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Infineon Technologies CY7C1386D-200AXCT
- Part No.:
- CY7C1386D-200AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1386D-200AXCT.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,417
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Product details
Overview
CY7C1386D-200AXCT from Infineon Technologies is a 2-Mbit (128K × 16) synchronous static RAM (SSRAM) with QDR™ II architecture, 200 MHz clock frequency, 3.3 V core/interface supply, and flow-through read latency. It supports burst-of-4 or burst-of-2 read/write operations and is used in high-speed networking packet buffers and FPGA co-processor cache interfaces.
For engineers reviewing the CY7C1386D-200AXCT datasheet, CY7C1386D-200AXCT pinout, CY7C1386D-200AXCT application, or CY7C1386D-200AXCT equivalent, key selection criteria include QDR-II timing compliance, 16-bit data bus width, 200 MHz double-data-rate operation, flow-through latency mode, and industrial temperature range support.
Technical Context
This QDR-II SSRAM implements separate independent read and write data buses (RDQ/WDQ), enabling concurrent read and write access without bus turnaround delay. It uses differential K/K# and C/C# clocks to achieve precise timing control for DDR operation on both edges.
The device supports programmable burst length (2 or 4), selectable latency modes (flow-through or registered), and has internal self-timed write cycles. All address and control inputs are registered on the rising edge of K, while data is captured on both edges of K/K#.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | Synchronous SRAM (QDR-II), not asynchronous or pseudo-static - enables true concurrent read/write via dual data ports. |
| Capacity | 2 Mbit (128K words × 16 bits) - provides sufficient depth for multi-gigabit packet buffering in L2/L3 switches. |
| Max Clock Frequency | 200 MHz (5 ns period) - supports 400 MT/s per data line, meeting OC-192/STM-64 interface bandwidth needs. |
| Read Latency | 1.5 K-cycles (flow-through mode) - delivers first valid read data within 7.5 ns after address setup, critical for low-jitter buffer access. |
| Supply Voltage | 3.3 V ± 0.3 V core and I/O - compatible with standard 3.3 V logic families and FPGA I/O banks without level translation. |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade deployment in telecom infrastructure and base station equipment. |
| Package | 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) - surface-mount compatible with automated PCB assembly and thermal management in dense layouts. |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), body size 14 mm × 14 mm, lead pitch 0.5 mm, exposed pad optional for thermal enhancement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Differential clock inputs | Edge-aligned timing reference for all registered inputs; K rising edge captures addresses/controls, K/K# transitions sample RDQ/WDQ. |
| C, C# | Differential echo clock outputs | Phase-aligned copies of K/K# for source-synchronous data capture by external controller - eliminates clock skew in high-speed routing. |
| A[16:0] | Address inputs | 17-bit address bus supporting full 128K-word addressing; registered on K rising edge with setup/hold timing referenced to K/K#. |
| RDQ[15:0] | Read data outputs | 16-bit unidirectional read data bus driven on K# falling/rising edges - isolated from WDQ to prevent contention during concurrent access. |
| WDQ[15:0] | Write data inputs | 16-bit unidirectional write data bus sampled on K# falling/rising edges - independent timing allows simultaneous read+write at full bandwidth. |
| GW#, BW#, UB#, LB# | Write control signals | Byte-write enable and global write enable pins - support partial-word writes without read-modify-write overhead in packet processing. |
Key Features
| Feature | Design Value |
|---|---|
| QDR-II Architecture | Separate read/write data buses eliminate bus turnaround delay, enabling sustained 400 MT/s throughput under concurrent traffic. |
| Burst Length Programmability | Configurable burst-of-2 or burst-of-4 via MODE pin - optimizes bandwidth efficiency for fixed-size packet headers vs. variable-length payloads. |
| Flow-through Read Latency | 1.5-cycle latency (7.5 ns @ 200 MHz) - reduces pipeline stalls in real-time packet classification engines. |
| Differential Clock & Echo Clock | K/K# and C/C# pairs provide deterministic timing margins - simplifies PCB layout and meets <10 ps skew requirements for >400 MT/s signaling. |
| Industrial Temperature Range | –40 °C to +85 °C operation - validated for continuous use in fanless network chassis and outdoor small cells. |
Applications
| High-Speed Network Switch Buffer | FPGA-Based Protocol Accelerator |
|---|---|
|
Use Scenario: Storing ingress/egress packet descriptors and metadata in Layer 2/L3 Ethernet switches operating at 10 Gbps line rate. IC Role / Device Role / Timing Role: Dual-port SSRAM serving as shared descriptor queue between ingress parser and egress scheduler, synchronized to 200 MHz system clock. Use Value: Concurrent read/write capability eliminates arbitration delay, enabling deterministic sub-100 ns descriptor access time required for wire-speed forwarding. |
Use Scenario: Offloading TCP/IP checksum calculation and header modification in reconfigurable compute accelerators using Xilinx Kintex-7 FPGAs. IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to FPGA's native QDR-II IP core for zero-wait-state streaming. Use Value: 400 MT/s effective bandwidth matches FPGA fabric throughput, avoiding backpressure on PCIe Gen2 x4 host interface. |
| Telecom Line Card Packet Memory | Real-Time Video Frame Buffer |
|
Use Scenario: Temporary storage of ATM cell payloads and MPLS label stacks in carrier-grade DSLAM and OLT line cards. IC Role / Device Role / Timing Role: Flow-through latency SSRAM acting as elastic store between serial framer and parallel bus interface, clocked at 200 MHz. Use Value: 1.5-cycle read latency ensures jitter-free cell reassembly across multiple VC channels with guaranteed 125 µs frame alignment. |
Use Scenario: Intermediate frame storage in broadcast-grade SDI-to-IP gateway hardware handling 1080p60 video streams. IC Role / Device Role / Timing Role: Dual-port buffer decoupling 74.25 MHz SMPTE-292 input clock from 148.5 MHz HDMI output clock domain. Use Value: Independent RDQ/WDQ buses allow simultaneous capture and playback without FIFO depth expansion or frame drop risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR-II SSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1386D-250AXC | 250 MHz max clock (4 ns period); otherwise identical pinout, timing, and feature set. | Supports higher bandwidth up to 500 MT/s - suitable when system clock margin allows tighter setup/hold timing. | Select if design targets >400 MT/s aggregate throughput and PCB layout supports stricter signal integrity controls. |
| AS7C3256A-20JC | Asynchronous SRAM (not QDR-II); 20 ns access time; single data bus; no differential clocks or echo clock. | Lacks concurrent read/write and source-synchronous timing - requires external arbitration and limits max throughput to ~50 MHz effective. | Only consider for cost-sensitive, non-real-time applications where latency tolerance exceeds 20 ns and bandwidth <100 MB/s is acceptable. |
Compared with CY7C1386D-250AXC, the -200AXCT trades 50 MHz clock headroom for relaxed timing closure and lower power; versus AS7C3256A-20JC, it delivers 4× higher effective bandwidth and deterministic low-latency access essential for packet and video processing.
Availability
CY7C1386D-200AXCT is available at Aetrix Electronics and suitable for high-speed networking equipment, FPGA-based protocol accelerators, telecom line cards, and broadcast video gateways requiring stable component supply and long-term industrial temperature support.
Supply support for CY7C1386D-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and high-performance memory products.
CY7C1386D belongs to Infineon's legacy Cypress QDR-II SSRAM product line, designed specifically for deterministic, high-bandwidth buffering in networking, telecommunications, and real-time video infrastructure.
FAQ
What is the difference between flow-through and registered latency modes in CY7C1386D-200AXCT?
In flow-through mode, read data appears after 1.5 K-clock cycles with no internal register delay - ideal for minimal-latency applications like packet forwarding. Registered mode inserts one additional K-cycle delay for improved timing margin at highest frequencies. Mode selection is controlled by the MODE pin at power-up and cannot be changed dynamically during operation.
Does CY7C1386D-200AXCT support byte-write masking without using global write enable?
Yes - the device uses four independent byte-enable signals (UB#, LB#, BW0#, BW1#) to mask individual bytes on the 16-bit WDQ bus. This allows precise 8-bit or partial-word writes without asserting GW# or affecting other bytes, critical for descriptor field updates in networking applications.
Can CY7C1386D-200AXCT operate with only single-ended clock inputs?
No - K/K# and C/C# are strictly differential inputs/outputs requiring matched-pair routing and termination. The device does not support single-ended clocking; attempting to drive only K or C will result in undefined behavior and timing violations per the datasheet specification.
Is there a drop-in replacement for CY7C1386D-200AXCT with extended temperature range?
No direct drop-in replacement exists with extended (–55 °C to +125 °C) rating in the same QDR-II 2-Mbit 100-pin TQFP package. Infineon discontinued extended-temp variants of this generation; designs requiring wider range must migrate to newer QDR-IV families such as CY7C2665KV18, which require PCB redesign and firmware adaptation.
CY7C1386D-200AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1386D-200AXCT FAQ
1.How can I place an order for CY7C1386D-200AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1386D-200AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1386D-200AXCT reliable?
The price and inventory of CY7C1386D-200AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1386D-200AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1386D-200AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1386D-200AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1386D-200AXCT?
CY7C1386D-200AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1386D-200AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1386D-200AXCT?
For technical support, including CY7C1386D-200AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1386D-200AXCT requirements.
6.How does Aetrix verify that CY7C1386D-200AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1386D-200AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1386D-200AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1386D-200AXCT?
All CY7C1386D-200AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1386D-200AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1386D-200AXCT part is unused and in its original packaging.
Return procedure for CY7C1386D-200AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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