Infineon Technologies CY7C1383D-133AXI
- Part No.:
- CY7C1383D-133AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1383D-133AXI.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1383D-133AXI from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous flow-through SRAM with 133 MHz bus operation, 6.5 ns clock-to-output delay, 3.3 V core supply (VDD), 2.5 V/3.3 V I/O supply (VDDQ), and JEDEC-standard 100-pin TQFP packaging. It serves as high-speed cache or buffer memory in Pentium-class microprocessor systems requiring burst-mode interfacing with minimal glue logic.
For engineers reviewing the CY7C1383D-133AXI datasheet, CY7C1383D-133AXI pinout, CY7C1383D-133AXI application, or CY7C1383D-133AXI equivalent, key selection criteria include burst sequence mode (interleaved/linear), dual address strobe support (ADSP/ADSC), synchronous self-timed write timing, ZZ sleep mode behavior, and VDDQ voltage flexibility for mixed-voltage system integration.
Technical Context
This SRAM implements a synchronous, flow-through architecture with a 2-bit on-chip burst counter that auto-increments addresses during burst reads/writes. All address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK, enabling precise timing alignment with high-speed processors.
Burst initiation is supported via either ADSP (processor address strobe) or ADSC (cache controller address strobe), with ADV controlling internal address advancement. The MODE pin selects interleaved (HIGH) or linear (LOW) burst sequences, directly mapping to Intel Pentium-compatible memory access patterns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1M × 18 organization) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns cycle time for sustained burst transfers |
| Access Time (tCO) | 6.5 ns - defines minimum clock-to-valid-output delay for read cycles |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers internal logic and memory array; requires stable regulation |
| I/O Supply Voltage | 2.5 V or 3.3 V - supports interface to both LVTTL and SSTL-2 systems |
| Burst Support | Intel Pentium-compatible interleaved or linear sequences - selected by MODE pin |
| Power Consumption | 210 mA max operating current - determines thermal budget in dense memory subsystems |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:18] | Synchronous Address Inputs | Sampled on CLK rising edge when ADSP/ADSC active; A[1:0] load burst counter |
| CLK | System Clock Input | Edge-triggered master timing reference for all synchronous inputs and burst counter |
| ADSP / ADSC | Address Strobe Inputs | Asynchronous assertion triggers address latching; ADSP takes priority over ADSC |
| ADV | Burst Address Advance | Asserted LOW on CLK edge to increment internal burst address counter |
| OE | Asynchronous Output Enable | Active LOW enables DQ/DQP outputs; tristates pins when HIGH or during writes |
| ZZ | Asynchronous Sleep Input | Active HIGH places device in low-power sleep; pin must be grounded per errata (Pin 64) |
| DQA–DQD, DQPA–DQPD | Bidirectional Data I/O | 18 data + 4 parity lines; direction controlled by OE; output drivers support 2.5 V/3.3 V VDDQ |
| BWA–BWD, BWE, GW | Write Control Inputs | Synchronous byte-write enable (BWE + BWx) or global write (GW); sampled on CLK rise |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-level decode: CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline stalls during burst reads by delivering data on same clock cycle as address advance |
| User-selectable burst mode | MODE pin configures Intel Pentium interleaved (HIGH) or linear (LOW) addressing without external logic |
| Dual address strobe support | Independent ADSP (processor) and ADSC (controller) inputs enable flexible cache-coherent system partitioning |
| Synchronous self-timed write | Internal write timing is fully clock-aligned; no external wait-state generation required |
| IEEE 1149.1 JTAG boundary scan | Supports board-level test and debug; requires BYPASS mode per errata due to functional limitations |
Applications
| High-Performance CPU Cache | Network Packet Buffer |
|---|---|
Use Scenario: L2 cache memory for x86-compatible embedded processors operating at 133 MHz bus speed. IC Role / Device Role / Timing Role: Flow-through SRAM providing zero-wait-state burst reads with 6.5 ns tCO to match processor timing budgets. Use Value: Enables deterministic 2-1-1-1 access pattern execution without glue logic, reducing PCB complexity and signal integrity risk. | Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer supporting concurrent ingress/egress traffic with burst-mode DMA. Use Value: 133 MHz operation sustains >2 Gbps aggregate throughput; VDDQ flexibility allows direct interface to 2.5 V PHY layers. |
| Industrial Motion Controller Memory | Medical Imaging Frame Store |
Use Scenario: Real-time position lookup table storage in servo drive firmware with deterministic interrupt response. IC Role / Device Role / Timing Role: Synchronous SRAM acting as fast-access parameter store synchronized to motion control clock domain. Use Value: ZZ sleep mode reduces standby power to <70 mA while preserving data integrity during idle intervals between motion cycles. | Use Scenario: Line-buffer memory in ultrasound beamforming engines requiring rapid pixel reordering. IC Role / Device Role / Timing Role: Burst-capable memory supporting interleaved read/write for real-time image rotation and scaling. Use Value: Interleaved burst mode matches raster-scan memory access patterns, cutting average latency by 30% vs. linear addressing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102418BLL-133TQLI | 1024K × 18, 133 MHz, 3.3 V core, but uses single VDDQ (3.3 V only); no ZZ sleep mode | Lacks asynchronous sleep control; requires external power management for low-power states | Select when system lacks dedicated sleep control logic and operates exclusively at 3.3 V I/O |
| MT55LSD128H18P-133:G | 128M × 18 QDR-II+ SRAM, 133 MHz, differential clocks, no MODE pin for burst type | Requires differential clocking and separate read/write clocks; not drop-in compatible | Select only for new designs targeting higher bandwidth via QDR protocol; not suitable for legacy Pentium-style interfaces |
Compared with IS61WV102418BLL-133TQLI and MT55LSD128H18P-133:G, the CY7C1383D-133AXI uniquely supports both 2.5 V and 3.3 V I/O, includes hardware-selectable burst modes, and provides an asynchronous ZZ sleep input-making it optimal for cost-sensitive, mixed-voltage, legacy-compatible systems requiring deterministic timing.
Availability
CY7C1383D-133AXI is available at Aetrix Electronics and suitable for high-speed CPU cache, network packet buffering, and industrial motion control applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1383D-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.
The CY7C138xD series was designed specifically for high-speed, low-latency memory interfacing in x86-compatible and industrial control platforms where flow-through timing and burst compatibility reduce system-level timing margin pressure.
FAQ
What is the correct connection for the ZZ pin on CY7C1383D-133AXI?
The ZZ pin (Pin 64) must be externally connected to ground per documented errata. Although internally pulled down, grounding ensures reliable entry into and exit from sleep mode. Leaving it floating may cause intermittent sleep activation or increased standby current due to noise coupling.
Can CY7C1383D-133AXI operate with 2.5 V VDDQ while using 3.3 V VDD?
Yes - the device supports independent 3.3 V core (VDD) and 2.5 V I/O (VDDQ) supplies. This allows direct interfacing with 2.5 V logic families while maintaining full 133 MHz performance. VDDQ must be stable within ±0.15 V during operation.
How does the MODE pin affect burst addressing behavior?
When MODE = HIGH, the device executes interleaved burst sequences (e.g., 0→2→4→6…); when MODE = LOW, it executes linear bursts (e.g., 0→1→2→3…). This selection is latched on power-up and remains fixed until reset or power cycle - no runtime reconfiguration is supported.
Is JTAG boundary scan functional on CY7C1383D-133AXI?
JTAG is physically present and IEEE 1149.1-compliant, but functional verification is limited. Per errata, JTAG testing must be performed in BYPASS mode only; full instruction register or data register operations are not guaranteed and should not be relied upon for production test.
CY7C1383D-133AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1383D-133AXI FAQ
1.How can I place an order for CY7C1383D-133AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1383D-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1383D-133AXI reliable?
The price and inventory of CY7C1383D-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1383D-133AXI is usually 5 days.
3.What payment methods are accepted for CY7C1383D-133AXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1383D-133AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1383D-133AXI?
CY7C1383D-133AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1383D-133AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1383D-133AXI?
For technical support, including CY7C1383D-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1383D-133AXI requirements.
6.How does Aetrix verify that CY7C1383D-133AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1383D-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1383D-133AXI meets industry standards.
7.What is the process for return or replacement of CY7C1383D-133AXI?
All CY7C1383D-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1383D-133AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1383D-133AXI part is unused and in its original packaging.
Return procedure for CY7C1383D-133AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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