Infineon Technologies CY7C1383KV33-133AXC
- Part No.:
- CY7C1383KV33-133AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1383KV33-133AXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,223
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Product details
Overview
CY7C1383KV33-133AXC from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous flow-through SRAM with on-chip ECC, designed for high-speed cache and buffer applications in networking and telecom infrastructure. It supports 133 MHz bus operation, delivers 6.5 ns clock-to-output delay, operates from a 3.3 V core supply (VDD) with selectable 2.5 V or 3.3 V I/O supply (VDDQ), and features interleaved/linear burst modes via MODE pin.
For engineers reviewing the CY7C1383KV33-133AXC datasheet, CY7C1383KV33-133AXC pinout, CY7C1383KV33-133AXC application, or CY7C1383KV33-133AXC equivalent, key selection criteria include burst address sequencing control (ADSP/ADSC/ADV), synchronous self-timed write timing, asynchronous OE and ZZ sleep enable, and JEDEC-compliant 100-pin TQFP packaging with JTAG boundary scan support.
Technical Context
This SRAM implements a synchronous, clock-driven architecture where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. A 2-bit internal burst counter captures A[1:0] at ADSP/ADSC assertion and auto-increments addresses during burst cycles controlled by ADV.
It supports dual-bus interface logic with three chip enables (CE1 active-low, CE2 active-high, CE3 active-low), four byte-write enables (BWA–BWD), global write (GW), and dedicated parity I/O lines (DQP A/B). ECC encoding/decoding is fully integrated to detect and correct single-bit errors in real time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1M × 18 organization) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns cycle time for high-bandwidth burst transfers |
| Access Time (tCO) | 6.5 ns - clock-to-output delay critical for meeting tight read setup windows in cache subsystems |
| VDD Supply | 3.3 V ± 0.3 V - core voltage powering memory array and logic; requires stable low-noise regulation |
| VDDQ Supply | 2.5 V or 3.3 V - selectable I/O voltage enabling interoperability with 2.5 V or 3.3 V controllers |
| Burst Mode Control | MODE pin - HIGH = interleaved burst, LOW = linear burst; static configuration required before operation |
| ECC Function | On-chip encode/decode - detects and corrects single-bit soft errors without external logic or software overhead |
Pinout & Package
Package: JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), surface-mount, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Edge-triggered master timing reference for all registered inputs and burst counter advancement |
| ADSP / ADSC | Address strobe inputs | ADSP prioritized over ADSC; both capture A[1:0] into burst counter and load full address register on rising CLK |
| ADV | Burst advance control | Asserted LOW on rising CLK to increment internal burst counter and generate next sequential address |
| CE1, CE2, CE3 | Chip enable group | Three-level decode: CE1 (active-L), CE2 (active-H), CE3 (active-L); enables depth expansion and bank selection |
| DQ A/B, DQP A/B | Data and parity I/O | 18-bit bidirectional data + 2-bit parity; direction controlled by OE; tristated automatically during writes and deselect |
| OE | Asynchronous output enable | Active-LOW; overrides synchronous timing to force output drivers into high-Z state immediately |
| ZZ | Asynchronous sleep input | Active-HIGH; reduces dynamic power >90% while preserving data integrity; internal pull-down allows floating for normal operation |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Eliminates pipeline stalls between consecutive reads/writes - supports 2-1-1-1 access rate for sustained bandwidth |
| Configurable burst sequence | Hardware-selectable interleaved or linear addressing via MODE pin - matches processor or controller cache line mapping |
| Synchronous self-timed write | Internal write cycle completion detection - removes need for external write-strobe handshaking or wait-state generation |
| JTAG boundary scan (IEEE 1149.1) | Full pin-level testability on supported packages - enables automated PCB test and interconnect verification |
| Soft error resilience | ECC reduces SER by >100× vs. standard SRAM - validated for telecom base station and industrial control environments |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
Use Scenario: High-speed packet buffering in 10G/25G Ethernet line cards requiring deterministic latency and error resilience. IC Role / Device Role / Timing Role: Primary burst-access SRAM serving as first-level packet buffer between MAC and switch fabric, synchronized to 133 MHz system clock. Use Value: 6.5 ns tCO and 2-1-1-1 access rate ensure sub-10 ns read turnaround; ECC prevents silent corruption in radiation-prone chassis environments. | Use Scenario: Deep buffering for ingress/egress queues in carrier-grade routers handling mixed traffic loads. IC Role / Device Role / Timing Role: Dual-port-configured SRAM used in ping-pong buffer mode, with ADSP/ADSC supporting separate CPU and DMA address domains. Use Value: Separate processor/controller address strobes enable concurrent access arbitration; ZZ sleep cuts idle power by >90% during low-traffic intervals. |
| Industrial PLC Memory Modules | Radar Signal Processing Caches |
Use Scenario: Real-time I/O data logging and program execution cache in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile-backed SRAM holding firmware instructions and process variable tables, interfaced to ARM Cortex-R4F via 18-bit bus. Use Value: 3.3 V core + 2.5 V I/O compatibility simplifies level-shifting with legacy microcontrollers; MODE-strapped linear burst matches sequential scan-cycle addressing. | Use Scenario: Intermediate result storage in FMCW radar DSP pipelines requiring zero-latency access to FFT coefficient arrays. IC Role / Device Role / Timing Role: Low-jitter, deterministic SRAM acting as coefficient cache for FPGA-based FFT engines, clocked synchronously to 133 MHz sampling clock. Use Value: Flow-through design eliminates pipeline bubbles during back-to-back coefficient reads; on-chip ECC ensures bit integrity across temperature-cycled automotive environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C31026B-133JCIN | No integrated ECC; 100-pin TQFP; identical 1M × 18, 133 MHz, 3.3 V core | Requires external ECC logic or software correction; lower BOM cost but higher system-level validation burden | Select when ECC is handled at system level and cost sensitivity outweighs reliability requirements |
| IS61WV102418BLL-133TQLI | 133 MHz, 1M × 18, 3.3 V core, no ECC; supports 2.5 V I/O; different pinout (no ADSC/ADSP) | Lacks dedicated address strobes - relies on standard CE/OE timing; not drop-in compatible for burst-addressed systems | Select only for non-burst, CE/OE-controlled interfaces where ADSP/ADSC functionality is unused |
Compared with AS7C31026B-133JCIN and IS61WV102418BLL-133TQLI, CY7C1383KV33-133AXC uniquely integrates ECC and dual-address-strobe burst control in a pin-compatible 100-pin TQFP, eliminating external error-handling logic and enabling direct interfacing with cache-coherent processors and network controllers.
Availability
CY7C1383KV33-133AXC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and industrial PLC memory modules requiring stable component supply, long-term lifecycle support, and guaranteed ECC-enabled SRAM performance.
Supply support for CY7C1383KV33-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1383KV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for cache and buffer applications demanding sub-10 ns access, burst-mode efficiency, and hardware-level data integrity in mission-critical infrastructure.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst address order: HIGH (or floating, due to internal pull-up) enables interleaved burst; LOW (tied to GND) enables linear burst. It is a strap pin-configuration must be fixed before device initialization and cannot change dynamically during operation. Incorrect strapping causes invalid burst sequences and data misalignment.
Does CY7C1383KV33-133AXC support both 2.5 V and 3.3 V I/O simultaneously?
No. VDDQ is a single-supply pin accepting either 2.5 V or 3.3 V-not both. The selected VDDQ voltage determines I/O logic levels and must match the host controller's interface voltage. Mixing voltages risks latch-up or signal integrity failure. VDD remains fixed at 3.3 V regardless of VDDQ choice.
How does the ZZ sleep mode affect timing and data retention?
When ZZ is driven HIGH, the device enters a low-power sleep state with current draw reduced >90%, while all stored data is retained indefinitely without refresh. All outputs go high-Z, clocks are ignored, and internal logic halts-but memory cell state remains intact. Exiting sleep requires ZZ return to LOW followed by one valid CLK cycle before resuming operation.
Can ADSP and ADSC be used concurrently, and what happens if both are asserted?
No-ADSP and ADSC are mutually exclusive. When both are asserted LOW, the device recognizes only ADSP and ignores ADSC. This priority design ensures deterministic address capture in systems where processor and controller strobes may overlap. ADSC is intended for cache controller use only when ADSP is inactive.
CY7C1383KV33-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1383KV33-133AXC FAQ
1.How can I place an order for CY7C1383KV33-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1383KV33-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1383KV33-133AXC reliable?
The price and inventory of CY7C1383KV33-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1383KV33-133AXC is usually 5 days.
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CY7C1383KV33-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1383KV33-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1383KV33-133AXC?
For technical support, including CY7C1383KV33-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1383KV33-133AXC requirements.
6.How does Aetrix verify that CY7C1383KV33-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1383KV33-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1383KV33-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1383KV33-133AXC?
All CY7C1383KV33-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1383KV33-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1383KV33-133AXC part is unused and in its original packaging.
Return procedure for CY7C1383KV33-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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