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Infineon Technologies CY7C1413KV18-300BZCT

Part No.:
CY7C1413KV18-300BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1413KV18-300BZCT.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,735

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Product details

Overview

CY7C1413KV18-300BZCT from Cypress Semiconductor is a 2 M × 18, 36-Mbit QDR® II SRAM with four-word burst architecture, 300 MHz clock operation (600 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply - deployed in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1413KV18-300BZCT datasheet, CY7C1413KV18-300BZCT pinout, CY7C1413KV18-300BZCT application, or CY7C1413KV18-300BZCT equivalent, key selection criteria include read latency mode (DOFF-controlled), echo clock timing margin, HSTL-15/18 output drive compatibility, and 165-ball FBGA (13 × 15 × 1.4 mm) board layout constraints.

Technical Context

This QDR II SRAM implements fully independent read and write ports with separate address latching on alternating K-clock edges, enabling true concurrent transactions without bus turnaround. It uses dual input clocks (K/K̄) for DDR write timing and dual output clocks (C/C̄) plus echo clocks (CQ/CQ̄) to align data capture at the receiver.

The device integrates a PLL for precise internal data placement, supports programmable impedance via ZQ pin, and features synchronous self-timed writes with full data coherency. Read latency is configurable: 1 cycle when DOFF = LOW (QDR I mode) or 1.5 cycles when DOFF = HIGH (QDR II mode).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2 M × 18 organization)
Max Clock Frequency 300 MHz - sets maximum sustained bandwidth of 2.16 GB/s (18-bit × 600 MT/s)
Core Supply Voltage 1.8 V ±0.1 V - defines minimum power rail stability requirement for internal logic and array
I/O Supply Range 1.4 V to 1.8 V - supports interoperability with both HSTL-15 and HSTL-18 systems
Read Latency Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts pipeline depth in switch fabric designs
Package 165-ball FBGA (13 × 15 × 1.4 mm) - requires 0.8 mm ball pitch layout and controlled-impedance PCB routing
Output Drive Variable-drive HSTL - enables impedance matching to 50 Ω transmission lines without external termination resistors

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs Latched on rising edge of K clock; drives 18-bit parallel data into memory during active WPS
Q[17:0] Synchronous read data outputs Driven on rising edge of C/C̄ clocks; delivers bursted 4×18-bit words with echo-clock-aligned timing
WPS Write port select Active-low signal enabling write operations; deassertion blocks D[17:0] sampling and prevents unintended writes
RPS Read port select Active-low signal enabling read operations; deassertion places Q[17:0] in high-impedance state
BWS[1:0] Byte write selects Active-low controls which 9-bit byte (BWS0 → D[8:0], BWS1 → D[17:9]) is written; enables partial-word updates
K / K̄ Input clocks Differential pair driving all synchronous inputs; only rising edge used for register sampling
C / C̄ Output clocks Differential pair controlling Q[17:0] output registers; minimizes skew between data and clock paths
CQ / CQ̄ Echo clocks Replica of C/C̄ outputs - routed alongside Q[17:0] to simplify source-synchronous capture at FPGA/ASIC receiver
DOFF Read latency mode control High = 1.5-cycle latency (QDR II); Low = 1-cycle latency (QDR I) - configures internal pipeline depth
ZQ Impedance calibration reference Connects to 240 Ω ±1% external resistor to ground for on-die output driver impedance tuning

Key Features

Feature Design Value
Four-word burst architecture Reduces effective address bus frequency by 4× - e.g., 2 M-depth access requires only 21 address transitions per burst instead of 8 M
Separate read/write ports Enables simultaneous 18-bit read and 18-bit write every 3.33 ns at 300 MHz - eliminates arbitration overhead in traffic shaping buffers
Echo clock (CQ/CQ̄) support Provides deterministic setup/hold margins at receiver - eliminates need for complex PCB trace length matching between clock and data
Programmable output impedance Calibrates drive strength to match 50 Ω PCB traces using single ZQ resistor - reduces signal integrity tuning effort
JTAG 1149.1 test access port Enables boundary scan testing of interconnects in dense FBGA layouts - critical for production test coverage in telecom modules

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packets in multi-gigabit Ethernet switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffering between MAC and switching fabric - reads next packet while writing current one.

Use Value: Concurrent R/W capability sustains 2.16 GB/s throughput at 300 MHz; echo clocks ensure reliable capture at FPGA receivers without retiming logic.

Use Scenario: Frame assembly/disassembly in OC-192/STM-64 SONET line cards requiring deterministic memory access.

IC Role / Device Role / Timing Role: High-speed scratchpad for ATM cell reassembly - holds partial frames during header parsing and payload stitching.

Use Value: 1.5-cycle read latency (DOFF = HIGH) aligns with SONET frame timing; HSTL-15 compatibility matches legacy line card I/O standards.

Baseband Processing Buffer Test Equipment Pattern Memory

Use Scenario: Temporary storage of IQ samples between ADC/DAC stages in LTE/5G radio units.

IC Role / Device Role / Timing Role: Synchronous buffer decoupling RF front-end sampling rate from DSP processing clock domain.

Use Value: 18-bit data width matches typical ADC resolution; variable drive strength adapts to varying trace lengths across RF module PCBs.

Use Scenario: Storing stimulus/response patterns in high-speed ATE systems performing DDR4/LPDDR4 validation.

IC Role / Device Role / Timing Role: Deterministic-access pattern generator memory - feeds known vectors to DUT with sub-nanosecond timing control.

Use Value: PLL-based data placement ensures jitter < 15 ps RMS; JTAG boundary scan validates interposer connections in modular ATE fixtures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36125L10BG 36-Mbit (2 M × 18), 250 MHz max clock, 1.5 V core, LVDS outputs Lower speed; requires differential LVDS termination; no echo clocks Choose for cost-sensitive, lower-bandwidth systems where LVDS interface is already standardized
ISSI IS61WV102418B 18-Mbit (512 K × 18), 200 MHz, 3.3 V core, asynchronous interface Half density; no DDR or burst; no concurrent R/W; no echo clocks or PLL Choose only for legacy designs lacking QDR infrastructure - not a functional replacement

Compared with IDT72T36125L10BG and IS61WV102418B, CY7C1413KV18-300BZCT delivers 20% higher bandwidth, integrated echo clock timing, and programmable impedance - making it the sole option for new 300 MHz+ QDR II switch fabric designs requiring guaranteed data coherency.

Availability

CY7C1413KV18-300BZCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and test equipment pattern memory requiring stable component supply across multi-year production cycles.

Supply support for CY7C1413KV18-300BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1413KV18 belongs to the QDR® II SRAM product line - engineered specifically for deterministic, low-latency, concurrent-read-write memory subsystems in packet-switched infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1413KV18-300BZCT?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle QDR II latency for optimized burst efficiency; when LOW, it reverts to 1-cycle QDR I latency for minimal pipeline delay. This setting directly affects the number of clock cycles between address assertion and valid Q[17:0] output, and must be set before initialization completes.

How does the ZQ pin enable impedance calibration?

The ZQ pin connects to a 240 Ω ±1% external resistor to ground, allowing the device to calibrate its HSTL output drivers to match 50 Ω transmission lines. Calibration occurs automatically during power-up and can be triggered manually via JTAG. This eliminates need for external series termination resistors and improves signal integrity across varying PCB stackups.

Can CY7C1413KV18-300BZCT operate with only a single clock domain?

Yes - the device supports single-clock mode where K and C clocks are tied together (and K̄/C̄ similarly), simplifying system clocking. In this mode, data is sampled and driven on the same clock edges, but echo clock (CQ) functionality remains active for receiver timing alignment. Maximum frequency drops to 250 MHz in single-clock configuration per datasheet specifications.

What is the purpose of BWS[1:0] pins in a 2 M × 18 configuration?

BWS[1:0] are active-low byte write select signals that enable partial-word writes: BWS0 controls D[8:0] (first 9 bits), BWS1 controls D[17:9] (second 9 bits). When either is deasserted, the corresponding 9-bit segment retains its prior value - essential for updating specific fields within a 18-bit packet header without overwriting adjacent data.

CY7C1413KV18-300BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1413KV18-300BZCT FAQ

1.How can I place an order for CY7C1413KV18-300BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1413KV18-300BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1413KV18-300BZCT reliable?

The price and inventory of CY7C1413KV18-300BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1413KV18-300BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1413KV18-300BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1413KV18-300BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1413KV18-300BZCT?

CY7C1413KV18-300BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1413KV18-300BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1413KV18-300BZCT?

For technical support, including CY7C1413KV18-300BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1413KV18-300BZCT requirements.

6.How does Aetrix verify that CY7C1413KV18-300BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1413KV18-300BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1413KV18-300BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1413KV18-300BZCT?

All CY7C1413KV18-300BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1413KV18-300BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1413KV18-300BZCT part is unused and in its original packaging.

Return procedure for CY7C1413KV18-300BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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