Infineon Technologies CY7C1413KV18-250BZXI

Overview

CY7C1413KV18-250BZXI from Cypress Semiconductor is a 2 M × 18, 36-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum operating frequency (40 ns clock period), 1.8 V core supply, and 1.4–1.8 V I/O supply. It supports concurrent read/write operations via independent ports, delivers 666 MT/s effective data rate using DDR interfaces on both ports, and is packaged in a 165-ball FBGA (13 × 15 × 1.4 mm) for high-density networking memory buffers.

For engineers reviewing the CY7C1413KV18-250BZXI datasheet, CY7C1413KV18-250BZXI pinout, CY7C1413KV18-250BZXI application, or CY7C1413KV18-250BZXI equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clocks (CQ/CQ) for timing margin recovery, JTAG 1149.1 test access, and HSTL-compatible variable-drive outputs for signal integrity in backplane and packet-switching systems.

Technical Context

This QDR II SRAM implements separate synchronous read and write ports sharing a multiplexed address bus, with address latching on alternate rising edges of K/K clocks. Internal self-timed writes eliminate external write pulse timing constraints, while dual output clocks (C/C) and echo clocks (CQ/CQ) decouple data capture timing from board flight time mismatches.

The device uses a PLL to align output data edges precisely with C/C clock transitions, enabling reliable 666 MT/s operation. Read latency is configurable: 1 cycle when DOFF = LOW (QDR I compatibility mode) or 1.5 cycles when DOFF = HIGH - a hardware-selectable trade-off between latency and setup/hold margin at full speed.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, Pb-free (BZXI suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1413KV18-300BZXI, this -250BZXI variant trades 50 MHz bandwidth for lower power (470 mA → 460 mA) and relaxed timing margins; versus AS7C362000B-250BIN, it offers proven JTAG testability and pin-compatible drop-in replacement within existing Cypress-based designs, but lacks QDR II+ enhancements.

Availability

CY7C1413KV18-250BZXI is available at Aetrix Electronics and suitable for 10G/25G Ethernet switch buffers, optical transport network (OTN) line cards, AI chiplet interposers, and broadcast video encoders requiring stable component supply across multi-year production cycles.

Supply support for CY7C1413KV18-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.

This device belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory buffering in high-speed packet processing and real-time video infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1413KV18-250BZXI?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for improved timing margin at 250 MHz; when LOW, it enables 1-cycle latency compatible with legacy QDR I timing. This is a static configuration pin sampled at power-up and cannot be changed dynamically during operation.

Can CY7C1413KV18-250BZXI operate with only one clock domain (K = C)?

Yes - the device supports single-clock mode where K and C are tied together (and K and C likewise). In this configuration, all inputs and outputs are synchronized to the same clock pair, simplifying clock tree design at the cost of reduced timing flexibility. Echo clocks (CQ/CQ) remain functional for data capture alignment.

What does "BZXI" in the part number signify?

The "BZXI" suffix indicates a 165-ball FBGA package (B), lead-free (Z), industrial temperature range (−40°C to +85°C) (I), and tape-and-reel packaging (X). It confirms RoHS compliance, extended thermal rating, and automated assembly readiness - critical for telecom and industrial deployments.

How is depth expansion implemented using port selects?

Depth expansion is achieved by cascading multiple CY7C1413KV18 devices using RPS (Read Port Select) and WPS (Write Port Select) signals. Each device's RPS/WPS is driven by decoded higher-order address bits, enabling independent enablement of read/write ports across the bank while sharing A[18:0], D[17:0], and Q[17:0] buses - preserving full concurrency across the expanded memory space.