Infineon Technologies CY7C1412AV18-200BZC

Overview

CY7C1412AV18 from Cypress Semiconductor is a 36-Mbit QDR-II™ SRAM with 2M × 18 organization, 250 MHz clock operation, DDR interfaces on independent read/write ports, and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers 500 MT/s data transfer rate per port and supports concurrent burst reads/writes in high-bandwidth networking and packet buffering applications.

For engineers reviewing the CY7C1412AV18 datasheet, CY7C1412AV18 pinout, CY7C1412AV18 application, or CY7C1412AV18 equivalent, this device is selected for synchronous pipelined memory subsystems requiring zero-bus-turnaround, full data coherency, precise DDR timing via dual echo clocks (CQ/CQ), and HSTL-compatible 1.4–1.8 V I/O operation.

Technical Context

The CY7C1412AV18 implements QDR-II architecture with physically separate read and write data paths-D[17:0] inputs and Q[17:0] outputs-eliminating bus contention and turn-around delays. Address latching uses shared A[19:0] bus synchronized to rising edges of K (read) and K (write) clocks.

Output timing is controlled by C/C clocks with echo clocks CQ/CQ referenced to C/C, enabling skew-compensated data capture. Internal DLL ensures accurate data placement, while BWS[1:0] enables byte-selective writes across two 9-bit lanes, preserving unselected data during partial writes.

Key Specifications

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA) package, 15 mm × 17 mm × 1.4 mm body, RoHS-compliant lead-free option available. Pin layout optimized for signal integrity in high-speed DDR memory subsystems with dedicated echo clocks, impedance control (ZQ), and JTAG test access.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with AS7C362000B-200BIN and IS61WV102418BLL-200BLI, the CY7C1412AV18 provides higher bandwidth (9 Gbps vs. ≤7.2 Gbps), integrated DLL and echo clocks for robust timing, and ZQ-based output impedance control-critical for maintaining signal integrity in dense, multi-SRAM memory subsystems.

Availability

CY7C1412AV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric memory, baseband processing buffers, and real-time video frame stores requiring stable component supply across extended production lifecycles.

Supply support for CY7C1412AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.

The QDR-II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking infrastructure, where concurrent read/write, DDR burst efficiency, and deterministic timing are mandatory.

FAQ

What is the minimum VDDQ voltage supported for CY7C1412AV18 operation?

The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed: HSTL-18 input thresholds and output drive strength fall outside specification, risking setup/hold violations and reduced noise margin. Always maintain VDDQ ≥ 1.4 V for functional compliance per datasheet Rev. *C.

Can CY7C1412AV18 operate without connecting the ZQ pin?

No. ZQ must be connected either to an external resistor to ground (for impedance calibration) or directly to VDDQ (to enable minimum output impedance mode). Leaving ZQ floating or tied to VSS violates absolute maximum ratings and causes undefined output driver behavior, including excessive current draw or signal distortion.

How does the DLL affect timing parameters when enabled versus disabled?

With DLL enabled, tAC (address-to-output) and tDOH (data hold after C/C) meet specified values (e.g., tAC = 2.4 ns @ 250 MHz). When DOFF = LOW (DLL disabled), tAC increases to ~3.8 ns and tDOH degrades significantly - requiring controller re-timing and reducing system margin. DLL must remain enabled for datasheet-compliant operation.

Is CY7C1412AV18 pin-compatible with other devices in the CY7C14xxAV18 family?

No. While all share the same 165-ball FBGA footprint, pin functions differ across configurations: CY7C1410AV18 uses NWS[1:0], CY7C1425AV18 uses BWS[0], CY7C1412AV18 uses BWS[1:0], and CY7C1414AV18 uses BWS[3:0]. Signal mapping, address width (A[19:0] vs A[20:0]), and data width (18-bit vs 8/9/36-bit) are not interchangeable.