Infineon Technologies CY7C1399BN-12VXIT

Overview

CY7C1399BN-12VXIT from Cypress Semiconductor is a 256-Kbit (32 K × 8) asynchronous CMOS static RAM with 3.3 V single-supply operation, 12 ns access time, industrial temperature range (–40 °C to +85 °C), and automatic CE-controlled power-down mode. It serves as cache or buffer memory in embedded controllers, network interface cards, and real-time data acquisition systems where low-latency read/write and standby current <5 µA are critical.

For engineers reviewing the CY7C1399BN-12VXIT datasheet, CY7C1399BN-12VXIT pinout, CY7C1399BN-12VXIT application, or CY7C1399BN-12VXIT equivalent, key selection criteria include verified 12 ns tAA/tACE timing, tristate I/O compatibility with 3.3 V logic families, CE/OE/WE control signal behavior under deselected conditions, and TSOP-I package thermal performance in convection-cooled PCB layouts.

Technical Context

The CY7C1399BN-12VXIT implements a fully decoded 32 K × 8 memory array using alpha-immune 6T SRAM cells, supporting asynchronous random-access reads and writes without clocking. Its dual active-Low enable architecture-CE for chip selection and OE for output gating-enables seamless memory expansion in multi-chip configurations.

Power management relies on automatic CE-driven power-down: when CE is HIGH, ICC drops to ≤5 µA (industrial grade) regardless of address or data bus activity, and outputs enter high-impedance state. Write operations require simultaneous LOW CE and LOW WE; read operations require LOW CE and LOW OE while WE remains HIGH.

Key Specifications

Pinout & Package

The CY7C1399BN-12VXIT is housed in a 28-pin Thin Small Outline Package (TSOP-I), 300-mil body width, lead pitch 0.55 mm, compliant with JEDEC MO-141BA. Pin 1 is marked by a beveled corner; package is Pb-free and RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Compared with AS6C4008-12IN and IS61LV25616AL-12MLI, the CY7C1399BN-12VXIT uniquely combines industrial/automotive-A temperature support, true 8-bit bus interface, and sub-5 µA standby current-making it optimal for space-constrained, reliability-critical embedded systems requiring minimal BOM changes.

Availability

CY7C1399BN-12VXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, network interface card caches, and automotive infotainment boot shadowing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1399BN-12VXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with headquarters in San Jose, CA.

The CY7C1399BN belongs to Cypress's legacy asynchronous SRAM product line, engineered specifically for low-voltage, low-power, high-speed buffering in resource-constrained embedded systems where deterministic timing and data retention under brown-out are mandatory.

FAQ

What is the maximum clock frequency supported by CY7C1399BN-12VXIT?

The CY7C1399BN-12VXIT is an asynchronous SRAM and does not use a clock signal. Its maximum operational speed is defined by access time: 12 ns tAA and tACE specify the minimum interval between address assertion and valid data output. This supports effective interface rates up to approximately 83 MHz in ideal conditions, assuming no bus turnaround or setup/hold overhead.

Does CY7C1399BN-12VXIT require external pull-up resistors on control lines?

No external pull-ups are required on CE, OE, or WE. These inputs meet TTL-compatible thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V) and have ≤1 µA leakage. However, floating control lines must be avoided-firmly tie unused lines to VCC or GND via PCB traces or FPGA I/O defaults to prevent metastability or unintended power-down activation.

Can CY7C1399BN-12VXIT operate reliably at 3.0 V VCC?

Per Electrical Characteristics table, CY7C1399BN-12VXIT is specified for 3.3 V ± 300 mV (i.e., 3.0 V to 3.6 V). At 3.0 V, all AC and DC parameters-including 12 ns access time, VOL ≤ 0.4 V, and ISB1 ≤5 µA-remain guaranteed across the full industrial temperature range, provided board-level decoupling meets datasheet recommendations.

Is the TSOP-I package of CY7C1399BN-12VXIT compatible with standard reflow soldering profiles?

Yes-the 28-pin TSOP-I package is rated for Pb-free reflow per JEDEC J-STD-020. Peak temperature must not exceed 260 °C for ≤60 seconds, with ramp-up ≤3 °C/s and ramp-down ≤6 °C/s. Thermal mass considerations require preheating to 150 °C for ≥90 s before soak, and the package's moisture sensitivity level is MSL-3, requiring dry-pack handling if exposed >168 hours at ambient.