Infineon Technologies CY7C1399BN-20ZXCT
- Part No.:
- CY7C1399BN-20ZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY7C1399BN-20ZXCT.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:1,995
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Product details
Overview
CY7C1399BN-20ZXCT from Cypress Semiconductor is a 256K (32K × 8) high-speed CMOS static RAM operating at 3.3 V, with 20 ns maximum access time, 45 mA max operating current, and automatic CE-controlled power-down reducing standby current to 500 µA (industrial range). It serves as low-voltage cache memory in embedded controllers and industrial communication modules requiring deterministic read/write timing and alpha-particle immunity.
For engineers reviewing the CY7C1399BN-20ZXCT datasheet, CY7C1399BN-20ZXCT pinout, CY7C1399BN-20ZXCT application, or CY7C1399BN-20ZXCT equivalent, this page delivers verified package mapping (28-pin TSOP I), functional pin roles, real-world timing constraints (tRC = 20 ns, tDOE = 7 ns), and validated alternatives for SRAM replacement in space-constrained, low-power systems.
Technical Context
The CY7C1399BN-20ZXCT implements a 32K × 8 asynchronous SRAM architecture with TTL/CMOS-compatible control inputs (CE̅, OE̅, WE̅), tri-state bidirectional I/Os, and an alpha-immune 6T memory cell. Its automatic power-down activates when CE̅ is HIGH, dropping ICC to ≤500 µA without external logic.
It supports three distinct write cycles-WE-controlled, CE-controlled, and WE-controlled with OE̅ LOW-with guaranteed setup/hold times referenced to signal edges that terminate writes. All timing parameters are specified at VCC = 3.3 V ±300 mV and CL = 30 pF, with input transition times ≤3 ns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32,768 words × 8 bits - matches 8-bit microcontroller data bus width without glue logic |
| Access Time (tRC) | 20 ns - defines minimum cycle time for burst reads in real-time control loops |
| VCC Supply | 3.3 V ±300 mV - compatible with modern low-voltage FPGA and MCU I/O domains |
| Operating Current (ICC) | 45 mA max - enables thermal design for dense PCB layouts with ≤180 mW active power |
| Standby Current (ISB2) | 500 µA (industrial) - sustains battery-backed operation for >1 year on coin-cell supply |
| Data Retention Voltage | 2.0 V min - allows graceful shutdown during brown-out events while preserving RAM contents |
| Input/Output Capacitance | CIN ≤ 6 pF, COUT ≤ 6 pF - minimizes signal integrity degradation on high-speed address/data buses |
Pinout & Package
Package: 28-pin TSOP Type I (8 mm × 13.4 mm), Pb-free, RoHS-compliant, JEDEC MO-153 variant (package code 51-85071).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus supporting full 32K-word decoding; no external address latching required |
| I/O0–I/O7 | Bidirectional Data Bus | Tri-state outputs disable automatically when CE̅ or OE̅ is HIGH; no bus contention risk |
| CE̅ | Chip Enable (active LOW) | Primary enable for automatic power-down; drives ISB2 = 500 µA when HIGH in industrial temp |
| OE̅ | Output Enable (active LOW) | Controls output buffer only; does not affect internal memory state or power mode |
| WE̅ | Write Enable (active LOW) | Determines write initiation/termination; write completes on first rising edge of CE̅ or WE̅ |
| VCC | Power Supply | 3.3 V core supply; decoupling required within 10 mm due to 45 mA dynamic current spikes |
| GND | Ground Reference | Single ground pin (Pin 13); requires low-inductance connection to minimize switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Low-power alpha immune 6T cell | Eliminates need for periodic refresh or EDAC in radiation-prone industrial environments |
| Automatic CE̅ power-down | Reduces power consumption by >95% vs active mode without external control circuitry |
| Tri-state I/O with independent OE̅/WE̅ control | Enables seamless integration into shared data buses with multiple masters or peripherals |
| Pb-free TSOP I packaging | Meets IPC/JEDEC J-STD-020D reflow profiles; compatible with lead-free SMT assembly lines |
| Industrial temperature support | Guaranteed operation from –40°C to +85°C with no derating of timing or voltage specs |
Applications
| Industrial PLC Memory Buffer | Automotive Telematics Cache |
|---|---|
|
Use Scenario: Stores real-time I/O scan data and firmware patch buffers in programmable logic controllers with deterministic 20 ns read latency. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state access to dual-port-capable microcontrollers during cyclic execution. Use Value: Enables sub-millisecond response to fieldbus interrupts without DRAM refresh overhead or latency jitter. |
Use Scenario: Holds GPS position history and CAN message queue metadata in automotive telematics control units operating across –40°C to +85°C. IC Role / Device Role / Timing Role: Nonvolatile-cached SRAM retaining critical session data during ignition cycling and brown-out events down to 2.0 V. Use Value: Prevents loss of last-known location and diagnostic event logs during vehicle power transitions. |
| Medical Imaging Frame Buffer | Network Switch Packet Metadata Store |
|
Use Scenario: Buffers uncompressed ultrasound frame headers and timestamp metadata in portable imaging devices with strict EMI limits. IC Role / Device Role / Timing Role: Low-noise, low-capacitance SRAM minimizing crosstalk on analog-front-end PCB sections adjacent to sensitive ADC traces. Use Value: Maintains SNR >72 dB in 12-bit medical imaging paths by limiting I/O switching current to 45 mA peak. |
Use Scenario: Stores packet classification rules and port forwarding tables in Layer 2/L3 Ethernet switches with line-rate forwarding requirements. IC Role / Device Role / Timing Role: High-reliability SRAM delivering deterministic 20 ns read cycles to match 100 Mbps MAC timing budgets. Use Value: Eliminates packet drop during sustained broadcast storms by avoiding DRAM refresh stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-20TQLI | 32K × 16 organization, 20 ns access, 3.3 V; higher density but wider bus | Requires 16-bit data path; incompatible with 8-bit microcontrollers without byte masking logic | Select only if system uses 16-bit bus and needs double the word depth per access |
| Renesas R1EX24064ASAS0I#U0 | 64K × 8, 25 ns access, 3.3 V; larger capacity but slower timing and different pinout | Pin 1 = VCC (vs Pin 1 = GND on CY7C1399BN); requires PCB redesign and layout verification | Choose only when capacity >256K is mandatory and 5 ns timing margin is acceptable |
Compared with IS61LV25616AL-20TQLI and R1EX24064ASAS0I#U0, the CY7C1399BN-20ZXCT offers exact 32K × 8 alignment with legacy 8-bit designs, TSOP I pin compatibility, and proven industrial temperature reliability without bus-width or footprint conversion.
Availability
CY7C1399BN-20ZXCT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive telematics cache, and medical imaging frame buffers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1399BN-20ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications systems, emphasizing signal integrity and long-term supply stability.
The CY7C1399BN belongs to Cypress's legacy asynchronous SRAM product line, engineered specifically for deterministic, low-latency data buffering in resource-constrained embedded systems where DRAM complexity or flash write latency is unacceptable.
FAQ
What is the minimum VCC required to retain data in CY7C1399BN-20ZXCT?
Data retention is guaranteed down to VCC = 2.0 V under industrial temperature conditions, with retention current ≤20 µA. This allows safe operation during brown-out events where main supply drops below nominal 3.3 V but remains above 2.0 V, preserving RAM contents without external backup capacitors.
Does CY7C1399BN-20ZXCT require external pull-up resistors on control pins?
No external pull-ups are required: CE̅, OE̅, and WE̅ have TTL/CMOS-compatible input thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V) and ≤1 µA input leakage. Direct connection to FPGA or MCU GPIOs suffices; pull-ups would increase standby current and violate ISB2 spec of 500 µA.
Can CY7C1399BN-20ZXCT be used in place of CY7C1399BN-20ZC?
Yes - CY7C1399BN-20ZXCT is the Pb-free (RoHS-compliant) version of CY7C1399BN-20ZC, sharing identical electrical specifications, timing, pinout, and thermal characteristics. The 'X' suffix denotes lead-free finish; both use the same 28-pin TSOP I package (51-85071) and operate across –40°C to +85°C.
What is the maximum clock frequency supported for burst reads using CY7C1399BN-20ZXCT?
The device is asynchronous and has no clock input; burst read speed is limited by tRC = 20 ns, enabling up to 50 MHz continuous read cycles. Address changes must meet tAA = 20 ns and tOHA = 3 ns hold requirements; no internal clock or PLL is involved.
CY7C1399BN-20ZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY7C1399BN-20ZXCT FAQ
1.How can I place an order for CY7C1399BN-20ZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1399BN-20ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1399BN-20ZXCT reliable?
The price and inventory of CY7C1399BN-20ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1399BN-20ZXCT is usually 5 days.
3.What payment methods are accepted for CY7C1399BN-20ZXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1399BN-20ZXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1399BN-20ZXCT?
CY7C1399BN-20ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1399BN-20ZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1399BN-20ZXCT?
For technical support, including CY7C1399BN-20ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1399BN-20ZXCT requirements.
6.How does Aetrix verify that CY7C1399BN-20ZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1399BN-20ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1399BN-20ZXCT meets industry standards.
7.What is the process for return or replacement of CY7C1399BN-20ZXCT?
All CY7C1399BN-20ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1399BN-20ZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1399BN-20ZXCT part is unused and in its original packaging.
Return procedure for CY7C1399BN-20ZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1399BN-20ZXCT Tags

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Microchip Technology

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