Infineon Technologies CY7C1392CV18-200BZC

Overview

CY7C1392CV18 from Cypress Semiconductor is a 18-Mbit (2M × 8) synchronous pipelined SRAM with DDR-II Separate I/O architecture, operating at 200 MHz with 1.5-cycle read latency (DLL enabled), 1.8V core supply, and HSTL I/O compatible with 600 Mbps data transfer. It serves as high-bandwidth buffer memory in network packet processors requiring burst-aligned dual-port access without bus turnaround.

For engineers reviewing the CY7C1392CV18 datasheet, CY7C1392CV18 pinout, CY7C1392CV18 application, or CY7C1392CV18 equivalent, key selection criteria include DDR-II SIO timing compliance, 165-ball FBGA mechanical fit, DLL-enabled latency mode, HSTL output drive matching, and 2-word burst address multiplexing behavior.

Technical Context

This SRAM implements a synchronous pipelined architecture with independent read and write ports sharing a common address bus, latching addresses on alternating rising edges of complementary K/K clocks. Write data is registered on both K and K edges, while read data is clocked out synchronously via C/C or K/K in single-clock mode.

The device integrates a Delay Lock Loop (DLL) for precise data placement relative to echo clocks CQ/CQ, supports JTAG 1149.1 boundary scan, and uses ZQ calibration to match output impedance to system trace resistance. Nibble write select (NWS0/NWS1) enables partial-byte writes without disturbing adjacent nibbles.

Key Specifications

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA) package, 13 mm × 15 mm footprint, 1.4 mm height, RoHS-compliant lead-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with CY7C1392CV18-250BZC, this -200BZC variant trades 50 MHz headroom for relaxed timing margin and lower power at 200 MHz; versus IS61WV102416BLL-10TLI, it delivers 2× bandwidth and deterministic DDR-II timing but demands precise clock routing and impedance control.

Availability

CY7C1392CV18 is available at Aetrix Electronics and suitable for network infrastructure, automated test equipment, baseband signal processing, and industrial motion control applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1392CV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications systems, with emphasis on signal integrity and timing precision.

This device belongs to the DDR-II SIO SRAM product line, engineered specifically for high-throughput, low-latency buffering in systems where deterministic DDR timing and burst efficiency outweigh asynchronous simplicity.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW, forcing the device into DDR-I mode with 1-cycle read latency and reduced maximum frequency (167 MHz). In normal operation (DOFF HIGH), DLL alignment enables 1.5-cycle latency at 200 MHz, ensuring precise CQ-synchronized data capture. The timing parameters differ significantly between modes, requiring separate setup/hold validation.

How are the NWS0 and NWS1 signals used during write operations?

NWS0 and NWS1 are active-LOW nibble write selects sampled on the same K/K edges as write data. NWS0 enables writing to D[3:0], and NWS1 enables D[7:4]; if either is HIGH, the corresponding 4-bit segment retains its prior value. This allows partial updates to an 8-bit word without full-word overwrite or additional read-modify-write cycles.

Can C and C clocks be omitted in system design?

Yes - when C and C are unconnected, the device defaults to single-clock mode using K and K to clock both input and output registers. However, echo clocks CQ/CQ remain functional and aligned to K/K, preserving source-synchronous capture capability. Omitting C/C sacrifices deskew flexibility but simplifies clock distribution for less demanding layouts.

What is the role of the ZQ pin, and how should it be terminated?

ZQ calibrates output driver impedance to match the system data bus. It must be connected to a precision resistor (RQ) tied to ground; typical RQ = 120 Ω yields ~24 Ω driver impedance (0.2 × RQ). Direct connection to VDDQ enables minimum impedance mode (~15 Ω), while floating or grounding ZQ violates specification and causes undefined output strength.