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Infineon Technologies CY7C1399B-12ZXC
- Part No.:
- CY7C1399B-12ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY7C1399B-12ZXC.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,940
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Product details
Overview
CY7C1399B-12ZXC from Cypress Semiconductor is a 256 Kbit (32K × 8) high-speed CMOS static RAM operating at 3.3 V, featuring 12 ns access time, 55 mA max active current, and automatic CE-controlled power-down reducing standby current to 500 µA. It supports low-voltage cache memory in embedded controllers and network interface cards where deterministic timing and TTL/CMOS-compatible control signaling are required.
For engineers reviewing the CY7C1399B-12ZXC datasheet, CY7C1399B-12ZXC pinout, CY7C1399B-12ZXC application, or CY7C1399B-12ZXC equivalent, this device delivers verified 32K × 8 organization, SOJ/TSOP-28 package compatibility, dual-mode write control (CE/WE), and data retention down to 2.0 V - critical for battery-backed SRAM subsystems and industrial control buffers.
Technical Context
The CY7C1399B-12ZXC implements a synchronous, non-volatile-retentive SRAM array with fully decoded 15-bit address space (A0–A14), eight bidirectional I/O lines (I/O0–I/O7), and three independent control inputs: CE (active-low chip enable), OE (active-low output enable), and WE (active-low write enable). Its 6T cell design ensures alpha-particle immunity without refresh circuitry.
Timing behavior is defined by overlapping CE and WE assertions for writes, while reads require CE and OE asserted low with WE high. The device transitions to ultra-low-power mode (<500 µA) within 12 ns of CE deassertion, and maintains data integrity during VCC reduction to 2.0 V in retention mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32,768 × 8) - provides byte-wide data path for microcontroller bus interfaces without external multiplexing. |
| Access Time | 12 ns - guarantees sub-83 MHz read/write cycle compatibility in real-time control loops and packet buffering. |
| VCC Supply | 3.3 V ± 300 mV - compatible with modern low-voltage logic families and eliminates level-shifting in 3.3 V system designs. |
| Active Current | 55 mA max - enables thermal management in dense PCB layouts with ≤216 mW active power dissipation. |
| Standby Current | 500 µA (CMOS input mode) - supports >100-hour battery backup in maintenance-free industrial logging applications. |
| Data Retention VCC | 2.0 V min - allows operation during brown-out conditions or capacitor-based hold-up without data loss. |
| Package | 28-pin TSOP Type I (Z28), Pb-free - meets RoHS compliance and surface-mount reflow requirements for automated assembly. |
Pinout & Package
Package: 28-pin Thin Small Outline Package (TSOP Type I), 8.8 mm × 10.2 mm body, 0.55 mm pitch, Pb-free (RoHS-compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit unidirectional address bus supporting full 32K-word decoding; no internal latching. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristate I/O lines shared for read and write; high-impedance when CE or OE inactive. |
| CE | Chip Enable | Active-low global enable; initiates automatic power-down when high, disabling all outputs and array. |
| OE | Output Enable | Active-low read gate; controls output drivers only - does not affect internal array power state. |
| WE | Write Enable | Active-low write strobe; combined with CE determines write initiation and termination timing. |
| VCC | Power Supply | 3.3 V main supply; decoupling required within 10 mm of pin per layout guidelines. |
| GND | Ground Reference | Dedicated ground pin (Pin 15); must be connected to low-impedance plane to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Low-Voltage Operation | 3.3 V supply enables direct interfacing with ARM Cortex-M, RISC-V SoCs, and FPGA I/O banks without voltage translation. |
| Automatic Power-Down | Reduces ICC to 500 µA when CE is high - eliminates need for external sleep controllers in portable instrumentation. |
| Alpha-Immune 6T Cell | Eliminates soft errors in radiation-prone environments (e.g., medical imaging, avionics edge nodes) without ECC overhead. |
| High-Speed Timing | 12 ns tRC and tAA ensure compatibility with 8051, PIC, and legacy x86 bus cycles running up to 83 MHz. |
| Pb-Free TSOP Packaging | Z28 footprint supports standard reflow profiles (JEDEC J-STD-020D) and eliminates lead contamination risk in medical devices. |
Applications
| Industrial PLC Data Buffer | Network Interface Card Cache |
|---|---|
|
Use Scenario: Storing transient process variables and I/O scan data between CPU polling intervals in modular PLC backplanes. IC Role / Device Role / Timing Role: Byte-wide SRAM buffer with deterministic 12 ns access, synchronized to 10–20 MHz control bus clocks. Use Value: Eliminates wait states during ladder logic execution and supports deterministic scan cycle times under 1 ms. |
Use Scenario: Holding incoming Ethernet frame payloads prior to DMA transfer to host memory in 10/100 Mbps NICs. IC Role / Device Role / Timing Role: Dual-port-capable buffer using CE/OE/WE handshaking to decouple MAC-layer timing from PCI/PCIe bus latency. Use Value: Enables zero-drop frame handling at line rate by absorbing bursty traffic with 32 KB of low-latency storage. |
| Medical Diagnostic Imaging FIFO | Automotive ADAS Sensor Preprocessor |
|
Use Scenario: Capturing raw pixel streams from ultrasound transducer arrays before DSP-based beamforming. IC Role / Device Role / Timing Role: High-reliability SRAM with 2.0 V data retention for fail-safe buffering during brief power interruptions. Use Value: Maintains image continuity across AC line dips, satisfying IEC 62304 Class C safety requirements. |
Use Scenario: Temporarily storing pre-fused radar and camera sensor fusion metadata in Tier-1 ADAS ECUs. IC Role / Device Role / Timing Role: Low-power, temperature-stable (–40°C to +85°C) SRAM for real-time object tracking pipelines. Use Value: Delivers consistent 12 ns latency across automotive temperature range without derating or thermal throttling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-12TLI | 256K × 16 organization, 12 ns access, 3.3 V, 32-pin TSOP; wider data bus but incompatible pinout and address mapping. | Requires PCB redesign and bus-width adaptation; better suited for 16-bit microcontrollers like SH-4 or ColdFire. | Select only if system architecture mandates 16-bit data path and board revision allows footprint change. |
| AS6C4008-12ZIN | 512K × 8 organization, 12 ns, 3.3 V, 28-pin TSOP; higher density but 2× larger die size and 700 µA standby current. | Higher capacity supports longer burst buffering but increases leakage and thermal load in space-constrained modules. | Prefer when future firmware expansion requires >32 KB contiguous RAM and thermal margin permits 15% higher ISB. |
Compared with IS61LV25616AL-12TLI and AS6C4008-12ZIN, the CY7C1399B-12ZXC offers optimal balance of pin-compatible 32K × 8 density, industry-leading 500 µA standby, and proven reliability in commercial/industrial temperature grades - making it the preferred choice for cost-sensitive, thermally constrained, and legacy-bus-compatible designs.
Availability
CY7C1399B-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network interface card caching, and medical diagnostic imaging FIFO applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1399B-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable systems-on-chip for industrial, automotive, and communications markets.
The CY7C1399B belongs to Cypress's legacy high-speed asynchronous SRAM product line, engineered specifically for low-voltage, low-power, and high-reliability embedded memory subsystems in mission-critical equipment.
FAQ
What is the minimum VCC required to retain data in CY7C1399B-12ZXC?
The CY7C1399B-12ZXC guarantees data retention down to 2.0 V on VCC when CE is held high and all inputs are at valid logic levels. This is validated per the L-version specification and applies across the full commercial temperature range (0°C to +70°C). No external backup battery or capacitor is required to maintain contents at this voltage, provided the power-down sequence complies with tCDR = 0 ns timing.
Can CY7C1399B-12ZXC operate with TTL-level control signals?
Yes - the device accepts TTL-compatible input thresholds: VIH ≥ 2.2 V and VIL ≤ 0.8 V, allowing direct connection to 5 V TTL outputs via series resistors or level translators. However, its VCC must remain at 3.3 V; applying 5 V to any pin violates absolute maximum ratings and risks permanent damage.
Does CY7C1399B-12ZXC support concurrent read and write operations?
No - it is a single-port asynchronous SRAM with one shared address/data/control bus. Read and write operations are mutually exclusive and controlled by CE, OE, and WE timing. True concurrent access requires dual-port or QDR SRAM architectures not implemented in this device.
Is the CY7C1399B-12ZXC pinout compatible with CY7C1399B-12VC?
Yes - both share identical 28-pin TSOP (Z28) and SOJ (V21) footprints respectively, and have functionally identical pin assignments. The -12ZXC and -12VC differ only in package type (TSOP vs. SOJ), Pb-free status, and temperature grade (commercial only for ZXC), not pinout or signal mapping.
CY7C1399B-12ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY7C1399B-12ZXC FAQ
1.How can I place an order for CY7C1399B-12ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1399B-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1399B-12ZXC reliable?
The price and inventory of CY7C1399B-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1399B-12ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1399B-12ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1399B-12ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1399B-12ZXC?
CY7C1399B-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1399B-12ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1399B-12ZXC?
For technical support, including CY7C1399B-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1399B-12ZXC requirements.
6.How does Aetrix verify that CY7C1399B-12ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1399B-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1399B-12ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1399B-12ZXC?
All CY7C1399B-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1399B-12ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1399B-12ZXC part is unused and in its original packaging.
Return procedure for CY7C1399B-12ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1399B-12ZXC Tags
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M24C02-WMN6TP
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