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Infineon Technologies CY7C1412AV18-167BZXI

Part No.:
CY7C1412AV18-167BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1412AV18-167BZXI.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,158

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Product details

Overview

CY7C1412AV18-167BZXI from Cypress Semiconductor is a 36-Mbit QDR-II™ SRAM with 2M × 18 organization, 167 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It features separate read/write ports, DDR interfaces on both ports (effectively 334 MT/s), and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers and switch fabric memory.

For engineers reviewing the CY7C1412AV18-167BZXI datasheet, CY7C1412AV18-167BZXI pinout, CY7C1412AV18-167BZXI application, or CY7C1412AV18-167BZXI equivalent, key selection criteria include burst depth (2-word), port independence (RPS/WPS control), HSTL-18-compatible variable-drive outputs, DLL-enabled timing accuracy, and 165-ball FBGA (15 × 17 × 1.4 mm) package compatibility with high-density routing.

Technical Context

The CY7C1412AV18-167BZXI implements true dual-port synchronous pipelined architecture: Read address latched on K rising edge, Write address on K rising edge, with independent RPS and WPS controls enabling concurrent access. Its 2M × 18 array is internally split into two 1M × 18 banks, accessed via 20-bit multiplexed address bus (A[19:0]).

All data transfers occur in fixed 2-word bursts - each read or write accesses two consecutive 18-bit words in one clock cycle. Output data is registered to C/C clocks (or K/K in single-clock mode), while echo clocks CQ/CQ are phase-aligned to C/C to simplify source-synchronous capture at the controller, eliminating flight-time skew across wide buses.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2M × 18 organization)
Max Clock Frequency 167 MHz - defines maximum sustained transaction rate of 167 million cycles/sec
Data Rate 334 MT/s - double-data-rate transfer on both read and write ports
Core Supply 1.8 V ±0.1 V - powers internal logic and array; requires tight regulation for timing stability
I/O Supply Range VDDQ = 1.4 V to 1.8 V - supports HSTL-18 interface compliance and drive strength tuning
Package 165-ball FBGA (15 × 17 × 1.4 mm) - enables high-pin-count routing with controlled impedance trace design
Output Interface HSTL Class I - provides matched termination, low-noise switching, and 0.2×RQ ZQ calibration support

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant lead-free finish (BZXI suffix).

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data sampled on rising edge of K clock; ignored if WPS deasserted
Q[17:0] Synchronous read data output 18-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS inactive
RPS Read port select (active LOW) Enables read access and output drivers; pending read completes before tri-state assertion
WPS Write port select (active LOW) Enables write access; D[17:0] ignored when deasserted
BWS[1:0] Byte write select (active LOW) BWS0 controls D[8:0], BWS1 controls D[17:9]; enables partial-word writes without read-modify-write
K / K Positive/negative input clocks Rising edges latch all synchronous inputs (address, control, data); K used for read address, K for write address
C / C Positive/negative output clocks Rising edges clock Q[17:0] and CQ/CQ; used for deskewing data capture across multi-device systems
CQ / CQ Echo clocks Free-running, phase-aligned copies of C/C; provide deterministic timing reference for external capture logic
ZQ Output impedance calibration input Connects to external resistor to ground (RQ) to calibrate Q[17:0]/CQ/CQ drive strength to 0.2×RQ
DOFF DLL disable (active LOW) Pulling low disables internal Delay Lock Loop; alters AC timing parameters and invalidates datasheet specs
TCK/TMS/TDI/TDO JTAG boundary-scan interface IEEE 1149.1 compliant test access port for production testing and debug visibility
VDD / VSS / VDDQ / VREF Power and reference supplies VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; VREF = static reference for HSTL input thresholds and AC measurements

Key Features

Feature Design Value
Separate read/write ports Eliminates bus turnaround delay and contention, enabling true concurrent access in full-duplex memory systems
2-word burst architecture Guarantees two sequential 18-bit words per access cycle, optimizing bandwidth utilization for packet payload buffering
Source-synchronous echo clocks (CQ/CQ) Provides controller with deterministic, board-skew-compensated timing reference for reliable >300 MT/s data capture
ZQ impedance calibration Enables dynamic output driver matching to PCB trace impedance, reducing signal integrity margin loss across voltage/temperature
On-chip DLL Aligns internal data paths to input clocks, ensuring setup/hold timing closure at 167 MHz without external delay tuning
HSTL-18 compatible I/O Supports industry-standard high-speed signaling with programmable drive strength and VREF-referenced thresholds

Applications

Networking Switch Fabric High-Speed Test Equipment Memory Buffer

Use Scenario: Storing and forwarding variable-length Ethernet/SONET frames in layer-2/3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as packet buffer memory with simultaneous ingress write and egress read operations.

Use Value: 2M × 18 capacity and 334 MT/s bandwidth support 10 Gbps+ switch fabric throughput without bottlenecking on memory latency.

Use Scenario: Capturing high-frequency digital waveforms during automated test pattern generation and analysis.

IC Role / Device Role / Timing Role: High-bandwidth acquisition buffer interfacing directly to FPGA-based pattern generators and comparators.

Use Value: Concurrent read/write capability allows real-time waveform streaming while previous data is being processed, minimizing dead time.

Telecom Baseband Processing Real-Time Video Frame Buffer

Use Scenario: Temporary storage of OFDM symbol data between FFT processing stages in LTE/5G baseband units.

IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory for pipeline staging between DSP cores and RF front-end interfaces.

Use Value: 167 MHz clock and DLL-controlled timing ensure sub-ns jitter alignment critical for coherent multi-carrier signal reconstruction.

Use Scenario: Interfacing between image sensor interface and video encoder in broadcast-grade camera systems.

IC Role / Device Role / Timing Role: Frame buffer supporting simultaneous sensor write (at pixel clock rate) and encoder read (at compression engine rate).

Use Value: Independent RPS/WPS control and burst transfers enable seamless frame handoff without frame tearing or dropped lines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1412AV18-200BZXI Higher max frequency (200 MHz vs. 167 MHz); identical pinout, timing, and feature set Required where system clock exceeds 167 MHz but ≤200 MHz; same PCB layout and firmware Select when bandwidth demand exceeds 334 MT/s and board-level timing margin supports 200 MHz operation
AS7C33618B-167BIN Same density (2M × 18), 167 MHz, but uses SSTL-2 I/O (2.5 V) instead of HSTL-18 (1.4–1.8 V); no ZQ or DLL Compatible only in systems with 2.5 V I/O rails and no need for impedance calibration or ultra-low-jitter timing Choose only if migrating from legacy SSTL designs; not drop-in due to voltage and feature mismatch

Compared with CY7C1412AV18-200BZXI, the -167BZXI trades peak bandwidth for lower power and relaxed timing closure; versus AS7C33618B-167BIN, it delivers superior signal integrity at 1.8 V with calibrated outputs and DLL-assisted timing - critical for >150 MHz systems.

Availability

CY7C1412AV18-167BZXI is available at Aetrix Electronics and suitable for networking switch fabric, telecom baseband processing, high-speed test equipment, and real-time video frame buffering requiring stable component supply across extended product lifecycles.

Supply support for CY7C1412AV18-167BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for demanding communications and industrial applications, emphasizing signal integrity, timing precision, and long-term reliability.

The QDR-II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking, test, and telecom infrastructure - specifically engineered to replace asynchronous SRAMs and simplify DDR-based buffer design with deterministic dual-port access.

FAQ

What is the function of the ZQ pin on CY7C1412AV18-167BZXI?

The ZQ pin is an output impedance calibration input that connects to an external resistor (RQ) tied to ground. The device uses this connection to tune its Q[17:0], CQ, and CQ output drivers to 0.2×RQ, ensuring precise impedance matching to the PCB data bus. It must never be left floating or tied directly to GND.

Can CY7C1412AV18-167BZXI operate in single-clock mode?

Yes - the device supports single-clock mode where K and K are tied together, and C and C are tied together. In this configuration, K serves as both address/control clock and output data clock, simplifying system clocking at the cost of reduced deskew capability compared to differential clocking.

How does the 2-word burst architecture affect memory access timing?

Each read or write access automatically retrieves or stores two consecutive 18-bit words in a single clock cycle, with the second word appearing on the next rising edge of the respective clock. This eliminates the need for external burst counters and guarantees predictable, fixed-latency transfers essential for pipeline synchronization.

What happens when DOFF is pulled LOW?

Pulling DOFF LOW disables the internal Delay Lock Loop (DLL), causing output timing parameters (e.g., tAC, tQH) to shift outside datasheet specifications. This mode is intended only for specific debug or low-power scenarios and invalidates guaranteed timing performance at 167 MHz.

CY7C1412AV18-167BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1412AV18-167BZXI FAQ

1.How can I place an order for CY7C1412AV18-167BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1412AV18-167BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1412AV18-167BZXI reliable?

The price and inventory of CY7C1412AV18-167BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1412AV18-167BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1412AV18-167BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1412AV18-167BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1412AV18-167BZXI?

CY7C1412AV18-167BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1412AV18-167BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1412AV18-167BZXI?

For technical support, including CY7C1412AV18-167BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1412AV18-167BZXI requirements.

6.How does Aetrix verify that CY7C1412AV18-167BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1412AV18-167BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1412AV18-167BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1412AV18-167BZXI?

All CY7C1412AV18-167BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1412AV18-167BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1412AV18-167BZXI part is unused and in its original packaging.

Return procedure for CY7C1412AV18-167BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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