Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1387KV33-167AXC

Part No.:
CY7C1387KV33-167AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1387KV33-167AXC.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,485

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1387KV33-167AXC from Cypress Semiconductor is a 18-Mbit synchronous pipelined SRAM configured as 1M × 18, operating at 167 MHz with 3.3 V core (VDD) and 2.5/3.3 V I/O (VDDQ) supplies, 3.4 ns access time, and registered inputs/outputs for depth-expansion-capable cache subsystems in high-performance embedded controllers.

For engineers reviewing the CY7C1387KV33-167AXC datasheet, CY7C1387KV33-167AXC pinout, CY7C1387KV33-167AXC application, or CY7C1387KV33-167AXC equivalent, key selection criteria include burst mode support (interleaved/linear), synchronous self-timed write capability, ZZ sleep mode, byte-write control (BWA–BWD + BWE), and JEDEC-standard 100-pin TQFP packaging.

Technical Context

This SRAM implements a two-bit synchronous wraparound burst counter controlled by ADV, ADSP, and ADSC inputs, enabling deterministic linear or interleaved address sequencing based on MODE pin state. All address, data, and control inputs (CE1/CE2/CE3, GW, BWE, BWX) are registered on the rising edge of CLK.

It supports asynchronous OE for output tristating and asynchronous ZZ for non-time-critical sleep mode with data retention. Write operations are self-timed and synchronized to CLK, with global write (GW) overriding byte-write selects (BWA–BWD) to enable full-word writes without external timing control.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (1M × 18 organization), enabling single-chip 18-bit wide cache or buffer in memory-constrained systems.
Max Clock Frequency 167 MHz - defines maximum sustained burst throughput of 167 million words per second.
Access Time (tCO) 3.4 ns - clock-to-output delay for read data valid after rising CLK edge, critical for tight timing budgets.
VDD / VDDQ 3.3 V core / 2.5 V or 3.3 V I/O - allows interface compatibility with both legacy 3.3 V and low-power 2.5 V logic domains.
Burst Control User-selectable interleaved or linear sequence via MODE pin - matches processor-specific cache line fetch patterns.
Write Architecture Synchronous self-timed writes with GW override - eliminates external write pulse generation and simplifies controller design.
Sleep Mode Asynchronous ZZ input (active HIGH) - reduces standby current while preserving data integrity without clock gating.

Pinout & Package

Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), JEDEC-standard Pb-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0, A1, A[2:18] Synchronous Address Inputs Sampled on CLK rising edge when ADSP/ADSC active; A1:A0 load two-bit burst counter for automatic address increment.
CE1, CE2, CE3 Synchronous Chip Enables CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) - enable depth expansion across multiple SRAMs without wait states.
ADSP / ADSC Address Strobe Inputs ADSP (processor strobe), ADSC (controller strobe); only one recognized if both asserted - supports dual-bus system architectures.
BWA–BWD, BWE, GW Byte Write Controls BWA–BWD select 4-byte lanes; BWE enables byte write; GW forces full-word write - enables precise memory update without read-modify-write.
OE Asynchronous Output Enable Active LOW; overrides CLK timing to tristate outputs immediately - supports shared bus arbitration and hot-swap safety.
ZZ Asynchronous Sleep Input Active HIGH; places device in low-power retention mode independent of clock state - ideal for power-gated subsystems.
DQs, DQP A–D Bidirectional Data I/O Common I/O pins with synchronous register capture on CLK rise; DQP pins provide parity for error detection in safety-critical applications.

Key Features

Feature Design Value
Pipelined DCD Synchronous Interface Registered inputs/outputs eliminate setup/hold violations at 167 MHz, enabling direct connection to high-speed processors without glue logic.
Double-Cycle Deselect Output buffers tristate precisely two clocks after chip deselect - maintains clean bus release timing during bank switching.
Depth Expansion Support Three independent chip enables (CE1/CE2/CE3) allow seamless stacking of multiple devices without performance penalty or external wait-state insertion.
Configurable Burst Mode MODE pin selects interleaved (for Pentium-style) or linear (for PowerPC-style) burst addressing - ensures compatibility with diverse CPU architectures.
Synchronous Self-Timed Writes On-chip write timing generator eliminates need for external write pulse width control - reduces FPGA/CPLD resource usage and PCB routing complexity.

Applications

Secondary Cache for RISC Processors Network Packet Buffer in Switch ASICs

Use Scenario: High-speed L2 cache between ARM Cortex-A series CPU and memory controller in telecom baseband processing units.

IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing 167 MHz burst reads/writes with zero-wait-state depth expansion across four banks.

Use Value: Eliminates external timing logic and enables deterministic 3.4 ns read latency across all cache lines, improving instruction throughput by >12% vs. asynchronous SRAM.

Use Scenario: Temporary storage for ingress/egress packet headers and metadata in Layer 2 Ethernet switching fabric.

IC Role / Device Role / Timing Role: 18-bit-wide synchronous buffer supporting concurrent header read (via ADSP) and payload write (via ADSC) with independent chip enables.

Use Value: Enables parallel header inspection and forwarding decision while buffering payload - reduces packet processing latency by 2.1 cycles per frame.

Industrial PLC Motion Control Buffer Avionics Display Frame Memory

Use Scenario: Real-time motion trajectory interpolation buffer in CNC controller requiring deterministic access to 1M-point position profiles.

IC Role / Device Role / Timing Role: Synchronous SRAM with ZZ sleep mode used during axis idle periods to reduce system power by 38% without data loss.

Use Value: Maintains microsecond-level jitter-free access during active motion while cutting quiescent power - meets IEC 61800-3 EMC and thermal limits.

Use Scenario: Dual-port frame buffer for HUD (Head-Up Display) graphics engine in certified flight display systems.

IC Role / Device Role / Timing Role: 1M × 18 organization mapped to 1024×768×18-bit pixel buffer with parity (DQP) for SEU detection per DO-254 requirements.

Use Value: Provides single-cycle pixel read/write with hardware parity checking - satisfies Level A airborne software assurance for display integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102418BLL-167BLI 100-pin TQFP, same 1M × 18, 167 MHz, but uses single VDD (3.3 V) for core and I/O - no VDDQ flexibility. Lacks ZZ sleep mode and separate VDDQ; not suitable for mixed-voltage I/O domains or low-power sleep states. Select when cost sensitivity outweighs voltage flexibility and power management needs.
MT55LCS0102418A-167:J 100-pin TQFP, identical organization and speed, but requires external write pulse; no self-timed write circuitry. Needs FPGA-generated write strobes and additional timing constraints - increases controller design complexity and verification effort. Select only when legacy controller already implements external write pulse generation and timing margins are sufficient.

Compared with IS61WV102418BLL-167BLI and MT55LCS0102418A-167:J, the CY7C1387KV33-167AXC uniquely integrates VDDQ voltage separation, ZZ sleep, and self-timed writes - reducing system-level power, board area, and controller firmware overhead in real-time embedded designs.

Availability

CY7C1387KV33-167AXC is available at Aetrix Electronics and suitable for secondary cache subsystems, network packet buffering, and industrial motion control applications requiring stable component supply, long-term lifecycle support, and JEDEC-compliant 100-pin TQFP packaging.

Supply support for CY7C1387KV33-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

The CY7C1387KV33 belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, depth-expandable cache and buffer applications in networking, industrial automation, and avionics systems.

FAQ

What is the function of the MODE pin on CY7C1387KV33-167AXC?

The MODE pin selects burst address sequence behavior: logic LOW configures interleaved burst order (e.g., 0, 2, 4, 6…), while logic HIGH selects linear burst order (e.g., 0, 1, 2, 3…). It is sampled synchronously on the rising edge of CLK during the first cycle of a burst access and determines how the internal two-bit counter increments addresses during ADV-driven bursts.

Can CY7C1387KV33-167AXC operate with VDDQ = 2.5 V while VDD = 3.3 V?

Yes - the device supports independent 3.3 V core supply (VDD) and 2.5 V I/O supply (VDDQ), enabling direct interfacing with 2.5 V logic families while maintaining full 167 MHz operation. This configuration is explicitly validated in the datasheet's Electrical Characteristics table and requires no derating of timing parameters.

How does the ZZ sleep mode affect timing and power consumption?

When ZZ is driven HIGH, the device enters a non-time-critical sleep state with typical standby current reduced to 25 µA (max 100 µA) while retaining all stored data. All outputs go high-impedance, and internal clocks are gated - no CLK signal is required during sleep. Exit time to active operation is 20 ns (max), guaranteed by internal wake-up circuitry.

Is CY7C1387KV33-167AXC pin-compatible with CY7C1386KV33-167AXC?

No - although both use 100-pin TQFP packages, their pinouts differ significantly: CY7C1386KV33 (512K × 36) allocates dedicated DQ/DQP pins for 36-bit width, while CY7C1387KV33 (1M × 18) repurposes several pins as address bits (A[2:18]) and removes redundant DQP lines. Direct substitution would cause functional failure and electrical mismatch.

CY7C1387KV33-167AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1387KV33-167AXC FAQ

1.How can I place an order for CY7C1387KV33-167AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1387KV33-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1387KV33-167AXC reliable?

The price and inventory of CY7C1387KV33-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1387KV33-167AXC is usually 5 days.

3.What payment methods are accepted for CY7C1387KV33-167AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1387KV33-167AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1387KV33-167AXC?

CY7C1387KV33-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1387KV33-167AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1387KV33-167AXC?

For technical support, including CY7C1387KV33-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1387KV33-167AXC requirements.

6.How does Aetrix verify that CY7C1387KV33-167AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1387KV33-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1387KV33-167AXC meets industry standards.

7.What is the process for return or replacement of CY7C1387KV33-167AXC?

All CY7C1387KV33-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1387KV33-167AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1387KV33-167AXC part is unused and in its original packaging.

Return procedure for CY7C1387KV33-167AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1387KV33-167AXC Tags

  • CY7C1387KV33-167AXC
  • CY7C1387KV33-167AXC PDF
  • CY7C1387KV33-167AXC Datasheet
  • CY7C1387KV33-167AXC Specifications
  • CY7C1387KV33-167AXC Images
  • Infineon Technologies
  • Infineon Technologies CY7C1387KV33-167AXC
  • Buy CY7C1387KV33-167AXC
  • CY7C1387KV33-167AXC Price
  • CY7C1387KV33-167AXC Distributor
  • CY7C1387KV33-167AXC Supplier
  • CY7C1387KV33-167AXC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER