Infineon Technologies CY7C1412AV18-167BZC

Overview

CY7C1412AV18-167BZC from Cypress Semiconductor is a 36-Mbit QDR-II™ SRAM with 2M × 18 organization, 167 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, 2-word burst transfers per access, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering systems.

For engineers reviewing the CY7C1412AV18-167BZC datasheet, CY7C1412AV18-167BZC pinout, CY7C1412AV18-167BZC application, or CY7C1412AV18-167BZC equivalent, key selection criteria include its 165-ball FBGA package, dual-clock timing architecture (K/K and C/C), HSTL-compatible variable-drive outputs, JTAG 1149.1 test access, and DLL-based data alignment for sub-nanosecond timing control.

Technical Context

The CY7C1412AV18-167BZC uses synchronous pipelined QDR-II architecture with physically independent read and write data paths-no bus turnaround required. Its 2M × 18 memory array is accessed via a shared 20-bit address bus latched on rising edges of K (read) and K (write) clocks.

Read data is output on Q[17:0] synchronized to C and C clocks, with echo clocks CQ/CQ aligned to output clock edges for receiver deskew. Write operations use on-chip self-timed logic, and byte write selects BWS[1:0] enable partial writes without disturbing unselected 9-bit bytes.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with CY7C1412AV18-200BZC, the -167BZC reduces power by ~15% at same voltage while retaining full feature set; versus AS7C336200B-167BIN, it provides superior signal integrity control via DLL-aligned echo clocks and programmable output impedance-critical for >1 Gbps trace lengths.

Availability

CY7C1412AV18-167BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, baseband processing buffers, and real-time video frame stores requiring stable component supply across extended production lifecycles.

Supply support for CY7C1412AV18-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.

The QDR-II SRAM product line targets applications demanding deterministic low-latency, concurrent memory access-especially in networking infrastructure where bus turnaround overhead directly impacts throughput and jitter.

FAQ

What is the minimum VDDQ voltage supported for CY7C1412AV18-167BZC?

The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed and may cause HSTL input threshold violations or reduced output drive strength. The 1.4 V lower limit ensures compatibility with HSTL Class I specifications and maintains adequate noise margin for 167 MHz DDR signaling.

Can CY7C1412AV18-167BZC operate in single-clock mode using only K and K?

Yes. When C and C are tied to K and K respectively, the device operates in single-clock mode. In this configuration, Q[17:0] and CQ/CQ are driven on rising edges of K/K, eliminating need for separate output clocks-but echo clock deskew capability is lost, limiting usable trace length to ≤3 inches.

How does the ZQ pin affect output impedance calibration?

ZQ connects to an external resistor (typically 240 Ω) to ground, establishing a reference for internal termination resistors. This calibrates Q[17:0], CQ, and CQ output drivers to 0.2 × RQ (≈48 Ω), matching standard 50 Ω PCB traces. Leaving ZQ floating or tying to GND disables calibration and risks signal reflection.

Is DOFF pin required to be asserted for normal operation?

No. DOFF must be held HIGH (tied to VDDQ) for normal DLL-enabled operation. Asserting DOFF LOW disables the DLL, causing CQ/CQ and Q[17:0] timing to shift by up to 1.5 ns and violating AC timing specs-this mode is only for debug or DLL failure recovery, not production use.