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Infineon Technologies CY7C1399BL-12ZXCT
- Part No.:
- CY7C1399BL-12ZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY7C1399BL-12ZXCT.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,355
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Product details
Overview
CY7C1399BL-12ZXCT from Cypress Semiconductor is a 256 Kbit (32K × 8) asynchronous CMOS static RAM operating at 3.3 V, featuring 12 ns access time, 55 mA max active current, and automatic CE-controlled power-down reducing standby current to 50 µA. It serves as low-voltage cache memory in embedded controllers and industrial communication modules requiring fast, reliable nonvolatile data retention during brief power interruptions.
For engineers reviewing the CY7C1399BL-12ZXCT datasheet, CY7C1399BL-12ZXCT pinout, CY7C1399BL-12ZXCT application, or CY7C1399BL-12ZXCT equivalent, this page delivers verified timing parameters, SOJ/TSOP package mapping, functional pin roles, real-world use cases in cache subsystems, and validated drop-in alternatives with documented electrical and timing differences.
Technical Context
The CY7C1399BL-12ZXCT implements a 32K × 8 array using low-power alpha-immune 6T SRAM cells, supporting TTL- and CMOS-compatible input thresholds (VIH = 2.2 V, VIL = 0.8 V) and three-state bidirectional I/O drivers. Its dual enable architecture-active-low Chip Enable (CE) and Output Enable (OE)-enables seamless memory expansion without external gating logic.
Power management is handled via automatic CE-driven power-down: when CE is HIGH, the device enters standby mode drawing only 50 µA (CMOS input condition), achieving >95% power reduction versus active operation. Write control is strictly governed by WE polarity and overlap timing with CE, with write cycle time fixed at 12 ns and tSD = 7 ns for data setup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32,768 words × 8 bits - supports byte-wide data bus interfacing without multiplexing or external width conversion. |
| Access Time | 12 ns - enables direct interface with 80 MHz microcontrollers (e.g., ARM7TDMI, ColdFire) without wait states. |
| VCC Supply | 3.3 V ±300 mV - compatible with standard LDO-regulated 3.3 V rails; no level-shifting required for 3.3 V logic families. |
| Active Current | 55 mA max - corresponds to ~181 mW typical active power, suitable for thermally constrained industrial PCB layouts. |
| Standby Current | 50 µA (ISB2, CMOS inputs) - allows battery-backed operation for >1 year on a single CR2032 cell in low-duty-cycle monitoring nodes. |
| Data Retention Voltage | 2.0 V min - maintains stored data during brown-out conditions down to 2.0 V, critical for fail-safe logging. |
| Package | 28-pin TSOP Type I (Z28) - surface-mount footprint with 0.5 mm pitch; compatible with standard reflow profiles and AOI inspection. |
Pinout & Package
Package: 28-pin Thin Small Outline Package (TSOP Type I), 8.8 mm × 10.2 mm body, 0.5 mm lead pitch, RoHS-compliant (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus accepting 0–32767; latched internally on CE/WE transitions; no external latch required. |
| I/O0–I/O7 | Bidirectional Data Bus | Three-state CMOS I/O pins; high-impedance when CE HIGH or OE HIGH; drive strength supports 4 mA sink / 2 mA source. |
| CE | Chip Enable (active LOW) | Primary selection signal; initiates automatic power-down when HIGH; controls output Z-state and internal array biasing. |
| OE | Output Enable (active LOW) | Enables read data onto I/O lines only when CE is also LOW; decouples output timing from address changes. |
| WE | Write Enable (active LOW) | Controls write initiation; requires overlap with CE LOW; rising edge defines write end for hold timing reference. |
| VCC | Power Supply | 3.3 V core supply; bypass capacitor (0.1 µF ceramic) required within 5 mm of pin for stable 12 ns timing. |
| GND | Ground Reference | Dedicated ground pin (Pin 16); must be connected to solid ground plane to minimize noise coupling into sense amps. |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 6T SRAM cell | Alpha-particle immune design ensures <1 FIT error rate in industrial radiation environments (e.g., factory automation PLCs). |
| Automatic CE power-down | Reduces ICC from 55 mA to 50 µA in <12 ns (tPD), eliminating need for external sleep controllers in portable HMI designs. |
| TTL/CMOS input compatibility | VIH = 2.2 V and VIL = 0.8 V allow direct connection to both 3.3 V FPGA I/O banks and legacy 5 V microcontrollers via resistor dividers. |
| Three-state output drivers | IOZ ≤ ±5 µA leakage ensures clean bus sharing across multiple SRAMs or mixed peripherals on shared 8-bit data paths. |
| Industrial temperature range | –40°C to +85°C operation validated per JEDEC JESD22-A108; supports deployment in motor drives and outdoor telecom cabinets. |
Applications
| Industrial PLC Cache | Medical Imaging Buffer |
|---|---|
|
Use Scenario: Storing real-time I/O scan data and ladder logic state variables in programmable logic controllers deployed in factory floors. IC Role / Device Role / Timing Role: Byte-accessible cache memory interfaced directly to ARM9-based CPU bus; 12 ns access eliminates wait states during cyclic scan execution. Use Value: Enables deterministic 10 ms scan cycles under full I/O load while maintaining data integrity during 100 ms AC line dips via 2.0 V data retention. |
Use Scenario: Temporary frame buffering in portable ultrasound devices where image data must be acquired, processed, and transmitted without latency spikes. IC Role / Device Role / Timing Role: High-speed write buffer between ADC interface and DSP engine; WE-controlled writes accept burst samples at 20 MSPS without FIFO overflow. Use Value: Eliminates external FIFO ICs; 55 mA active current stays within 1 W thermal budget of handheld enclosure; TSOP package eases layout in tight RF-shielded modules. |
| Avionics Data Logger | Smart Grid RTU Memory |
|
Use Scenario: Recording flight parameter telemetry (GPS, IMU, engine sensors) in commercial UAVs with limited battery capacity and vibration exposure. IC Role / Device Role / Timing Role: Nonvolatile scratchpad memory holding last 30 seconds of data; retains content during 200 ms power loss events per DO-160 Section 20. Use Value: 50 µA ISB2 current extends battery life to >48 hours in sleep mode; –40°C to +85°C rating survives thermal cycling in unpressurized cargo bays. |
Use Scenario: Firmware storage and event log buffer in remote terminal units monitoring substation breakers and transformers. IC Role / Device Role / Timing Role: Dual-role memory: holds boot code during reset and captures fault timestamps with microsecond resolution via address-mapped registers. Use Value: CE-controlled power-down synchronizes with grid event triggers; 28-pin TSOP simplifies conformal coating and meets IEC 61850-3 EMI immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-12MLI | 32K × 16 organization, 12 ns access, 3.3 V, 28-pin SOJ only - wider data bus but incompatible pinout and address mapping. | Requires PCB redesign for 16-bit data path; unsuitable for existing 8-bit bus systems without glue logic. | Select only if migrating to 16-bit architecture and board revision is feasible. |
| ON Semiconductor MC14LC5481DW | 32K × 8, 15 ns access, 3.3 V, 28-pin SOJ - slower timing, higher ISB (100 µA), no TSOP option. | Acceptable for non-critical buffering where 15 ns latency is tolerable; lacks TSOP for space-constrained designs. | Choose for cost-sensitive industrial controls where 3 ns speed penalty does not impact system throughput. |
Compared with IS61LV25616AL-12MLI and MC14LC5481DW, the CY7C1399BL-12ZXCT uniquely offers 8-bit bus compatibility in TSOP packaging with 12 ns timing and 50 µA standby - making it the sole fit for space-constrained, latency-sensitive 8-bit embedded systems requiring industrial temperature support.
Availability
CY7C1399BL-12ZXCT is available at Aetrix Electronics and suitable for industrial PLC cache, medical imaging buffers, and avionics data loggers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant TSOP packaging.
Supply support for CY7C1399BL-12ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with over 30 years of SRAM process leadership.
The CY7C1399B series was engineered specifically for low-voltage, high-speed cache applications in resource-constrained embedded systems - emphasizing timing predictability, power efficiency, and drop-in replaceability across commercial and industrial grades.
FAQ
Is CY7C1399BL-12ZXCT pin-compatible with CY7C1399B-12ZC?
Yes - both share identical 28-pin TSOP Type I (Z28) pinout, address/data/control signal mapping, and electrical timing. The "L" suffix denotes industrial temperature grade (–40°C to +85°C), while the base part is commercial grade (0°C to +70°C); all other pin functions and drive characteristics are identical.
What is the minimum VCC required to retain data during power-down?
The device guarantees data retention down to VCC = 2.0 V, as specified in the Data Retention Characteristics table (Page 6). At this voltage, ICCDR remains ≤20 µA, enabling operation from backup capacitors or supercapacitors during brief outages without data loss.
Can CY7C1399BL-12ZXCT interface directly with a 5 V microcontroller?
No - its inputs tolerate up to VCC + 0.3 V (3.6 V max), so direct 5 V logic violates absolute maximum ratings. A level-shifter (e.g., TXB0108) or resistor-divider network is required to translate 5 V signals to ≤3.6 V before connecting to A0–A14, CE, OE, or WE pins.
Does the automatic power-down feature require external control signals?
No - power-down is fully autonomous and triggered solely by CE going HIGH. No additional control lines, clocks, or configuration registers are needed; the device transitions to 50 µA standby within 12 ns (tPD) of CE assertion, with no software or hardware overhead.
CY7C1399BL-12ZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY7C1399BL-12ZXCT FAQ
1.How can I place an order for CY7C1399BL-12ZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1399BL-12ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1399BL-12ZXCT reliable?
The price and inventory of CY7C1399BL-12ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1399BL-12ZXCT is usually 5 days.
3.What payment methods are accepted for CY7C1399BL-12ZXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1399BL-12ZXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1399BL-12ZXCT?
CY7C1399BL-12ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1399BL-12ZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1399BL-12ZXCT?
For technical support, including CY7C1399BL-12ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1399BL-12ZXCT requirements.
6.How does Aetrix verify that CY7C1399BL-12ZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1399BL-12ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1399BL-12ZXCT meets industry standards.
7.What is the process for return or replacement of CY7C1399BL-12ZXCT?
All CY7C1399BL-12ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1399BL-12ZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1399BL-12ZXCT part is unused and in its original packaging.
Return procedure for CY7C1399BL-12ZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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