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Infineon Technologies CY7C1383D-100AXC
- Part No.:
- CY7C1383D-100AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1383D-100AXC.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,373
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Product details
Overview
CY7C1383D-100AXC from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous flow-through SRAM with 133 MHz bus operation, 6.5 ns clock-to-output delay, 3.3V core supply (VDD), and dual-voltage I/O support (2.5V/3.3V VDDQ). It implements synchronous burst addressing via ADSP/ADSC strobes and on-chip 2-bit wraparound counter for Pentium®-compatible cache subsystems in high-speed embedded controllers.
For engineers reviewing the CY7C1383D-100AXC datasheet, CY7C1383D-100AXC pinout, CY7C1383D-100AXC application, or CY7C1383D-100AXC equivalent, key selection criteria include burst mode configuration (MODE pin), triple chip enable architecture (CE1/CE2/CE3), synchronous self-timed write timing, JTAG boundary scan compliance, and JEDEC-standard TQFP-100 Pb-free packaging.
Technical Context
This SRAM uses a synchronous interface with positive-edge-triggered CLK to register all address, control, and data inputs. Burst sequencing is determined by the static MODE pin (interleaved when HIGH, linear when LOW), and address advancement is controlled by ADV during active ADSP or ADSC assertion.
The device integrates separate processor (ADSP) and controller (ADSC) address strobes, supports byte-write (BWA–BWD + BWE) and global write (GW), and features asynchronous OE and ZZ sleep controls. All I/Os are JEDEC-compliant and JESD8-5-compatible, with VDDQ-independent output drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1,048,576 × 18 bits), enabling full-line cache storage for 64-byte bursts in x18 configuration. |
| Max Clock Frequency | 133 MHz - defines maximum sustained burst throughput of 2.39 GB/s (133 MHz × 18-bit × 1 cycle per access). |
| Access Time (tCDV) | 6.5 ns - guaranteed clock-to-output delay under worst-case VDD = 3.3V ± 0.3V, Tj = 85°C, ensuring tight timing closure in Pentium-class systems. |
| VDD / VDDQ Supply | 3.3V core (VDD), 2.5V or 3.3V I/O (VDDQ) - allows interoperability with both 2.5V and 3.3V logic families without level shifters. |
| Burst Control | User-selectable interleaved/linear via MODE pin - matches native burst order of Intel Pentium® (interleaved) or custom controllers (linear). |
| Chip Enables | Three synchronous enables (CE1 active LOW, CE2 active HIGH, CE3 active LOW) - supports hierarchical memory banking with precise timing alignment to CLK. |
| JTAG Support | IEEE 1149.1-compliant boundary scan (TCK/TDI/TDO/TMS) - enables in-system test and debug without external probing on FBGA variants (not present in TQFP). |
Pinout & Package
Package: 100-pin JEDEC-standard Pb-free TQFP (Thin Quad Flat Package), 14 mm × 14 mm body, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Positive-edge-triggered master timing reference for all registered inputs (address, control, data); governs burst counter increment on ADV assertion. |
| ADSP / ADSC | Address strobe inputs | ADSP initiates processor-originated bursts; ADSC handles controller-originated accesses; ADSP takes priority when both asserted. |
| ADV | Burst address advance | Sampled on CLK rise to auto-increment internal 2-bit counter - eliminates external address generation logic during burst cycles. |
| CE1, CE2, CE3 | Chip enable group | CE1 (active LOW) enables device; CE2 (active HIGH) and CE3 (active LOW) provide depth-expansion control for multi-SRAM banks with synchronized access. |
| MODE | Burst sequence selector | Static strap pin: HIGH (or floating) selects Pentium®-compatible interleaved burst; LOW selects linear - must remain stable during operation. |
| DQA–DQD, DQPA–DQPD | Data I/O and parity I/O | 18-bit bidirectional data (DQA–DQD) plus 4-bit parity (DQPA–DQPD); direction controlled by asynchronous OE; tri-stated automatically during writes and deselect. |
| ZZ | Asynchronous sleep control | Active HIGH input places SRAM in low-power retention mode (ISB ≤ 70 mA) while preserving data integrity - no timing constraints on entry/exit. |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous self-timed write | Eliminates external write pulse generation - internal timing circuitry completes write within one CLK period after valid address/data/control setup. |
| Configurable burst order | Hardware-selectable via MODE pin - avoids firmware reconfiguration and ensures deterministic timing for cache coherency protocols. |
| Triple chip enable architecture | Enables seamless expansion to 4M×18 or 2M×36 configurations using CE2/CE3 as bank select lines without additional glue logic. |
| Asynchronous output enable (OE) | Permits dynamic output tri-state control independent of CLK - critical for bus sharing in multi-master systems. |
| JEDEC-compliant I/O interface | Guarantees signal integrity and timing compatibility with industry-standard microprocessors and ASICs without level-shifting circuitry. |
Applications
| Processor Cache Subsystem | Network Packet Buffer |
|---|---|
Use Scenario: Secondary cache for Intel Pentium®-class CPUs operating at 133 MHz FSB. IC Role / Device Role / Timing Role: High-bandwidth, low-latency flow-through SRAM providing burst-aligned data delivery with 6.5 ns tCDV. Use Value: Matches native Pentium® interleaved burst order via MODE pin, eliminating address translation logic and reducing PCB trace count by 33% vs. discrete latch-based solutions. | Use Scenario: Line-rate buffering in Gigabit Ethernet switch fabric ASICs. IC Role / Device Role / Timing Role: Synchronous packet payload store supporting back-to-back 64-byte bursts at 133 MHz with deterministic latency. Use Value: Triple CE architecture enables concurrent read/write bank switching, sustaining 2.39 GB/s throughput without pipeline stalls or arbitration overhead. |
| Industrial Motion Controller Memory | Avionics Data Acquisition Buffer |
Use Scenario: Real-time trajectory buffer in CNC motion controllers requiring deterministic access under RTOS scheduling. IC Role / Device Role / Timing Role: Deterministic-latency SRAM interfacing directly to FPGA-based motion sequencers via ADSP/ADV handshake. Use Value: Asynchronous ZZ sleep mode reduces standby power to ≤70 mA while preserving position data across servo cycle gaps - critical for fail-safe operation. | Use Scenario: High-integrity sensor data capture in DO-254-certified flight control systems. IC Role / Device Role / Timing Role: Parity-protected (DQPX) burst memory storing ADC samples with IEEE 1149.1 JTAG test access for in-flight diagnostics. Use Value: Built-in parity I/O and boundary scan eliminate need for external ECC logic and dedicated test fixtures - reducing SWaP-C by 12 cm² and 1.8 W. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1383F-100AXC | Same density and timing, but 119-ball BGA package with single CE1 only (no CE2/CE3); no TQFP option. | Preferred for space-constrained PCBs where board area is prioritized over manual assembly; lacks depth-expansion capability. | Select when footprint size is critical and memory expansion beyond single device is not required. |
| IS61LV102418-100TQLI | 1M×18, 100 MHz, 8.5 ns tCDV, 3.3V-only VDDQ, no MODE/burst control - asynchronous interface with simpler timing. | Suitable for non-bursting control-plane buffers where deterministic burst alignment is unnecessary. | Choose for cost-sensitive, lower-speed applications where Pentium®-compatibility and burst flexibility are not needed. |
Compared with CY7C1383F-100AXC, the -100AXC offers TQFP manufacturability and triple CE expandability; versus IS61LV102418-100TQLI, it delivers 33% higher bandwidth and hardware-configurable burst order essential for cache coherence.
Availability
CY7C1383D-100AXC is available at Aetrix Electronics and suitable for industrial motion controllers, network switch fabric buffers, avionics data acquisition systems, and Pentium®-based embedded computing platforms requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1383D-100AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets, with emphasis on reliability and system-level integration.
CY7C1383D belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for secondary cache and burst-buffer applications in microprocessor-based systems demanding sub-7 ns access and JEDEC-compliant interoperability.
FAQ
What is the function of the MODE pin, and how must it be connected?
The MODE pin selects burst sequence: HIGH (or floating, due to internal pull-up) enables Pentium®-compatible interleaved burst; LOW enables linear burst. It is a static strap pin - connection must be fixed at power-up and remain unchanged during operation. Incorrect or floating MODE in linear-mode systems causes invalid address sequences and data corruption.
Can CY7C1383D-100AXC operate with only 2.5V I/O supply (VDDQ) while maintaining 133 MHz performance?
Yes - the device is fully characterized at VDDQ = 2.5V ± 0.2V and supports full 133 MHz operation with 6.5 ns tCDV. I/O voltage independence from VDD allows direct interfacing with 2.5V ASICs or FPGAs without level shifters, provided VDD remains at 3.3V ± 0.3V for core functionality.
How does the ZZ sleep mode affect data retention and wake-up timing?
When ZZ is driven HIGH, the device enters non-time-critical sleep with data retained and standby current ≤70 mA. Wake-up occurs synchronously on the next rising CLK edge after ZZ returns LOW - no minimum sleep duration or stabilization delay is required, enabling microsecond-scale power gating in real-time systems.
Why are CE2 and CE3 absent in the CY7C1383F variant but present in CY7C1383D-100AXC?
CE2 (active HIGH) and CE3 (active LOW) are implemented only in TQFP and 165-ball FBGA packages to support depth-expansion across multiple SRAM devices. The 119-ball BGA (CY7C1383F) omits them to reduce ball count and simplify routing - confirming that CY7C1383D-100AXC's triple CE capability is package-dependent and exclusive to TQFP/FBGA variants.
CY7C1383D-100AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1383D-100AXC FAQ
1.How can I place an order for CY7C1383D-100AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1383D-100AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1383D-100AXC reliable?
The price and inventory of CY7C1383D-100AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1383D-100AXC is usually 5 days.
3.What payment methods are accepted for CY7C1383D-100AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1383D-100AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1383D-100AXC?
CY7C1383D-100AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1383D-100AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1383D-100AXC?
For technical support, including CY7C1383D-100AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1383D-100AXC requirements.
6.How does Aetrix verify that CY7C1383D-100AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1383D-100AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1383D-100AXC meets industry standards.
7.What is the process for return or replacement of CY7C1383D-100AXC?
All CY7C1383D-100AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1383D-100AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1383D-100AXC part is unused and in its original packaging.
Return procedure for CY7C1383D-100AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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