Infineon Technologies CY7C1412KV18-250BZCT
- Part No.:
- CY7C1412KV18-250BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1412KV18-250BZCT.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1412KV18-250BZCT from Cypress Semiconductor is a 2M × 18 (36-Mbit) QDR® II SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It features independent read/write ports, DDR interfaces on both ports (500 Mbps per pin), echo clocks (CQ/CQ), and PLL-based timing control for high-speed networking buffers and packet memory applications.
For engineers reviewing the CY7C1412KV18-250BZCT datasheet, CY7C1412KV18-250BZCT pinout, CY7C1412KV18-250BZCT application, or CY7C1412KV18-250BZCT equivalent, key selection criteria include 250 MHz operation with 1.5-cycle read latency (DOFF = HIGH), 165-ball FBGA package compatibility, dual-clock domain support (K/K and C/C), byte write select (BWS[1:0]), and JTAG 1149.1 test access.
Technical Context
This QDR II SRAM implements fully synchronous, pipelined read and write operations using separate address latching on alternate rising edges of K and K clocks. Internal self-timed writes eliminate external write pulse timing constraints, while echo clocks CQ/CQ align with output data edges to simplify high-speed capture at the controller.
The device supports both single- and dual-clock domains: in dual-clock mode, K/K drive inputs and C/C drive outputs with deskew capability; in single-clock mode, K/K serve both input and output timing. DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency, enabling trade-offs between latency and bandwidth utilization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18 organization) |
| Max Clock Frequency | 250 MHz - determines peak bandwidth of 9 Gbps (18-bit × 500 MT/s) |
| Read Latency | 1.5 cycles (DOFF = HIGH) - enables higher sustained throughput in burst-heavy systems |
| Core Supply Voltage | 1.8 V ±0.1 V - defines power rail stability requirement and thermal design margin |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V HSTL-compatible controllers |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in telecom line cards |
| Operating Temperature | 0 °C to +70 °C - commercial-grade rating suitable for indoor network infrastructure |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 1.0 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; supports two-word burst writes |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS is deasserted |
| WPS | Write port select | Active-low signal enabling write transactions; sampled on rising edge of K clock |
| RPS | Read port select | Active-low signal initiating read bursts; sampled on rising edge of K clock |
| BWS[1:0] | Byte write select | Two active-low signals controlling 9-bit byte lanes (D[8:0] and D[17:9]) during partial writes |
| K, K | Input clocks (positive/negative) | DDR-clocked inputs for address, data, and control; rising edges latch all synchronous inputs |
| C, C | Output clocks (positive/negative) | DDR-clocked outputs for Q[17:0]; used with CQ/CQ for flight-time deskew in multi-device systems |
| CQ, CQ | Echo clocks | Free-running copies of C/C, phase-aligned to output data edges-enables source-synchronous capture without board-level delay tuning |
| DOFF | Read latency control | High = 1.5-cycle latency (optimized for bandwidth); Low = 1-cycle latency (optimized for low-latency response) |
| VDD, VDDQ, VSS | Power and ground | VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; dedicated VSS balls per I/O bank minimize switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables true concurrent access-no bus turnaround required, eliminating arbitration overhead in full-duplex traffic buffers |
| Two-word burst architecture | Guarantees minimum 2× data transfer per access cycle, improving effective bandwidth utilization over single-word devices |
| PLL-based output timing | Ensures precise placement of Q[17:0] relative to C/C edges, reducing setup/hold margin requirements at 250 MHz operation |
| HSTL Class I compatible I/O | Supports 1.5 V or 1.8 V signaling with programmable drive strength-matches FPGA and ASIC memory controllers without level shifters |
| JTAG 1149.1 boundary scan | Enables in-system test and debug of interconnect integrity in dense PCB layouts with minimal test point overhead |
Applications
| Packet Buffer Memory | Network Switch Fabric Interface |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switches before classification and forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly with switch fabric ASIC via HSTL buses. Use Value: Concurrent read/write ports allow simultaneous header lookup (read) and new packet enqueue (write) without contention-maintaining line-rate throughput at 10 Gbps+. |
Use Scenario: Acting as a temporary staging buffer between ingress and egress scheduler blocks in modular chassis-based routers. IC Role / Device Role / Timing Role: Dual-port SRAM providing deterministic 250 MHz access to support time-sensitive scheduling algorithms with sub-10 ns jitter tolerance. Use Value: Echo clocks CQ/CQ enable source-synchronous capture at the scheduler ASIC, eliminating need for complex PCB length matching across 18-bit data paths. |
| Telecom Line Card Control Plane | High-Speed Test Equipment Memory |
|
Use Scenario: Holding configuration tables and real-time statistics in optical transport equipment (OTN/SDH) control modules. IC Role / Device Role / Timing Role: Synchronous SRAM serving as fast-access scratchpad for microcontroller or ARM-based management processors. Use Value: 1.5-cycle read latency (DOFF = HIGH) delivers consistent 4 ns access time at 250 MHz-critical for deterministic interrupt response in fault-monitoring loops. |
Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) pattern generators and digitizers. IC Role / Device Role / Timing Role: Burst-mode memory staging raw ADC/DAC data streams prior to compression or analysis. Use Value: Byte write select BWS[1:0] allows selective update of 9-bit segments within 18-bit words-reducing unnecessary memory writes during partial sample updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1412KV18-300BZCT | Higher max clock (300 MHz) and current draw (700 mA @ 300 MHz vs. 610 mA @ 250 MHz); identical pinout and feature set | Required where system clock budget exceeds 250 MHz but board layout and power delivery support higher frequency operation | Select when bandwidth > 10.8 Gbps is needed and thermal/power margins permit increased dissipation |
| AS7C33618A-250BIN | Asynchronous interface, no echo clocks or PLL; 25 ns access time, 3.3 V only; different pinout and control protocol | Suitable for legacy designs with non-QDR controllers or cost-sensitive applications where concurrency is not required | Only viable if redesigning controller logic to support asynchronous timing and accepting ~5× lower bandwidth |
Compared with CY7C1412KV18-300BZCT, the -250BZCT reduces power by 90 mA at full load and relaxes timing closure requirements; versus AS7C33618A-250BIN, it delivers 4× higher effective bandwidth and eliminates bus turnaround delays but requires QDR-aware controller firmware and layout discipline for echo clock routing.
Availability
CY7C1412KV18-250BZCT is available at Aetrix Electronics and suitable for packet buffer memory, network switch fabric interfaces, and telecom line card control plane applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY7C1412KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
This device belongs to Cypress's QDR II SRAM product line, designed specifically for high-throughput, low-latency buffering in packet-switched networks, telecom infrastructure, and test equipment where deterministic concurrent access is mandatory.
FAQ
What is the function of the DOFF pin on CY7C1412KV18-250BZCT?
The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency mode for optimized bandwidth efficiency; when LOW, it selects 1-cycle latency for minimal access delay. This setting affects timing margins for C/C clock-to-data alignment and must be fixed at power-up-no dynamic switching is supported during operation.
Can CY7C1412KV18-250BZCT operate with only one clock input (K) instead of K and K?
Yes-it supports single-clock domain operation where K serves as both input and output timing reference. In this mode, C and C are unused, and CQ/CQ derive from K. However, dual-clock mode (K/K for inputs, C/C for outputs) is required to exploit echo clock deskew benefits and achieve full 250 MHz performance with relaxed board layout constraints.
How does byte write select (BWS[1:0]) work in practice for partial writes?
BWS[1:0] controls two independent 9-bit lanes: BWS0 enables D[8:0], BWS1 enables D[17:9]. When either is LOW, corresponding bytes are written; when HIGH, those bytes retain prior values. This allows atomic 9-bit updates-e.g., modifying only packet priority bits in a 18-bit header word without disturbing timestamp fields-reducing write amplification in buffer management.
Is JTAG boundary scan functional on CY7C1412KV18-250BZCT out-of-the-box?
JTAG is enabled by default at power-up and compliant with IEEE 1149.1. No configuration is needed to access TAP registers, perform IDCODE reads, or execute EXTEST/INTEST instructions. The TDO, TCK, TMS, and TDI pins are dedicated and do not share functions with memory I/O-ensuring test access remains available even when memory ports are actively used.
CY7C1412KV18-250BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1412KV18-250BZCT FAQ
1.How can I place an order for CY7C1412KV18-250BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1412KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1412KV18-250BZCT reliable?
The price and inventory of CY7C1412KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1412KV18-250BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1412KV18-250BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1412KV18-250BZCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1412KV18-250BZCT?
CY7C1412KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1412KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1412KV18-250BZCT?
For technical support, including CY7C1412KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1412KV18-250BZCT requirements.
6.How does Aetrix verify that CY7C1412KV18-250BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1412KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1412KV18-250BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1412KV18-250BZCT?
All CY7C1412KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1412KV18-250BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1412KV18-250BZCT part is unused and in its original packaging.
Return procedure for CY7C1412KV18-250BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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