Infineon Technologies CY7C1412KV18-300BZXI

Overview

CY7C1412KV18-300BZXI from Cypress Semiconductor is a 2M × 18, 36-Mbit QDR® II SRAM with two-word burst architecture, 300 MHz clock operation (600 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, echo clocks (CQ/CQ), and PLL-based timing control for high-speed networking buffers in packet switching ASICs.

For engineers reviewing the CY7C1412KV18-300BZXI datasheet, CY7C1412KV18-300BZXI pinout, CY7C1412KV18-300BZXI application, or CY7C1412KV18-300BZXI equivalent, key selection criteria include dual-port concurrency, 1.5-cycle read latency (DOFF = HIGH), HSTL-compatible 165-ball FBGA package, and JTAG 1149.1 test support.

Technical Context

This SRAM implements true dual-port QDR II architecture: independent read and write ports share one address bus but use separate clock domains (K/K for addressing, C/C for output timing) and dedicated data paths (D[17:0] inputs, Q[17:0] outputs). It eliminates bus turnaround via full separation of input and output data lanes.

The device uses internal PLL to align echo clocks (CQ/CQ) with output clocks (C/C), enabling precise source-synchronous capture at 600 MHz DDR. Read latency is configurable-1 cycle when DOFF = LOW (QDR I mode), 1.5 cycles when DOFF = HIGH (QDR II mode)-with synchronous self-timed writes and byte-write select (BWS[1:0]) granularity.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch, JEDEC MO-270AC compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with IDT72T36120L10BG and IS61WV102418BLL-10BLI, CY7C1412KV18-300BZXI delivers 3× higher bandwidth, deterministic 1.5-cycle latency, and echo-clock-assisted timing closure - making it uniquely suited for 10G+ packet processing where concurrent access and sub-10 ns timing margins are mandatory.

Availability

CY7C1412KV18-300BZXI is available at Aetrix Electronics and suitable for network packet buffers, telecom line card caches, baseband processor memories, and ATE pattern stores requiring stable component supply across multi-year production cycles.

Supply support for CY7C1412KV18-300BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems, with focus on signal integrity and timing precision.

CY7C1412KV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic-latency, concurrent-access buffering in packet-switched infrastructure - targeting ASIC/FPGA-based networking and baseband applications demanding >2 GB/s sustained bandwidth.

FAQ

What is the function of the DOFF pin on CY7C1412KV18-300BZXI?

The DOFF (Data-Off) pin configures read latency mode: when asserted HIGH, it enables QDR II mode with 1.5-cycle read latency and two-word burst; when LOW, it reverts to QDR I mode with 1-cycle latency. This pin is sampled synchronously on the rising edge of K and must be stable before initialization completes.

Can CY7C1412KV18-300BZXI operate with only a single clock domain?

Yes - the device supports single-clock mode where K and C are tied together (and K and C tied together), eliminating need for separate address and output clocks. In this configuration, Q[17:0] outputs are clocked by K/K instead of C/C, and echo clocks CQ/CQ track K/K. All timing parameters shift accordingly per datasheet Table 12.

How does the BWS[1:0] signal control byte writes in the 2M × 18 configuration?

BWS[0] enables writing to D[8:0], and BWS[1] enables writing to D[17:9]. Both are active-low and sampled on the same K clock edge as data. When BWS[0] is HIGH, D[8:0] is ignored; when BWS[1] is HIGH, D[17:9] is ignored - allowing partial 9-bit updates without disturbing the complementary half-word.

Is the 165-ball FBGA package of CY7C1412KV18-300BZXI compatible with standard reflow profiles?

Yes - the Pb-free 165-ball FBGA (package code BZXI) complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C, 60-second duration above 217°C). Board layout must observe 0.8 mm ball pitch, 0.35 mm pad diameter, and controlled-impedance routing for K/K and C/C pairs.