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Infineon Technologies CY7C1412KV18-250BZI

Part No.:
CY7C1412KV18-250BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1412KV18-250BZI.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,584

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Product details

Overview

CY7C1412KV18-250BZI from Cypress Semiconductor is a 2M × 18 (36-Mbit) QDR® II SRAM with two-word burst architecture, 250 MHz maximum operating frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports (500 Mbps per pin), and echo clocks (CQ/CQ) for precise high-speed data capture in networking packet buffers and switch fabric memory subsystems.

For engineers reviewing the CY7C1412KV18-250BZI datasheet, CY7C1412KV18-250BZI pinout, CY7C1412KV18-250BZI application, or CY7C1412KV18-250BZI equivalent, key selection criteria include 250 MHz clock timing margin, 18-bit × 2-word burst width, FBGA-165 package compatibility, DOFF-controlled 1-cycle vs. 1.5-cycle read latency, and HSTL-18 I/O drive compliance.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write ports sharing a single multiplexed address bus, with address latching on alternate rising edges of K/K clocks. Internal self-timed writes eliminate external write pulse timing constraints, while dual output clocks (C/C) and echo clocks (CQ/CQ) enable deterministic deskewed data capture at 500 Mbps per pin.

The device uses a PLL to align output data edges with C/C clock transitions, supports byte-write masking via BWS[1:0], and maintains full data coherency across concurrent read/write operations. Read latency is configurable via DOFF: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH), matching legacy QDR I or optimized QDR II timing modes respectively.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2M × 18 organization)
Max Clock Frequency 250 MHz - sets maximum sustained bandwidth of 9 Gbps (18-bit × 2 words × 250 MHz)
Core Supply Voltage 1.8 V ±0.1 V - defines minimum power rail stability requirement for internal logic and array operation
I/O Supply Range 1.4 V to 1.8 V - supports HSTL-18 Class I/II signaling and interoperability with 1.5 V or 1.8 V controllers
Read Latency Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts pipeline depth in switch ASIC interfaces
Package 165-ball FBGA (13 × 15 × 1.4 mm) - matches standard high-density PCB layout rules for telecom modules
Operating Temperature –40 °C to +85 °C - qualified for industrial and extended commercial networking equipment environments

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Write data input bus 18-bit synchronous input sampled on rising edge of K clock; supports byte-write via BWS[1:0]
Q[17:0] Read data output bus 18-bit synchronous output driven on rising edges of C/C clocks; tristated when RPS inactive
RPS Read port select Active-low signal enabling read access; sampled on rising edge of K; controls Q[17:0] driver state
WPS Write port select Active-low signal enabling write access; sampled on rising edge of K; gates D[17:0] into memory array
BWS[1:0] Byte write select Two active-low signals controlling 9-bit byte lanes (BWS0 = D[8:0], BWS1 = D[17:9]) for partial writes
K, K Input clocks Differential pair driving all synchronous inputs; rising edges latch addresses, RPS, WPS, BWS, and D[17:0]
C, C Output clocks Differential pair controlling Q[17:0] timing; used with CQ/CQ for source-synchronous capture at controller
CQ, CQ Echo clocks Free-running copies of C/C, phase-aligned to simplify PCB trace length matching and timing closure
DOFF Read latency mode Active-high signal selecting 1-cycle (LOW) or 1.5-cycle (HIGH) read latency for system timing alignment

Key Features

Feature Design Value
Separate read/write ports Enables true concurrent access without bus turnaround delay - critical for full-duplex packet buffering
Two-word burst architecture Guarantees 36-bit data transfer per access cycle - matches common 32-bit+ control word widths in switch ASICs
HSTL-18 compatible I/O Supports 500 Mbps per pin with 1.4–1.8 V VDDQ - eliminates level-shifting in 1.5 V/1.8 V SoC interconnects
Programmable read latency (DOFF) Allows seamless migration between QDR I (1-cycle) and QDR II (1.5-cycle) timing models in same PCB design
JTAG 1149.1 boundary scan Enables production test and debug of high-speed memory interconnects without physical probe access

Applications

High-Speed Network Switch Fabric Telecom Line Card Buffering

Use Scenario: Storing ingress/egress packet headers and metadata in multi-terabit Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler, synchronized to 250 MHz switch fabric clock.

Use Value: Concurrent read/write eliminates arbitration stalls, enabling line-rate forwarding at 100 GbE per port with sub-10 ns latency.

Use Scenario: Temporary storage of voice-over-IP (VoIP) payload fragments during jitter compensation on TDM-to-packet gateways.

IC Role / Device Role / Timing Role: Burst-mode memory interfacing with DSP cores and packet engines using separate K/C clock domains.

Use Value: Two-word burst delivers 36-bit aligned VoIP frames per cycle, reducing DMA overhead by 50% versus single-word devices.

Optical Transport Network (OTN) Framer Memory Industrial Real-Time Control Buffer

Use Scenario: Holding OTU2/OTU3 frame alignment words and overhead bytes during SONET/SDH mapping.

IC Role / Device Role / Timing Role: High-reliability SRAM with ECC-optional interface, clocked by 250 MHz framer timing engine.

Use Value: Echo clocks (CQ/CQ) ensure ±5 ps skew tolerance across 12-inch backplane traces - meeting ITU-T G.709 jitter specs.

Use Scenario: Interfacing motion controller FPGA with servo drive feedback loops requiring deterministic 250 kHz update rates.

IC Role / Device Role / Timing Role: Low-latency buffer for position/velocity data exchange between real-time CPU and fieldbus peripherals.

Use Value: 1-cycle read latency (DOFF = LOW) guarantees ≤4 ns access time - enabling closed-loop response within 4 µs window.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1412KV18-300BZI Higher max frequency (300 MHz) and current draw (700 mA @ 300 MHz vs. 610 mA @ 250 MHz) Requires tighter PCB layout for signal integrity; suitable only where 300 MHz timing margin is needed Select when system clock exceeds 250 MHz and board layout supports higher-speed routing
AS7C362000B-250BIN Same density (2M × 18) and speed grade but uses SSTL-2 I/O (2.5 V) instead of HSTL-18 (1.4–1.8 V) Not pin-compatible; requires level-shifter or redesign of I/O voltage rails Consider only if existing design uses 2.5 V memory interface and cannot support 1.8 V core/I/O separation

Compared with CY7C1412KV18-300BZI, the -250BZI reduces power by 90 mA at same temperature and relaxes timing closure; versus AS7C362000B-250BIN, it enables direct 1.8 V SoC integration without voltage translation, lowering BOM cost and signal integrity risk.

Availability

CY7C1412KV18-250BZI is available at Aetrix Electronics and suitable for high-speed network switch fabric, telecom line card buffering, and optical transport network framer memory requiring stable component supply across extended product lifecycles.

Supply support for CY7C1412KV18-250BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with headquarters in San Jose, CA.

CY7C1412KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in packet-switched infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C1412KV18-250BZI?

The DOFF (Data Output Fall-off) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for QDR II timing compliance; when LOW, it selects 1-cycle latency for backward compatibility with QDR I controllers. This pin is sampled synchronously on the rising edge of the K clock and must be held stable during initialization.

Can CY7C1412KV18-250BZI operate with only a single clock domain?

Yes - the device supports single-clock mode where K and C are tied together (and K and C likewise), eliminating need for separate clock generators. In this configuration, data is clocked in/out on K/K edges, and echo clocks CQ/CQ track K/K instead of C/C. Setup/hold timing margins tighten slightly, but full functionality including burst and byte-write remains intact.

What is the purpose of BWS[1:0] pins and how are they used in byte-write operations?

BWS[1:0] are active-low byte write select signals that enable partial 9-bit writes: BWS0 controls D[8:0], BWS1 controls D[17:9]. When either is deasserted, the corresponding 9-bit lane is ignored during write cycles, preserving prior data in those bits. Both signals are sampled synchronously with D[17:0] on the rising edge of K, allowing fine-grained data updates without full-word overwrites.

Is JTAG boundary scan supported on CY7C1412KV18-250BZI and how is it enabled?

Yes - the device implements IEEE 1149.1 JTAG test access port with TDI, TDO, TCK, and TMS pins. JTAG is enabled by default at power-up; no external configuration is required. Boundary scan supports full pin-level interconnect testing and can be used for in-system programming of associated configuration devices, provided the host controller implements TAP controller logic.

CY7C1412KV18-250BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1412KV18-250BZI FAQ

1.How can I place an order for CY7C1412KV18-250BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1412KV18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1412KV18-250BZI reliable?

The price and inventory of CY7C1412KV18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1412KV18-250BZI is usually 5 days.

3.What payment methods are accepted for CY7C1412KV18-250BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1412KV18-250BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1412KV18-250BZI?

CY7C1412KV18-250BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1412KV18-250BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1412KV18-250BZI?

For technical support, including CY7C1412KV18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1412KV18-250BZI requirements.

6.How does Aetrix verify that CY7C1412KV18-250BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1412KV18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1412KV18-250BZI meets industry standards.

7.What is the process for return or replacement of CY7C1412KV18-250BZI?

All CY7C1412KV18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1412KV18-250BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1412KV18-250BZI part is unused and in its original packaging.

Return procedure for CY7C1412KV18-250BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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