Infineon Technologies CY7C1399BNL-15ZXC
- Part No.:
- CY7C1399BNL-15ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY7C1399BNL-15ZXC.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:2,212
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1399BNL-15ZXC from Cypress Semiconductor is a 256K (32K × 8) high-speed CMOS static RAM operating at 3.3 V, with 15 ns maximum access time, industrial temperature range (–40°C to +85°C), and automatic CE-controlled power-down mode reducing standby current to 500 µA. It serves as low-voltage cache or buffer memory in embedded controllers and real-time data acquisition systems.
For engineers reviewing the CY7C1399BNL-15ZXC datasheet, CY7C1399BNL-15ZXC pinout, CY7C1399BNL-15ZXC application, or CY7C1399BNL-15ZXC equivalent, key selection criteria include access timing consistency across temperature, TTL/CMOS input compatibility, tri-state I/O behavior during deselection, and Pb-free TSOP I package suitability for space-constrained PCB layouts.
Technical Context
The CY7C1399BNL-15ZXC implements a 32K × 8 asynchronous SRAM array using alpha-immune 6T cells, supporting independent read/write control via active-low CE, OE, and WE signals. Its dual power-down modes-TTL- and CMOS-input variants-enable sub-1 mA standby current under industrial conditions.
Timing is defined by overlapping CE and WE assertions for write cycles, with address-to-data valid (tAA) and read cycle time (tRC) both guaranteed ≤15 ns. Output enable delay (tDOE = 6 ns) and high-impedance transition times (tHZOE = 6 ns, tHZCE = 7 ns) ensure clean bus sharing in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32,768 words × 8 bits - supports byte-wide data paths without external demultiplexing |
| Access Time (tRC / tAA) | 15 ns max - enables interface with 66 MHz microcontrollers without wait states |
| VCC Supply | 3.3 V ±300 mV - compatible with standard LVTTL and LVCMOS I/O domains |
| Standby Current (ISB2) | 500 µA max (industrial) - allows >10-year battery-backed retention in low-power modes |
| Operating Temperature | –40°C to +85°C - qualified for industrial control and automotive-A environments |
| Package | 28-pin TSOP I (8 × 13.4 mm) - surface-mount compatible with automated reflow assembly |
| Input Voltage Range | –0.3 V to VCC + 0.3 V - ensures robust noise margin against ground bounce and crosstalk |
Pinout & Package
Package: 28-pin Thin Small Outline Package Type I (TSOP I), 8 mm × 13.4 mm body, 0.55 mm pitch, Pb-free termination.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus accepting 0–32,767 row/column decode for full 32K word access |
| I/O0–I/O7 | Bidirectional Data Bus | Tri-state CMOS I/O pins shared for read output and write input; high-impedance when CE or OE inactive |
| CE | Chip Enable (active LOW) | Primary device select; initiates automatic power-down when HIGH, disabling internal logic and outputs |
| OE | Output Enable (active LOW) | Controls output drivers only; does not affect internal memory state or power consumption |
| WE | Write Enable (active LOW) | Controls direction of I/O pins and initiates write cycle when CE is also LOW |
| VCC | Power Supply | 3.3 V core supply; decoupling capacitor required within 10 mm of pin per layout guidelines |
| GND | Ground Reference | Dedicated ground pin (Pin 16); must be connected to low-impedance PCB plane for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Low-power alpha immune 6T cell | Enables reliable operation in radiation-prone industrial environments without soft error correction overhead |
| Automatic CE power-down | Reduces ICC to ≤500 µA without external control logic-simplifies power management in always-on systems |
| Tri-state outputs with fast Z-state transitions | tHZOE = 6 ns and tLZOE = 0 ns allow glitch-free bus arbitration in multi-SRAM configurations |
| Pb-free TSOP I packaging | Meets RoHS Directive 2011/65/EU and JEDEC MO-153 standards for lead-free solder reflow compatibility |
| Industrial and Automotive-A qualification | Validated across –40°C to +85°C with full AC/DC parametric testing per AEC-Q100 stress requirements |
Applications
| Industrial PLC Data Buffer | Automotive Engine Control Unit Cache |
|---|---|
Use Scenario: Storing real-time sensor fusion results and actuator command queues in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM providing zero-wait-state access to volatile working memory for cyclic executive tasks. Use Value: 15 ns tRC ensures full 32K buffer read/write completion within one 100 µs PLC scan interval, eliminating pipeline stalls. |
Use Scenario: Holding transient calibration tables and misfire detection history in engine control modules where ECU firmware executes on 40–66 MHz MCUs. IC Role / Device Role / Timing Role: Nonvolatile-cached SRAM interfaced directly to MCU data bus for low-latency lookup table access during combustion timing calculations. Use Value: Industrial-grade temperature tolerance and 500 µA ISB2 support continuous operation during cold cranking (–40°C) without brown-out recovery delays. |
| Medical Diagnostic Imaging FIFO | Networking Packet Buffer |
Use Scenario: Acting as line-scan FIFO between analog front-end ADCs and digital post-processing ASICs in portable ultrasound systems. IC Role / Device Role / Timing Role: High-reliability SRAM buffering burst-mode pixel streams with strict setup/hold timing enforced by tSD = 8 ns and tHD = 0 ns. Use Value: Tri-state I/O and tHZWE = 7 ns prevent bus contention during concurrent DMA transfers, ensuring pixel data coherency. |
Use Scenario: Temporary storage for Ethernet frame payloads in industrial gateways handling Modbus TCP and PROFINET traffic. IC Role / Device Role / Timing Role: Shared-memory packet buffer accessed by dual-port MAC controller and ARM-based application processor via time-multiplexed bus. Use Value: CE-controlled power-down reduces idle power by >95%, extending thermal headroom in fanless DIN-rail enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-15TQLI | 16-bit bus width (256K × 16), 15 ns access, same TSOP I package but 44-pin | Requires bus-width adaptation; higher density but incompatible pinout and address mapping | Select only if system architecture supports 16-bit data path and board layout accommodates larger footprint |
| ON Semiconductor MCM62C256B-15N | Same 32K × 8 organization, 15 ns speed, but SOJ package (300-mil) and non-Pb-free option only | Larger SOJ footprint; lacks automotive qualification and CMOS-input standby mode (ISB2) | Prefer for legacy SOJ-based designs where Pb-free compliance is not mandated and temperature range is commercial only |
Compared with IS61LV25616AL-15TQLI and MCM62C256B-15N, the CY7C1399BNL-15ZXC uniquely delivers Pb-free TSOP I packaging, industrial/Automotive-A qualification, and dual-mode (TTL/CMOS) standby current optimization-making it optimal for new designs requiring compact size, regulatory compliance, and extended temperature reliability.
Availability
CY7C1399BNL-15ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive engine control unit caching, and medical diagnostic imaging FIFO applications requiring stable component supply across long production lifecycles.
Supply support for CY7C1399BNL-15ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and automotive markets.
The CY7C1399B series was designed specifically for low-voltage, high-speed cache and buffer applications in resource-constrained embedded systems requiring deterministic timing and extended temperature operation.
FAQ
What is the minimum VCC required for data retention on CY7C1399BNL-15ZXC?
Data retention is guaranteed down to VCC = 2.0 V, with maximum retention current ICCDR of 20 µA at that voltage. This enables use with backup batteries or supercapacitors in holdover scenarios, provided CE remains asserted above VCC – 0.3 V and all inputs are held at valid logic levels.
Does CY7C1399BNL-15ZXC support true 3.3 V-only operation without level shifters?
Yes. All DC input thresholds (VIH = 2.2 V min, VIL = 0.8 V max) and output drive levels (VOH = 2.4 V min at –2 mA, VOL = 0.4 V max at 4 mA) comply fully with 3.3 V LVTTL and LVCMOS specifications, eliminating need for external level translation in compatible host systems.
How does the automatic power-down feature behave when CE is HIGH but WE and OE are floating?
When CE is HIGH, the device enters power-down regardless of WE/OE states. Input leakage (IIX ≤ ±1 µA) and standby current (ISB2 ≤ 500 µA) remain within spec even with CMOS inputs floating, due to internal weak pull-downs on control pins-no external biasing is required.
Can CY7C1399BNL-15ZXC be used in place of CY7C1399BN-15ZC in existing designs?
Yes-CY7C1399BNL-15ZXC is the Pb-free variant of CY7C1399BN-15ZC, sharing identical AC/DC electrical specs, timing, pinout, and thermal characteristics. The "L" suffix denotes enhanced data retention capability (VDR = 2.0 V), but functional compatibility is 100% maintained for all standard SRAM operations.
CY7C1399BNL-15ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY7C1399BNL-15ZXC FAQ
1.How can I place an order for CY7C1399BNL-15ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1399BNL-15ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1399BNL-15ZXC reliable?
The price and inventory of CY7C1399BNL-15ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1399BNL-15ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1399BNL-15ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1399BNL-15ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1399BNL-15ZXC?
CY7C1399BNL-15ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1399BNL-15ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1399BNL-15ZXC?
For technical support, including CY7C1399BNL-15ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1399BNL-15ZXC requirements.
6.How does Aetrix verify that CY7C1399BNL-15ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1399BNL-15ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1399BNL-15ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1399BNL-15ZXC?
All CY7C1399BNL-15ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1399BNL-15ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1399BNL-15ZXC part is unused and in its original packaging.
Return procedure for CY7C1399BNL-15ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1399BNL-15ZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

