Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1386S-167AXC

Part No.:
CY7C1386S-167AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1386S-167AXC.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,819

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1386S-167AXC from Cypress Semiconductor is a 18-Mbit (512 K × 36) pipelined DCD synchronous SRAM with registered inputs/outputs, 167 MHz bus operation support, 3.4 ns clock-to-output time, and dual-voltage I/O (2.5 V/3.3 V). It serves as high-performance secondary cache in Pentium®-compatible systems requiring burst-mode memory access with depth expansion capability.

For engineers reviewing the CY7C1386S-167AXC datasheet, CY7C1386S-167AXC pinout, CY7C1386S-167AXC application, or CY7C1386S-167AXC equivalent, key selection criteria include synchronous burst timing, byte-write control granularity, ZZ sleep mode behavior, and JEDEC-standard 100-pin TQFP compatibility for legacy x86 cache subsystems.

Technical Context

The device implements a two-bit wraparound burst counter synchronized to CLK's rising edge, supporting both Intel Pentium®-interleaved and linear burst sequences selected via the static MODE pin. All address, data, and control inputs (CE1/CE2/CE3, ADSP/ADSC, ADV, BWE/BWX, GW) are registered on the same clock edge.

It features pipelined enable logic that delays output buffer disable by one cycle during deselect, enabling zero-wait-state depth expansion. Write cycles are self-timed and synchronous; reads deliver data on the second clock edge after address capture, with OE providing asynchronous tri-state control independent of clock timing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18 Mbit (512 K × 36), enabling 36-bit wide cache line storage without external data bus widening
Max Clock Frequency167 MHz, defining maximum sustained burst throughput in synchronous cache applications
Access Time (tCO)3.4 ns, specifying minimum clock-to-output delay for timing-critical read paths
VDD / VDDQ3.3 V core / 2.5 V or 3.3 V I/O, allowing direct interface with 2.5 V processors or 3.3 V system buses
Burst SupportUser-selectable interleaved or linear sequence via MODE pin, matching Pentium® or generic processor requirements
Write ArchitectureSynchronous self-timed writes with byte-level (BWA–BWD) and global (GW) control, eliminating external write timing logic
Power ManagementZZ sleep mode with data retention, reducing standby current to ≤70 mA while preserving cache contents

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, compatible with automated SMT assembly and thermal management in dense cache modules.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Synchronous Address InputSampled on CLK rising edge when ADSP/ADSC active; A1:A0 feed internal 2-bit burst counter
CE1, CE3Synchronous Chip Enable (Active LOW)CE1 must be LOW to recognize ADSP; CE3 enables depth expansion with CE1/CE2
CE2Synchronous Chip Enable (Active HIGH)Used with CE1/CE3 for bank selection in multi-SRAM configurations
ADSP / ADSCAddress Strobe (Processor / Controller)ADSP takes priority; both trigger address registration and burst counter load on CLK rise
ADVBurst Address AdvanceAsserted LOW on CLK rise to increment internal burst counter for next address
BWA–BWDByte Write Select (Active LOW)Combined with BWE to enable 1–4 byte writes; no external decode logic required
GWGlobal Write Enable (Active LOW)Overrides BWX/BWE to write all 36 bits simultaneously on next clock edge
OEAsynchronous Output EnableTri-states DQ/DQP outputs immediately when HIGH, independent of CLK timing
ZZAsynchronous Sleep ControlHigh-Z input with internal pull-down; HIGH enters low-power sleep with data retention
DQA–DQD, DQPA–DQPDSynchronous Bidirectional Data I/O36 data + 4 parity bits; direction controlled by OE; registered on CLK rise for reads/writes

Key Features

FeatureDesign Value
Double-cycle deselectEnables zero-wait-state depth expansion across multiple CY7C1386S devices without performance penalty
Pipelined output enable registerDelays output buffer disable by one clock cycle during deselect, preventing bus contention in burst chains
User-selectable burst modeMODE pin configures interleaved (Pentium®) or linear burst order at power-up, no runtime reconfiguration needed
Synchronous self-timed writesEliminates need for external write pulse generation or timing margining in high-speed cache controllers
Separate ADSP/ADSC strobesAllows independent address capture from CPU (ADSP) and memory controller (ADSC), supporting dual-bus architectures

Applications

Secondary Cache for Pentium® SystemsHigh-Speed Buffer Memory in Network Processors

Use Scenario: Implements L2 cache between Pentium® processor and main memory in embedded industrial controllers.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as burst-accessible cache line store with interleaved addressing and pipelined enable.

Use Value: Delivers 167 MHz burst throughput and 3.4 ns tCO to match Pentium® bus timing, eliminating wait states in cache fills.

Use Scenario: Buffers packet header and payload data in ASIC-based network switching fabric.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory for temporary frame storage with byte-write granularity.

Use Value: Supports concurrent 36-bit reads and selective byte writes (via BWA–BWD) to minimize bus occupancy during partial updates.

Depth-Expanded Memory SubsystemLegacy x86 Industrial Control Module

Use Scenario: Four CY7C1386S devices configured in 144-Mbit (512 K × 144) depth-expanded array.

IC Role / Device Role / Timing Role: Pipelined DCD SRAM with double-cycle deselect enabling seamless address space extension.

Use Value: Maintains full 167 MHz bandwidth across all devices without added wait states or glue logic.

Use Scenario: Replaces obsolete SRAM in long-lifecycle PLC backplane modules requiring RoHS-compliant sourcing.

IC Role / Device Role / Timing Role: Drop-in-compatible synchronous cache with 100-pin TQFP footprint and identical AC/DC electrical specs.

Use Value: Preserves existing PCB layout and timing margins while adding ZZ sleep mode for energy-constrained deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102436BLL-167BLI1024 K × 36 organization, same 167 MHz speed grade, but uses single 3.3 V supply (no VDDQ separation)Lacks dual-voltage I/O flexibility; requires 3.3 V-only system interfaceSelect if board design uses uniform 3.3 V I/O and needs higher density per package
MT55LSD25636DZ-167:JSame 512 K × 36 density and 167 MHz rating, but supports JTAG boundary scan and has different ZZ behavior (active LOW)Requires redesign of sleep control logic and adds test infrastructure overheadSelect only when JTAG visibility and IEEE 1149.1 compliance are mandatory for production test

Compared with IS61WV102436BLL-167BLI and MT55LSD25636DZ-167:J, the CY7C1386S-167AXC uniquely supports mixed 2.5 V/3.3 V I/O and Pentium®-interleaved burst mode out-of-box, making it optimal for legacy x86 cache upgrades where voltage flexibility and burst compatibility are non-negotiable.

Availability

CY7C1386S-167AXC is available at Aetrix Electronics and suitable for secondary cache implementations, network processor buffers, depth-expanded memory subsystems, and legacy x86 industrial control modules requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1386S-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and computing applications.

The CY7C1386S belongs to Cypress's DCD Sync SRAM product line, engineered specifically for low-latency, burst-capable cache and buffer applications in x86-compatible and ASIC-based systems demanding deterministic timing and depth scalability.

FAQ

What is the function of the MODE pin on CY7C1386S-167AXC?

The MODE pin is a static configuration input that selects burst address sequence: tied to GND for linear burst, tied to VDD or left floating for Intel Pentium®-interleaved burst. It must remain stable during operation and is sampled only at power-up or reset; no dynamic switching is supported.

How does the ZZ sleep mode affect data retention and wake-up timing?

When ZZ is driven HIGH, the device enters a non-time-critical sleep state with full data retention. Wake-up occurs synchronously on the first valid CLK edge after ZZ returns LOW, with no additional stabilization delay required before initiating read/write operations.

Can CY7C1386S-167AXC operate with only 2.5 V on VDDQ while VDD remains at 3.3 V?

Yes - VDD must be 3.3 V ± 0.3 V for core operation, while VDDQ may be independently set to either 2.5 V ± 0.2 V or 3.3 V ± 0.3 V. This allows direct interfacing with 2.5 V processors without level shifters, provided VSSQ is referenced to the same ground as VDDQ.

What is the timing relationship between ADSP assertion and data output validity?

Data appears at DQ/DQP outputs on the rising edge of the second CLK cycle after ADSP is asserted LOW (assuming CE1–CE3 active and OE LOW). The first cycle captures the address; the second cycle clocks out the data with tCO ≤ 3.4 ns, regardless of whether the device was previously deselected.

CY7C1386S-167AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1386S-167AXC FAQ

1.How can I place an order for CY7C1386S-167AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1386S-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1386S-167AXC reliable?

The price and inventory of CY7C1386S-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1386S-167AXC is usually 5 days.

3.What payment methods are accepted for CY7C1386S-167AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1386S-167AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1386S-167AXC?

CY7C1386S-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1386S-167AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1386S-167AXC?

For technical support, including CY7C1386S-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1386S-167AXC requirements.

6.How does Aetrix verify that CY7C1386S-167AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1386S-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1386S-167AXC meets industry standards.

7.What is the process for return or replacement of CY7C1386S-167AXC?

All CY7C1386S-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1386S-167AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1386S-167AXC part is unused and in its original packaging.

Return procedure for CY7C1386S-167AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1386S-167AXC Tags

  • CY7C1386S-167AXC
  • CY7C1386S-167AXC PDF
  • CY7C1386S-167AXC Datasheet
  • CY7C1386S-167AXC Specifications
  • CY7C1386S-167AXC Images
  • Infineon Technologies
  • Infineon Technologies CY7C1386S-167AXC
  • Buy CY7C1386S-167AXC
  • CY7C1386S-167AXC Price
  • CY7C1386S-167AXC Distributor
  • CY7C1386S-167AXC Supplier
  • CY7C1386S-167AXC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER