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Infineon Technologies CY7C1399BN-12ZXC

Part No.:
CY7C1399BN-12ZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
28-TSSOP (0.465", 11.80mm Width)
Datasheet:
AetrixCY7C1399BN-12ZXC.pdf
Description:
IC SRAM 256KBIT PAR 28TSOP I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,905

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Product details

Overview

CY7C1399BN-12ZXC from Cypress Semiconductor is a 256-Kbit (32 K × 8) asynchronous CMOS static RAM with 3.3 V single-supply operation, 12 ns access time, industrial temperature range (–40 °C to +85 °C), and automatic CE-controlled power-down mode. It serves as cache or buffer memory in embedded controllers, FPGA configuration storage, and real-time data logging systems where deterministic timing and low standby current are critical.

For engineers reviewing the CY7C1399BN-12ZXC datasheet, CY7C1399BN-12ZXC pinout, CY7C1399BN-12ZXC application, or CY7C1399BN-12ZXC equivalent, key selection criteria include its 12 ns read cycle time, 55 mA max active current, 500 µA CMOS standby current at industrial temp, tristate I/O drivers, and dual-package availability in TSOP-I and SOJ.

Technical Context

The CY7C1399BN-12ZXC implements a full 32 K × 8 asynchronous SRAM array using alpha-immune 6T cell technology, enabling reliable operation in industrial environments. Its control logic relies on three independent active-low enables: Chip Enable (CE), Output Enable (OE), and Write Enable (WE), allowing flexible bus interfacing without external gating.

Timing behavior is defined by overlapping CE/WE assertions for writes and CE/OE co-assertion for reads, with guaranteed tRC = 12 ns, tAA = 12 ns, and tPD = 15 ns power-down entry. The device enters automatic low-power mode when CE is deasserted, reducing ICC to ≤500 µA under CMOS input conditions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization32,768 × 8 bits - supports byte-wide data buses without address decoding overhead
Access Time (tAA)12 ns - enables direct interface with 80 MHz microcontrollers without wait states
VCC Supply3.3 V ±300 mV - compatible with modern low-voltage logic families and LDO-regulated systems
Standby Current (ISB2)500 µA max (industrial) - reduces system-level quiescent power in always-on edge nodes
Operating Temperature–40 °C to +85 °C - qualified for industrial control and automotive-A applications
Package Type28-pin TSOP-I (ZXC suffix) - surface-mount, JEDEC-standard footprint for automated assembly
Output DriveTristate I/O (I/O0–I/O7) - allows shared bus topology with multiple peripherals

Pinout & Package

The CY7C1399BN-12ZXC is packaged in a 28-pin Thin Small Outline Package (TSOP-I), 300-mil width, lead-free (RoHS-compliant) construction. Pin numbering follows standard JEDEC top-view orientation with pin 1 marked by a notch or dot.

Pin/TerminalCircuit RoleDesign Meaning
A0–A14Address Inputs15-bit address bus supporting full 32 K-word addressing; no internal latching
I/O0–I/O7Bidirectional Data BusCMOS-compatible tristate I/O pins; high-impedance when CE or OE inactive
CEChip EnableActive-low global enable; initiates automatic power-down when HIGH
OEOutput EnableActive-low output gate; controls data assertion onto I/O lines during reads
WEWrite EnableActive-low write control; determines direction of data flow on I/O bus
VCCPower Supply+3.3 V supply pin; requires local 0.1 µF ceramic decoupling
GNDGround ReferenceSignal and power ground; must be low-inductance connection to minimize noise

Key Features

FeatureDesign Value
Alpha-immune 6T cellEnsures data retention integrity in radiation-prone industrial environments without refresh circuitry
Automatic CE power-downReduces ICC to ≤500 µA without external control logic or sleep-mode software intervention
12 ns access timeSupports zero-wait-state operation with ARM Cortex-M4/M7 and RISC-V cores running at ≤80 MHz
3.3 V only operationEliminates level-shifting requirements in modern mixed-signal SoC subsystems
TSOP-I and SOJ package optionsEnables footprint compatibility across legacy (SOJ) and high-density (TSOP-I) PCB layouts

Applications

Industrial PLC Data BufferFPGA Configuration Storage

Use Scenario: Storing real-time I/O scan data between PLC CPU cycles with deterministic latency.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer providing sub-12 ns read/write turnaround for cyclic data exchange.

Use Value: Eliminates DMA arbitration delays and guarantees consistent 12 ns access across all 32 K addresses.

Use Scenario: Holding partial reconfiguration bitstreams for Xilinx Artix-7 or Intel Cyclone V FPGAs.

IC Role / Device Role / Timing Role: Byte-accessible nonvolatile shadow memory for fast bitstream loading during dynamic reconfiguration.

Use Value: Enables <100 µs reconfiguration latency using parallel 8-bit load path, avoiding serial PROM bottlenecks.

Automotive ADAS Sensor HubMedical Imaging Frame Buffer

Use Scenario: Temporarily caching raw radar point-cloud data before DSP preprocessing in AEC-Q100 qualified modules.

IC Role / Device Role / Timing Role: High-reliability SRAM operating at –40 °C to +85 °C with automatic power gating during sensor idle periods.

Use Value: Achieves 95% power reduction in standby via CE-driven auto-down mode, extending module battery life.

Use Scenario: Capturing full-resolution ultrasound frames (1024 × 768 × 8-bit) at 30 fps for real-time display buffering.

IC Role / Device Role / Timing Role: Low-latency frame store interfaced directly to image processor AXI bus via glueless 8-bit data path.

Use Value: Delivers sustained 83 MB/s read bandwidth (12 ns × 8 bits) required for uninterrupted video streaming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISSI IS61LV25616AL-12TLI16-bit bus (256K × 16), 12 ns, 3.3 V; higher density but wider interfaceRequires 16-bit data path redesign; not drop-in for 8-bit systemsSelect only if upgrading bus width and requiring >256 Kbytes without banking
Renesas R1LV25616AS-12SISame 32K × 8 organization, 12 ns, 3.3 V; TSOP-I package; lower ISB2 (300 µA)Identical pinout and timing; validated for extended temperature (–40 °C to +105 °C)Preferred for new designs needing extended temp margin and slightly lower standby current

Compared with IS61LV25616AL-12TLI, the CY7C1399BN-12ZXC avoids bus-width redesign overhead; versus R1LV25616AS-12SI, it trades 200 µA higher standby current for broader legacy design support and Cypress's long-term industrial supply commitment.

Availability

CY7C1399BN-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, FPGA configuration storage, and automotive ADAS sensor hubs requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for CY7C1399BN-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip (PSoC), memory, and USB solutions for industrial, automotive, and consumer applications.

The CY7C1399BN belongs to Cypress's legacy high-speed asynchronous SRAM product line, designed specifically for low-latency, low-voltage embedded memory applications where predictability and reliability outweigh density scaling.

FAQ

What is the maximum clock frequency supported by CY7C1399BN-12ZXC?

The CY7C1399BN-12ZXC is an asynchronous SRAM and does not use a clock signal. Its performance is governed by access time (tAA = 12 ns) and cycle time (tRC = 12 ns), enabling reliable operation with microcontrollers or FPGAs running up to 80 MHz on the address/data bus without synchronization logic.

Does CY7C1399BN-12ZXC require external refresh circuitry?

No. As a static RAM, the CY7C1399BN-12ZXC retains data indefinitely while powered and enabled, with no refresh cycles needed. Its alpha-immune 6T cell design ensures data integrity without periodic access, unlike DRAM or pseudo-SRAM devices.

Can CY7C1399BN-12ZXC operate at 2.5 V?

No. The device is specified exclusively for 3.3 V ±300 mV operation (3.0 V to 3.6 V). Operation below 3.0 V violates the Absolute Maximum Ratings and may result in data corruption, timing violations, or failure to enter power-down mode reliably.

Is the ZXC suffix indicative of RoHS compliance?

Yes. The "ZXC" suffix denotes a lead-free, RoHS-compliant 28-pin TSOP-I package per Cypress ordering nomenclature. This includes matte tin lead finish and halogen-free molding compound, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).

CY7C1399BN-12ZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
28-TSSOP (0.465", 11.80mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
256Kbit
Memory Organization:
32K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSOP I

CY7C1399BN-12ZXC FAQ

1.How can I place an order for CY7C1399BN-12ZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1399BN-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1399BN-12ZXC reliable?

The price and inventory of CY7C1399BN-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1399BN-12ZXC is usually 5 days.

3.What payment methods are accepted for CY7C1399BN-12ZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1399BN-12ZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1399BN-12ZXC?

CY7C1399BN-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1399BN-12ZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1399BN-12ZXC?

For technical support, including CY7C1399BN-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1399BN-12ZXC requirements.

6.How does Aetrix verify that CY7C1399BN-12ZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1399BN-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1399BN-12ZXC meets industry standards.

7.What is the process for return or replacement of CY7C1399BN-12ZXC?

All CY7C1399BN-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1399BN-12ZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1399BN-12ZXC part is unused and in its original packaging.

Return procedure for CY7C1399BN-12ZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1399BN-12ZXC Tags

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