Infineon Technologies CY7C1399B-12VXC
- Part No.:
- CY7C1399B-12VXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-BSOJ (0.300", 7.62mm Width)
- Datasheet:
-
CY7C1399B-12VXC.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28SOJ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1399B-12VXC from Cypress Semiconductor is a 256 Kbit (32K × 8) asynchronous CMOS static RAM operating at 3.3 V, with 12 ns access time, 28-pin SOJ (Pb-free) package, and automatic CE-controlled power-down mode. It delivers 216 mW max active power and supports low-voltage cache memory in embedded controllers and networking interface cards.
For engineers reviewing the CY7C1399B-12VXC datasheet, CY7C1399B-12VXC pinout, CY7C1399B-12VXC application, or CY7C1399B-12VXC equivalent, key selection criteria include 12 ns read cycle timing, TTL/CMOS-compatible control inputs (CE/OE/WE), 3.3 V single-supply operation, and automatic standby current reduction to 500 µA under deselected conditions.
Technical Context
The CY7C1399B-12VXC implements a full 32K × 8 asynchronous SRAM array using alpha-immune 6T cell technology, supporting independent read/write control via three-state bidirectional I/Os and dual enable logic (CE and OE). Its timing architecture guarantees tRC = 12 ns and tPD = 12 ns for CE-driven power-down entry.
It features two distinct standby modes: ISB1 (5 mA, TTL input thresholds) and ISB2 (500 µA, CMOS input thresholds), both triggered by CE HIGH while maintaining address and control pin voltage compliance. Output impedance transitions are specified with CL = 5 pF for high-speed bus interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32,768 × 8 bits) - supports byte-wide data paths without external multiplexing |
| Access Time | 12 ns - enables direct interface with 80 MHz bus systems without wait states |
| VCC Supply | 3.3 V ± 300 mV - compatible with modern low-voltage logic families and LDO-regulated rails |
| Active Current | 55 mA max - corresponds to ~216 mW at 3.3 V, suitable for thermally constrained modules |
| Standby Current | 500 µA (ISB2 mode) - reduces system idle power by >95% vs active operation |
| Input Capacitance | 5–6 pF - minimizes loading on address/control buses, preserving signal integrity at 100+ MHz edges |
| Data Retention VCC | 2.0 V min - allows battery-backed retention during main supply brownout or shutdown |
Pinout & Package
Package: 28-pin plastic SOJ (Small Outline J-Lead), 300-mil width, Pb-free (RoHS-compliant), JEDEC MS-012AC variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus supporting full 32K-word decoding; no internal latching |
| I/O0–I/O7 | Bidirectional Data Bus | Three-state CMOS I/Os; high-impedance when CE HIGH or OE HIGH and WE HIGH |
| CE | Chip Enable (active LOW) | Primary device select; initiates automatic power-down when HIGH and controls output Z-state |
| OE | Output Enable (active LOW) | Controls data output drivers only; does not affect internal memory state or power mode |
| WE | Write Enable (active LOW) | Controls write operation timing; overlapping CE LOW and WE LOW defines write window |
| VCC | Power Supply | 3.3 V core supply; decoupling required within 10 mm of pin per layout guidelines |
| GND | Ground Reference | Dedicated ground pin (Pin 12); must be connected to low-impedance system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Single 3.3 V supply | Eliminates need for dual-rail regulators or level shifters in 3.3 V system designs |
| Automatic CE power-down | Reduces ICC to 500 µA without external control logic or sleep-mode sequencing |
| Alpha-immune 6T SRAM cell | Ensures data integrity in radiation-prone environments such as industrial automation and telecom base stations |
| SOJ and TSOP packaging options | Enables footprint compatibility across board generations and thermal profiles (SOJ for reworkability, TSOP for density) |
| TTL/CMOS input thresholds | Supports direct connection to both legacy 5 V-tolerant microcontrollers and modern 3.3 V FPGAs |
Applications
| Network Interface Buffer | Industrial PLC Data Cache |
|---|---|
|
Use Scenario: Storing packet descriptors and temporary frame buffers in Ethernet MAC controllers. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM providing zero-wait-state storage for DMA-accessed descriptor rings. Use Value: 12 ns tRC ensures descriptor fetches align with 80 MHz PHY clock domains without pipeline stalls. |
Use Scenario: Holding real-time I/O status tables and ladder logic scratchpad in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile-cached working memory accessed by dual-port microcontroller cores during scan cycles. Use Value: 500 µA ISB2 current enables extended runtime on backup capacitors during AC loss events. |
| Medical Imaging Frame Store | Automotive Infotainment UI Buffer |
|
Use Scenario: Temporary storage of grayscale pixel rows during ultrasound image preprocessing pipelines. IC Role / Device Role / Timing Role: High-reliability SRAM buffer between ADC front-end and DSP engine, operating in extended temperature range. Use Value: Alpha-immune 6T cell design prevents soft errors in diagnostic-grade imaging systems requiring FDA compliance. |
Use Scenario: Storing GUI bitmap assets and touch event queues in head unit display subsystems. IC Role / Device Role / Timing Role: Low-power, fast-access memory for burst-mode rendering engines with intermittent activity patterns. Use Value: Automatic CE power-down cuts background memory leakage by >95%, extending vehicle battery life in accessory mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-12TLI | 256K × 16 organization, 12 ns, 3.3 V, 44-pin TSOP II; higher density but wider bus | Requires 16-bit data path redesign; unsuitable for existing 8-bit controller interfaces | Select only if migrating to 16-bit architecture and board layout permits package change |
| ON Semiconductor MC68HC11E9CP | Microcontroller with integrated 512-byte RAM; no external SRAM interface | Not a drop-in replacement; lacks standalone memory functionality and timing control pins | Only viable for greenfield designs where on-chip RAM suffices and no external expansion is needed |
Compared with IS61LV25616AL-12TLI and MC68HC11E9CP, the CY7C1399B-12VXC uniquely provides 8-bit bus compatibility, SOJ footprint, and deterministic 12 ns access in a dedicated SRAM-critical for legacy controller upgrades and space-constrained PCBs.
Availability
CY7C1399B-12VXC is available at Aetrix Electronics and suitable for network interface buffers, industrial PLC data caches, medical imaging frame stores, and automotive infotainment UI buffers requiring stable component supply across commercial temperature range (0°C to +70°C).
Supply support for CY7C1399B-12VXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer electronics.
The CY7C1399B belongs to Cypress's legacy high-speed asynchronous SRAM product line, designed specifically for low-voltage, low-power cache and buffer applications in space- and thermal-constrained embedded systems.
FAQ
Is CY7C1399B-12VXC RoHS-compliant?
Yes. The "X" suffix in CY7C1399B-12VXC explicitly denotes Pb-free (RoHS-compliant) construction per Cypress ordering nomenclature. It uses matte tin lead finish on SOJ leads and meets JEDEC J-STD-020 moisture sensitivity level 3 requirements.
Can CY7C1399B-12VXC operate at 2.5 V?
No. The device is characterized and guaranteed only for 3.3 V ± 300 mV operation. At 2.5 V, timing parameters (e.g., tRC, tPD) and DC specifications (VOH/VOL, VIH/VIL) fall outside datasheet limits, and data retention is not assured below VCC = 2.0 V.
What is the maximum junction temperature for continuous operation?
The absolute maximum junction temperature is +125°C, aligned with its commercial temperature grade (0°C to +70°C ambient). Derating curves in the datasheet confirm reliable operation up to TJ = 110°C with appropriate PCB copper area and airflow.
Does CY7C1399B-12VXC support battery backup for data retention?
Yes. With VCC reduced to ≥2.0 V and CE held HIGH, the device enters data retention mode drawing ≤20 µA (L-version spec), enabling use with coin-cell or supercapacitor backup circuits for nonvolatile storage during main power loss.
CY7C1399B-12VXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-BSOJ (0.300", 7.62mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOJ
CY7C1399B-12VXC FAQ
1.How can I place an order for CY7C1399B-12VXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1399B-12VXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1399B-12VXC reliable?
The price and inventory of CY7C1399B-12VXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1399B-12VXC is usually 5 days.
3.What payment methods are accepted for CY7C1399B-12VXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1399B-12VXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1399B-12VXC?
CY7C1399B-12VXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1399B-12VXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1399B-12VXC?
For technical support, including CY7C1399B-12VXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1399B-12VXC requirements.
6.How does Aetrix verify that CY7C1399B-12VXC is sourced from the original manufacturer or authorized distributors?
All CY7C1399B-12VXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1399B-12VXC meets industry standards.
7.What is the process for return or replacement of CY7C1399B-12VXC?
All CY7C1399B-12VXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1399B-12VXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1399B-12VXC part is unused and in its original packaging.
Return procedure for CY7C1399B-12VXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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