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Infineon Technologies CY7C1412KV18-250BZCT

Part No.:
CY7C1412KV18-250BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1412KV18-250BZCT.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,855

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Product details

Overview

CY7C1412KV18-250BZCT from Cypress Semiconductor is a 2M × 18 (36-Mbit) QDR® II SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It features independent read/write ports, DDR interfaces on both ports (500 Mbps per pin), echo clocks (CQ/CQ), and PLL-based timing control for high-speed networking buffers and packet memory applications.

For engineers reviewing the CY7C1412KV18-250BZCT datasheet, CY7C1412KV18-250BZCT pinout, CY7C1412KV18-250BZCT application, or CY7C1412KV18-250BZCT equivalent, key selection criteria include 250 MHz operation with 1.5-cycle read latency (DOFF = HIGH), 165-ball FBGA package compatibility, dual-clock domain support (K/K and C/C), byte write select (BWS[1:0]), and JTAG 1149.1 test access.

Technical Context

This QDR II SRAM implements fully synchronous, pipelined read and write operations using separate address latching on alternate rising edges of K and K clocks. Internal self-timed writes eliminate external write pulse timing constraints, while echo clocks CQ/CQ align with output data edges to simplify high-speed capture at the controller.

The device supports both single- and dual-clock domains: in dual-clock mode, K/K drive inputs and C/C drive outputs with deskew capability; in single-clock mode, K/K serve both input and output timing. DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency, enabling trade-offs between latency and bandwidth utilization.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2M × 18 organization)
Max Clock Frequency 250 MHz - determines peak bandwidth of 9 Gbps (18-bit × 500 MT/s)
Read Latency 1.5 cycles (DOFF = HIGH) - enables higher sustained throughput in burst-heavy systems
Core Supply Voltage 1.8 V ±0.1 V - defines power rail stability requirement and thermal design margin
I/O Supply Range 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V HSTL-compatible controllers
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in telecom line cards
Operating Temperature 0 °C to +70 °C - commercial-grade rating suitable for indoor network infrastructure

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 1.0 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data sampled on rising edge of K clock; supports two-word burst writes
Q[17:0] Synchronous read data output 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS is deasserted
WPS Write port select Active-low signal enabling write transactions; sampled on rising edge of K clock
RPS Read port select Active-low signal initiating read bursts; sampled on rising edge of K clock
BWS[1:0] Byte write select Two active-low signals controlling 9-bit byte lanes (D[8:0] and D[17:9]) during partial writes
K, K Input clocks (positive/negative) DDR-clocked inputs for address, data, and control; rising edges latch all synchronous inputs
C, C Output clocks (positive/negative) DDR-clocked outputs for Q[17:0]; used with CQ/CQ for flight-time deskew in multi-device systems
CQ, CQ Echo clocks Free-running copies of C/C, phase-aligned to output data edges-enables source-synchronous capture without board-level delay tuning
DOFF Read latency control High = 1.5-cycle latency (optimized for bandwidth); Low = 1-cycle latency (optimized for low-latency response)
VDD, VDDQ, VSS Power and ground VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; dedicated VSS balls per I/O bank minimize switching noise coupling

Key Features

Feature Design Value
Independent read/write ports Enables true concurrent access-no bus turnaround required, eliminating arbitration overhead in full-duplex traffic buffers
Two-word burst architecture Guarantees minimum 2× data transfer per access cycle, improving effective bandwidth utilization over single-word devices
PLL-based output timing Ensures precise placement of Q[17:0] relative to C/C edges, reducing setup/hold margin requirements at 250 MHz operation
HSTL Class I compatible I/O Supports 1.5 V or 1.8 V signaling with programmable drive strength-matches FPGA and ASIC memory controllers without level shifters
JTAG 1149.1 boundary scan Enables in-system test and debug of interconnect integrity in dense PCB layouts with minimal test point overhead

Applications

Packet Buffer Memory Network Switch Fabric Interface

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switches before classification and forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly with switch fabric ASIC via HSTL buses.

Use Value: Concurrent read/write ports allow simultaneous header lookup (read) and new packet enqueue (write) without contention-maintaining line-rate throughput at 10 Gbps+.

Use Scenario: Acting as a temporary staging buffer between ingress and egress scheduler blocks in modular chassis-based routers.

IC Role / Device Role / Timing Role: Dual-port SRAM providing deterministic 250 MHz access to support time-sensitive scheduling algorithms with sub-10 ns jitter tolerance.

Use Value: Echo clocks CQ/CQ enable source-synchronous capture at the scheduler ASIC, eliminating need for complex PCB length matching across 18-bit data paths.

Telecom Line Card Control Plane High-Speed Test Equipment Memory

Use Scenario: Holding configuration tables and real-time statistics in optical transport equipment (OTN/SDH) control modules.

IC Role / Device Role / Timing Role: Synchronous SRAM serving as fast-access scratchpad for microcontroller or ARM-based management processors.

Use Value: 1.5-cycle read latency (DOFF = HIGH) delivers consistent 4 ns access time at 250 MHz-critical for deterministic interrupt response in fault-monitoring loops.

Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) pattern generators and digitizers.

IC Role / Device Role / Timing Role: Burst-mode memory staging raw ADC/DAC data streams prior to compression or analysis.

Use Value: Byte write select BWS[1:0] allows selective update of 9-bit segments within 18-bit words-reducing unnecessary memory writes during partial sample updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1412KV18-300BZCT Higher max clock (300 MHz) and current draw (700 mA @ 300 MHz vs. 610 mA @ 250 MHz); identical pinout and feature set Required where system clock budget exceeds 250 MHz but board layout and power delivery support higher frequency operation Select when bandwidth > 10.8 Gbps is needed and thermal/power margins permit increased dissipation
AS7C33618A-250BIN Asynchronous interface, no echo clocks or PLL; 25 ns access time, 3.3 V only; different pinout and control protocol Suitable for legacy designs with non-QDR controllers or cost-sensitive applications where concurrency is not required Only viable if redesigning controller logic to support asynchronous timing and accepting ~5× lower bandwidth

Compared with CY7C1412KV18-300BZCT, the -250BZCT reduces power by 90 mA at full load and relaxes timing closure requirements; versus AS7C33618A-250BIN, it delivers 4× higher effective bandwidth and eliminates bus turnaround delays but requires QDR-aware controller firmware and layout discipline for echo clock routing.

Availability

CY7C1412KV18-250BZCT is available at Aetrix Electronics and suitable for packet buffer memory, network switch fabric interfaces, and telecom line card control plane applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY7C1412KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

This device belongs to Cypress's QDR II SRAM product line, designed specifically for high-throughput, low-latency buffering in packet-switched networks, telecom infrastructure, and test equipment where deterministic concurrent access is mandatory.

FAQ

What is the function of the DOFF pin on CY7C1412KV18-250BZCT?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency mode for optimized bandwidth efficiency; when LOW, it selects 1-cycle latency for minimal access delay. This setting affects timing margins for C/C clock-to-data alignment and must be fixed at power-up-no dynamic switching is supported during operation.

Can CY7C1412KV18-250BZCT operate with only one clock input (K) instead of K and K?

Yes-it supports single-clock domain operation where K serves as both input and output timing reference. In this mode, C and C are unused, and CQ/CQ derive from K. However, dual-clock mode (K/K for inputs, C/C for outputs) is required to exploit echo clock deskew benefits and achieve full 250 MHz performance with relaxed board layout constraints.

How does byte write select (BWS[1:0]) work in practice for partial writes?

BWS[1:0] controls two independent 9-bit lanes: BWS0 enables D[8:0], BWS1 enables D[17:9]. When either is LOW, corresponding bytes are written; when HIGH, those bytes retain prior values. This allows atomic 9-bit updates-e.g., modifying only packet priority bits in a 18-bit header word without disturbing timestamp fields-reducing write amplification in buffer management.

Is JTAG boundary scan functional on CY7C1412KV18-250BZCT out-of-the-box?

JTAG is enabled by default at power-up and compliant with IEEE 1149.1. No configuration is needed to access TAP registers, perform IDCODE reads, or execute EXTEST/INTEST instructions. The TDO, TCK, TMS, and TDI pins are dedicated and do not share functions with memory I/O-ensuring test access remains available even when memory ports are actively used.

CY7C1412KV18-250BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1412KV18-250BZCT FAQ

1.How can I place an order for CY7C1412KV18-250BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1412KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1412KV18-250BZCT reliable?

The price and inventory of CY7C1412KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1412KV18-250BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1412KV18-250BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1412KV18-250BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1412KV18-250BZCT?

CY7C1412KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1412KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1412KV18-250BZCT?

For technical support, including CY7C1412KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1412KV18-250BZCT requirements.

6.How does Aetrix verify that CY7C1412KV18-250BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1412KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1412KV18-250BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1412KV18-250BZCT?

All CY7C1412KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1412KV18-250BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1412KV18-250BZCT part is unused and in its original packaging.

Return procedure for CY7C1412KV18-250BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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