Infineon Technologies CY7C1413KV18-250BZCT
- Part No.:
- CY7C1413KV18-250BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1413KV18-250BZCT.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,750
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Product details
Overview
CY7C1413KV18-250BZCT from Cypress Semiconductor is a 2 M × 18, 36-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum operating frequency (40 ns clock period), 1.8 V core supply, and 1.4–1.8 V I/O supply. It supports concurrent read/write transactions via independent ports and delivers 3.6 Gbps bandwidth using DDR interfaces on both ports.
For engineers reviewing the CY7C1413KV18-250BZCT datasheet, CY7C1413KV18-250BZCT pinout, CY7C1413KV18-250BZCT application, or CY7C1413KV18-250BZCT equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clocks (CQ/CQ) for timing margin, 165-ball FBGA package compatibility, and HSTL-15/18 I/O drive support in high-speed packet buffering systems.
Technical Context
The CY7C1413KV18-250BZCT implements a synchronous pipelined QDR II architecture with physically separate read and write data paths, eliminating bus turnaround delays. It uses dual input clocks (K/K) for address/data capture and dual output clocks (C/C) with echo clocks (CQ/CQ) to compensate for PCB flight time skew.
Internally, it organizes memory as four 512 K × 18 arrays, latching addresses on alternating rising edges of K, supporting 18-bit wide data bursts of four words per access. The PLL ensures precise data placement relative to C/C edges, and DOFF pin configures read latency between 1-cycle (LOW) and 1.5-cycle (HIGH) modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2 M × 18 organization) |
| Max Clock Frequency | 250 MHz - defines 40 ns minimum clock period for timing closure |
| Data Bus Width | 18-bit - supports parallel high-throughput data transfers without multiplexing |
| Read Latency | 1.5 cycles (DOFF = HIGH) - enables precise timing alignment in pipeline-constrained systems |
| Core Supply Voltage | 1.8 V ±0.1 V - requires tight regulation; decoupling critical for signal integrity |
| I/O Supply Range | 1.4 V to 1.8 V - supports HSTL-15 and HSTL-18 interface standards |
| Burst Length | Four-word - reduces effective address bus toggling frequency by 4× |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant, ball pitch 0.8 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Write data inputs | Latched on rising edge of K clock; 18-bit parallel write path |
| Q[17:0] | Read data outputs | Driven on rising edge of C/C clocks; supports DDR output timing |
| K / K | Input clocks | Rising-edge-triggered for address and write data capture; dual-clock domain |
| C / C | Output clocks | Drive read data; matched to CQ/CQ for source-synchronous capture |
| CQ / CQ | Echo clocks | Replicate C/C timing at receiver; eliminate board-level skew compensation |
| WPS | Write port select | Active-low synchronous enable; gates write operations when deasserted |
| BWS[1:0] | Byte write selects | Independent 9-bit byte enables for partial writes without read-modify-write |
| DOFF | Read latency control | High = 1.5-cycle latency; Low = 1-cycle latency - configures pipeline depth |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent access - no arbitration or bus contention in full-duplex traffic |
| Four-word burst mode | Reduces required address transition rate by 75%, easing routing and timing closure |
| Echo clock outputs (CQ/CQ) | Eliminates need for external delay tuning; simplifies high-speed PCB layout |
| Programmable read latency (DOFF) | Allows system-level optimization between throughput (1.5-cycle) and latency (1-cycle) |
| HSTL-compatible I/O | Supports 1.5 V or 1.8 V termination; compatible with FPGA/HBAs using HSTL-15/18 |
Applications
| Network Packet Buffering | FPGA-Based Protocol Acceleration |
|---|---|
Use Scenario: Storing ingress/egress packets in 10/40/100 GbE line cards with real-time header inspection and forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared buffer between MAC and traffic manager; operates in full-duplex burst mode. Use Value: 3.6 Gbps sustained bandwidth and 1.5-cycle latency ensure zero packet loss under line-rate traffic with minimal pipeline stalls. | Use Scenario: Offloading TCP/IP checksum, encryption, and packet reassembly in FPGA-accelerated smart NICs. IC Role / Device Role / Timing Role: Dual-port scratchpad memory for parallel read (instruction fetch) and write (result store) within single clock cycle. Use Value: Independent ports eliminate bus turnaround overhead, enabling deterministic 250 MHz operation without arbitration logic. |
| Telecom Baseband Processing | High-Speed Test Equipment Memory |
Use Scenario: Real-time buffering of IQ samples between ADC/DAC and DSP cores in 5G massive MIMO radio units. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM interfacing directly to Xilinx Ultrascale+ GTY transceivers using HSTL-18 I/O. Use Value: Echo clocks (CQ/CQ) match FPGA IDELAYCTRL timing, achieving < ±5 ps clock-to-data skew across 18-bit bus. | Use Scenario: Pattern memory in automated test equipment (ATE) for high-speed digital IC validation at 500 Mbps+ data rates. IC Role / Device Role / Timing Role: Deterministic-access memory for stimulus generation and response capture with sub-nanosecond timing control. Use Value: 1.5-cycle read latency and 250 MHz clock enable precise 2 ns resolution waveform sampling and comparison. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-250BIN | 2 M × 18 QDR II+, 250 MHz, 1.5 V core, no echo clocks, no DOFF latency control | Lacks CQ/CQ and programmable latency; requires external timing compensation | Select only if echo clock removal simplifies system design and latency tolerance > 2 cycles |
| MT47H64M16HR-25E:H | 64 M × 16 DDR2 SDRAM, 250 MHz, 1.8 V, asynchronous command interface, higher density but higher latency | Not QDR; requires refresh, command scheduling, and burst-length management | Choose only when capacity >36 Mbit is mandatory and deterministic latency is secondary |
Compared with AS7C362000B-250BIN and MT47H64M16HR-25E:H, the CY7C1413KV18-250BZCT uniquely delivers guaranteed 1.5-cycle latency with echo-clock–assisted capture, making it optimal for systems requiring sub-2-ns timing margin and zero-refresh deterministic access.
Availability
CY7C1413KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffering, FPGA-based protocol acceleration, and telecom baseband processing requiring stable component supply and long-term industrial availability.
Supply support for CY7C1413KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
The QDR II SRAM product line targets deterministic, low-latency, high-bandwidth memory subsystems in infrastructure equipment where DDR SDRAM latency and refresh overhead are unacceptable.
FAQ
What is the function of the DOFF pin on CY7C1413KV18-250BZCT?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-speed systems; when LOW, it selects 1-cycle latency for minimal access delay. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.
Does CY7C1413KV18-250BZCT require an external PLL or clock synthesizer?
No. The device integrates an internal PLL that locks to the K clock and generates phase-aligned internal clocks for precise data placement. External clock synthesis is unnecessary - only clean, low-jitter K, K, C, and C signals must be provided from the system controller or FPGA.
Can CY7C1413KV18-250BZCT operate with 1.5 V I/O supply while maintaining 1.8 V core voltage?
Yes. The device supports independent I/O supply (VDDQ = 1.4–1.8 V) and core supply (VDD = 1.8 V ±0.1 V). Operating at VDDQ = 1.5 V enables HSTL-15 compatibility with FPGAs like Xilinx Kintex-7, while retaining full 250 MHz performance and signal integrity.
How does the BWS[1:0] signal differ from standard byte enables in asynchronous SRAMs?
BWS[1:0] are synchronous, clocked byte write selects sampled on the rising edge of K/K alongside D[17:0]. Each controls a 9-bit segment (BWS0 → D[8:0], BWS1 → D[17:9]), enabling partial writes without read-modify-write cycles. Unlike asynchronous enables, they guarantee atomicity and timing alignment with the write clock domain.
CY7C1413KV18-250BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1413KV18-250BZCT FAQ
1.How can I place an order for CY7C1413KV18-250BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1413KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1413KV18-250BZCT reliable?
The price and inventory of CY7C1413KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1413KV18-250BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1413KV18-250BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1413KV18-250BZCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1413KV18-250BZCT?
CY7C1413KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1413KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1413KV18-250BZCT?
For technical support, including CY7C1413KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1413KV18-250BZCT requirements.
6.How does Aetrix verify that CY7C1413KV18-250BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1413KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1413KV18-250BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1413KV18-250BZCT?
All CY7C1413KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1413KV18-250BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1413KV18-250BZCT part is unused and in its original packaging.
Return procedure for CY7C1413KV18-250BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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