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Infineon Technologies CY7C1399BNL-12ZXC

Part No.:
CY7C1399BNL-12ZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
28-TSSOP (0.465", 11.80mm Width)
Datasheet:
AetrixCY7C1399BNL-12ZXC.pdf
Description:
IC SRAM 256KBIT PAR 28TSOP I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,048

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Product details

Overview

CY7C1399BNL-12ZXC from Cypress Semiconductor is a 256-Kbit (32 K × 8) asynchronous CMOS static RAM with single 3.3 V supply, 12 ns access time, industrial temperature range (–40 °C to +85 °C), and automatic CE-controlled power-down mode. It serves as cache or buffer memory in embedded controllers, FPGA configuration storage, and real-time data logging systems where deterministic timing and low standby current are critical.

For engineers reviewing the CY7C1399BNL-12ZXC datasheet, CY7C1399BNL-12ZXC pinout, CY7C1399BNL-12ZXC application, or CY7C1399BNL-12ZXC equivalent, key selection criteria include access time consistency across temperature, tristate I/O behavior under OE/CE control, retention voltage margin at 2.0 V, and compatibility with 28-pin TSOP-I footprint for board-level replacement.

Technical Context

The CY7C1399BNL-12ZXC implements a fully asynchronous SRAM architecture with independent address decoding, 6T alpha-immune memory cells, and dual active-Low control signals (CE, OE) enabling seamless memory expansion. Its read cycle is initiated by CE and OE both LOW while WE is HIGH, with data valid within 12 ns of address stabilization or CE assertion.

Write operation requires simultaneous CE and WE LOW; termination occurs on the first rising edge of either signal. Output drivers enter high-impedance state when CE is HIGH or OE is HIGH, and automatic power-down reduces ICC to ≤5 µA (CMOS inputs) or ≤5 mA (TTL inputs) during deselect.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size32 K × 8 = 256 Kbit; supports byte-wide data bus without external multiplexing
Access Time12 ns max; guarantees deterministic read latency for real-time interrupt handlers
Supply Voltage3.3 V ±300 mV; compatible with modern low-voltage logic families and LDO outputs
Operating Temp–40 °C to +85 °C; qualified for industrial control and automotive-A environments
Standby Current≤5 µA (CMOS inputs); enables battery-backed retention in sleep modes
Data Retention VCC2.0 V min; maintains stored data during brown-out or backup power transitions
I/O Drive StrengthIOH = –2.0 mA, IOL = 4.0 mA; ensures noise margin with 30 pF load and 3 ns edge rates

Pinout & Package

Package: 28-pin TSOP-I (Type I), 8.1 mm × 13.4 mm body, 0.5 mm pitch, lead-free (RoHS-compliant).

Pin/TerminalCircuit RoleDesign Meaning
A0–A14Address Inputs15-bit address bus; selects one of 32,768 locations; no internal latching
I/O0–I/O7Bidirectional Data BusHigh-impedance when CE HIGH or OE HIGH; driven only during valid read/write cycles
CEChip Enable (active LOW)Primary device select; initiates automatic power-down when HIGH
OEOutput Enable (active LOW)Controls output driver enable; does not affect internal memory state
WEWrite Enable (active LOW)Controls direction of I/O bus; LOW enables write, HIGH enables read
VCCPower Supply3.3 V supply pin; decoupling required within 10 mm of pin per layout guidelines
GNDGround ReferenceSignal and power return; separate ground plane recommended for noise immunity

Key Features

FeatureDesign Value
Low-power 6T cellAlpha-particle immune design ensures data integrity in radiation-prone environments like industrial automation
Automatic CE power-downReduces ICC to ≤5 µA without external control logic or clock gating
Tristate-compatible I/OSimultaneous OE/CE/WE control eliminates bus contention in multi-device systems
TSOP-I and SOJ package options28-pin footprint allows drop-in replacement between surface-mount and through-hole assembly lines
Single 3.3 V supplyEliminates need for dual-rail regulators or level shifters in 3.3 V system designs

Applications

FPGA Configuration StorageIndustrial PLC Data Buffer

Use Scenario: Stores bitstream for Xilinx Spartan or Intel MAX II FPGAs during cold boot or reconfiguration.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding configuration data; accessed sequentially at startup with strict tAA ≤12 ns timing.

Use Value: Eliminates reliance on external serial PROMs and reduces boot time by enabling parallel loading.

Use Scenario: Buffers sensor readings from analog input modules before batch transmission to HMI or SCADA.

IC Role / Device Role / Timing Role: High-speed scratchpad memory; supports burst writes at 83 MHz effective rate via CE/OE strobing.

Use Value: Prevents data loss during transient communication outages with guaranteed 2.0 V retention voltage.

Automotive Infotainment UI CacheMedical Device Real-Time Log

Use Scenario: Caches GUI assets (icons, fonts, menu trees) in head-unit displays operating across –40 °C to +85 °C.

IC Role / Device Role / Timing Role: Low-latency display memory; interfaces directly to ARM Cortex-A53 AXI bus via glueless 8-bit interface.

Use Value: Maintains UI responsiveness under thermal stress with <5 µA ISB2 standby current at full temperature range.

Use Scenario: Captures ECG waveform samples at 1 kHz for 30-second emergency buffer in portable monitors.

IC Role / Device Role / Timing Role: Deterministic write buffer; accepts back-to-back writes with tWC = 12 ns and tSD = 7 ns setup.

Use Value: Ensures zero-data-loss recording during power fail events using 2.0 V data retention mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV25616AL-12TQLI32 K × 16 organization, 12 ns access, 3.3 V, 44-pin TSOP-IIWider data bus requires PCB redesign; higher density but incompatible pinoutSelect only if system requires 16-bit data path and board revision is feasible
AS6C4008-12ZIN512 Kbit (64 K × 8), 12 ns, 3.3 V, 28-pin TSOP-I, higher ICC active current (70 mA)Same footprint and voltage; larger capacity suits extended buffer needsPrefer when >256 Kbit capacity is needed and active power budget allows +15 mA

Compared with IS61LV25616AL-12TQLI and AS6C4008-12ZIN, the CY7C1399BNL-12ZXC offers exact 28-pin TSOP-I compatibility, lowest standby current (≤5 µA), and proven industrial temperature reliability - making it optimal for footprint-constrained, low-power, drop-in replacements.

Availability

CY7C1399BNL-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, FPGA configuration storage, and automotive infotainment UI caching requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1399BNL-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.

The CY7C1399BN series targets cost-sensitive, low-power embedded systems needing deterministic SRAM performance without complex power sequencing or external refresh circuitry.

FAQ

What is the minimum VCC required to retain data in CY7C1399BNL-12ZXC?

The device guarantees data retention down to VCC = 2.0 V, as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤20 µA, and no external hold signal is needed - retention is automatic upon CE deassertion and VCC decay below operational threshold.

Does CY7C1399BNL-12ZXC require an external clock or refresh circuit?

No. It is a fully static RAM with no clock input and zero refresh requirement. Internal 6T cells retain data indefinitely as long as VCC ≥2.0 V and CE is held HIGH during retention mode. All timing is asynchronous and controlled solely by CE, OE, and WE edges.

Can CY7C1399BNL-12ZXC be used with 5 V logic interfaces?

No. Its absolute maximum input voltage is VCC + 0.5 V, and VCC is strictly 3.3 V ±300 mV. Direct connection to 5 V buses risks permanent damage. Level translation (e.g., TXB0108) is mandatory for mixed-voltage systems.

What is the difference between ISB1 and ISB2 standby current specifications?

ISB1 applies when inputs use TTL thresholds (VIH ≥2.0 V), yielding ≤5 mA typical. ISB2 applies under CMOS thresholds (VIH ≥VCC – 0.3 V), yielding ≤5 µA typical. Designers must match input driver types to the appropriate spec - CMOS drivers achieve 1000× lower standby power.

CY7C1399BNL-12ZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
28-TSSOP (0.465", 11.80mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
256Kbit
Memory Organization:
32K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSOP I

CY7C1399BNL-12ZXC FAQ

1.How can I place an order for CY7C1399BNL-12ZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1399BNL-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1399BNL-12ZXC reliable?

The price and inventory of CY7C1399BNL-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1399BNL-12ZXC is usually 5 days.

3.What payment methods are accepted for CY7C1399BNL-12ZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1399BNL-12ZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1399BNL-12ZXC?

CY7C1399BNL-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1399BNL-12ZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1399BNL-12ZXC?

For technical support, including CY7C1399BNL-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1399BNL-12ZXC requirements.

6.How does Aetrix verify that CY7C1399BNL-12ZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1399BNL-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1399BNL-12ZXC meets industry standards.

7.What is the process for return or replacement of CY7C1399BNL-12ZXC?

All CY7C1399BNL-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1399BNL-12ZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1399BNL-12ZXC part is unused and in its original packaging.

Return procedure for CY7C1399BNL-12ZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1399BNL-12ZXC Tags

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