait states in CPU fetch pipelines by matching Pentium burst protocols and supporting 2-1-1-1 access rate. |
Use Scenario: Glueless interface between Intel Pentium-compatible controllers and external SRAM-based instruction buffers. IC Role / Device Role / Timing Role: Flow-through SRAM with ADSP/ADSC dual strobes and MODE-configurable burst order - mirrors Pentium bus protocol. Use Value: Reduces PCB layer count and logic gate count by removing address latches, burst counters, and level shifters. |
| Network Packet Buffer | Industrial Motion Controller Memory |
|
Use Scenario: Temporary packet storage in Gigabit Ethernet switch fabric ASICs handling variable-length frames. IC Role / Device Role / Timing Role: Burst-capable 18-bit SRAM with byte-write granularity (BWA–BWD + BWE) for partial frame updates. Use Value: Enables in-place modification of packet headers without full-word read-modify-write cycles - cuts latency by >40%. |
Use Scenario: Real-time position lookup table storage in servo drive controllers requiring deterministic 100-MHz read access. IC Role / Device Role / Timing Role: Synchronous SRAM with ZZ sleep mode and 70 mA standby current - sustains data integrity during motor idle phases. Use Value: Maintains encoder calibration tables during low-power states without battery backup or external refresh circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV102418-100TQLI | 1-M × 18-bit, 3.3V, 100 MHz, but lacks ADSP/ADSC dual strobes and MODE-selectable burst order. | Requires external logic for Pentium burst emulation; limited to linear-only bursts. | Choose when cost sensitivity outweighs protocol fidelity and burst flexibility. |
| MT55LCS12818A-100:G | 1-M × 18-bit, 3.3V, 100 MHz, includes JTAG but no ZZ sleep pin or separate CE2/CE3 depth-enable architecture. | Supports boundary scan but cannot replicate CY7C1383C's three-level chip select hierarchy for stacked memory banks. | Prefer when test coverage is prioritized over power-gating capability and multi-device expansion. |
Compared with IS61LV102418-100TQLI and MT55LCS12818A-100:G, the CY7C1383C-100AC uniquely combines Intel-compatible burst sequencing, triple chip enable for depth expansion, and asynchronous ZZ sleep - making it irreplaceable in legacy Pentium-based designs requiring glueless integration and deterministic low-power behavior.
Availability
CY7C1383C-100AC is available at Aetrix Electronics and suitable for high-speed cache buffers, Pentium-class CPU interfaces, network packet buffers, and industrial motion controller memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1383C-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial and computing markets.
The CY7C1383C belongs to Cypress's synchronous flow-through SRAM product line, engineered specifically for low-latency, burst-oriented memory subsystems in x86-compatible and real-time embedded systems.
FAQ
What is the function of the MODE pin on CY7C1383C-100AC?
The MODE pin is a static configuration input that selects burst addressing order: HIGH enables Intel Pentium-style interleaved bursts, while LOW enables linear bursts. It has an internal pull-up resistor and must remain stable during operation - no dynamic switching is allowed. This pin directly maps to CPU cache-line fetch behavior and eliminates software configuration overhead.
Can CY7C1383C-100AC operate with only 2.5V I/O supply and 3.3V core supply simultaneously?
Yes. The device supports independent VDD (3.3V ±5%/+10%) and VDDQ (2.5V or 3.3V) supplies. This allows direct connection to 2.5V FPGA I/O banks while maintaining full-speed 3.3V core operation. VSSQ must be tied to the same ground as VSS, and VDDQ must be powered before or concurrently with VDD to ensure proper I/O driver biasing.
How does the ZZ pin affect timing and power in CY7C1383C-100AC?
When ZZ is driven HIGH, the device enters non-time-critical sleep mode: core clocks halt, outputs go high-impedance, and standby current drops to 70 mA - independent of CLK or other control signals. Data is retained. Normal operation resumes within one clock cycle after ZZ returns LOW; no initialization sequence is required.
Why does CY7C1383C-100AC use separate ADSP and ADSC inputs instead of a single address strobe?
ADSP (Address Strobe Processor) and ADSC (Address Strobe Controller) provide hardware-level arbitration between CPU and cache controller address sources. When both are asserted, ADSP takes priority - enabling hierarchical memory management without external logic. This dual-strobe architecture eliminates glue logic in Pentium-compatible systems and supports simultaneous address capture from two independent masters.
CY7C1383C-100AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1383C-100AC FAQ
1.How can I place an order for CY7C1383C-100AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1383C-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1383C-100AC reliable?
The price and inventory of CY7C1383C-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1383C-100AC is usually 5 days.
3.What payment methods are accepted for CY7C1383C-100AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1383C-100AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1383C-100AC?
CY7C1383C-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1383C-100AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1383C-100AC?
For technical support, including CY7C1383C-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1383C-100AC requirements.
6.How does Aetrix verify that CY7C1383C-100AC is sourced from the original manufacturer or authorized distributors?
All CY7C1383C-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1383C-100AC meets industry standards.
7.What is the process for return or replacement of CY7C1383C-100AC?
All CY7C1383C-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1383C-100AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1383C-100AC part is unused and in its original packaging.
Return procedure for CY7C1383C-100AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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