Infineon Technologies CY7C1386C-167AC

Overview

CY7C1386C-167AC from Cypress Semiconductor is a 18-Mb synchronous pipelined SRAM with 512K × 36 organization, supporting 167 MHz bus operation (3.4 ns clock-to-output), 3.3V core supply (±5%), and 2.5V/3.3V I/O compatibility. It implements registered address/data paths, double-cycle deselect, and Intel Pentium–compatible burst sequencing - deployed in high-speed network packet buffers and CPU cache coherency subsystems.

For engineers reviewing the CY7C1386C-167AC datasheet, CY7C1386C-167AC pinout, CY7C1386C-167AC application, or CY7C1386C-167AC equivalent, key selection criteria include synchronous burst timing compliance, depth-expansion chip enable support (CE1/CE2/CE3), ZZ sleep mode behavior, and JEDEC-standard TQFP-100 package mechanical fit for legacy board layouts.

Technical Context

This SRAM uses a positive-edge-triggered CLK to register all synchronous inputs (addresses, CE1/CE2/CE3, ADSP/ADSC/ADV, BWx, BWE, GW) and outputs via pipelined output registers. The internal two-bit burst counter generates sequential addresses on ADV assertion, supporting both linear and interleaved (Intel Pentium) burst orders selected by the MODE pin.

It features asynchronous OE and ZZ controls: OE enables tri-state output buffering without clock dependency, while ZZ places the device in low-power sleep with data retention. Write cycles are self-timed and support byte-selectable widths (1–4 bytes) via BWx and BWE, with GW overriding byte masking to enable full-word writes.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC standard, 0.5 mm pitch, body size 14 × 14 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IS61WV102436B and MC10E143, CY7C1386C-167AC uniquely combines 2.5V/3.3V I/O flexibility, ZZ sleep, and Intel-compatible burst sequencing - enabling direct integration into mixed-voltage, power-aware, x86-aligned designs where alternatives require redesign or compromise.

Availability

CY7C1386C-167AC is available at Aetrix Electronics and suitable for network packet buffering, CPU cache coherency subsystems, baseband DSP memory, and industrial motion controller look-up tables requiring stable component supply across extended production lifecycles.

Supply support for CY7C1386C-167AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.

The CY7C1386C belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-oriented memory subsystems in networking infrastructure and compute-intensive embedded systems.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst sequence order: tied to GND for linear burst, or to VDD/floating for Intel Pentium–style interleaved burst. It is a static strap pin - configuration must be fixed at power-on and cannot change during operation. An internal pull-up ensures safe default (interleaved) if left unconnected.

Can CY7C1386C-167AC operate with a 2.5V VDDQ supply while using 3.3V core (VDD)?

Yes. VDD (core) requires 3.3 V ±5%, while VDDQ (I/O) accepts either 2.5 V or 3.3 V independently. When using 2.5 V on VDDQ, all DQ pins, OE, ZZ, and control inputs (CE1/CE2/CE3, ADSP/ADSC, ADV, BWx, BWE, GW) must be driven by 2.5 V logic - no level shifting needed.

How does the Double-Cycle Deselect (DCD) feature improve system performance?

DCD extends output enable by one clock cycle after chip deselect, allowing consecutive accesses across multiple depth-expanded SRAMs without bus turnaround delays. This eliminates wait states and maintains peak bandwidth - critical in systems using stacked 512K×36 devices to build larger memory arrays.

Is JTAG boundary scan supported in the CY7C1386C-167AC TQFP package?

No. JTAG signals (TDO, TDI, TMS, TCK) are only available on the 119-ball BGA and 165-ball fBGA packages. The 100-pin TQFP variant lacks JTAG pins entirely - boundary scan testing is not supported in this package option.