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Infineon Technologies CY7C1413KV18-333BZXI

Part No.:
CY7C1413KV18-333BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1413KV18-333BZXI.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,470

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Product details

Overview

CY7C1413KV18-333BZXI from Cypress Semiconductor is a 2 M × 18, 36-Mbit QDR® II SRAM with four-word burst architecture, 333 MHz clock frequency, DDR interfaces on independent read/write ports (666 MHz data rate), and 1.8 V core / 1.4–1.8 V I/O supply - deployed in high-bandwidth packet buffering for telecom line cards.

For engineers reviewing the CY7C1413KV18-333BZXI datasheet, CY7C1413KV18-333BZXI pinout, CY7C1413KV18-333BZXI application, or CY7C1413KV18-333BZXI equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clock (CQ/CQ) support for timing margin, 165-ball FBGA package compatibility, and synchronous self-timed write capability.

Technical Context

The CY7C1413KV18-333BZXI implements QDR II architecture with physically separate read and write data paths, eliminating bus turnaround delays. It uses dual input clocks (K/K) for address/data latching and dual output clocks (C/C) with echo clocks (CQ/CQ) to compensate for PCB flight time skew.

Internally, it organizes memory as four 512 K × 18 arrays, accepts 19-bit addresses (A[18:0]), supports byte-write via BWS[1:0], and delivers full data coherency with synchronous pipelined access. The integrated PLL ensures precise data placement relative to output clocks.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2 M × 18 configuration)
Clock Frequency 333 MHz - enables 666 MT/s effective data rate per port
Read Latency 1.5 cycles (with DOFF = HIGH) - reduces pipeline stalls in burst-heavy systems
Supply Voltages VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - supports 1.5 V or 1.8 V interface levels
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count SRAMs in dense PCB layouts
Interface Type QDR II with independent DDR read/write ports - eliminates bidirectional bus contention
Write Mode Synchronous self-timed writes - removes external write pulse timing constraints

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free (BZXI suffix).

Pin/Terminal Circuit Role Design Meaning
D[17:0] Write data inputs 18-bit parallel data sampled on rising edge of K clock during active write
Q[17:0] Read data outputs 18-bit parallel data driven on rising edge of C/C clocks; echo-aligned with CQ/CQ
A[18:0] Address inputs 19-bit multiplexed address for both read/write ports; latched on K clock edges
WPS Write port select Active-low signal enabling write operations; deassertion disables D[17:0] sampling
BWS[1:0] Byte write selects Two active-low signals controlling which 9-bit bytes (D[8:0], D[17:9]) are written
CQ / CQ Echo clocks Output-synchronized copies of C/C clocks - simplify source-synchronous capture at FPGA/ASIC receiver
K / K Input clocks Dual-phase clocks for address/data latching; only rising edges used (no DDR clocking on inputs)
C / C Output clocks Dual-phase clocks driving Q[17:0]; paired with CQ/CQ for timing margin recovery
DOFF Read latency control High = 1.5-cycle latency; Low = 1-cycle latency - configures internal pipeline depth
VREF Reference voltage Provides HSTL-compatible reference for input threshold setting (VDDQ/2)

Key Features

Feature Design Value
Independent read/write DDR ports Enables concurrent read+write without bus arbitration or turnaround delay - critical for full-duplex packet buffers
Echo clock (CQ/CQ) support Eliminates need for precise PCB trace length matching between clock and data lines - simplifies layout in >300 MHz designs
Programmable read latency (DOFF) Allows runtime optimization between latency-sensitive (DOFF = LOW) and bandwidth-optimized (DOFF = HIGH) modes
Byte-selectable writes (BWS[1:0]) Permits partial-word updates without read-modify-write cycles - preserves integrity in multi-threaded buffer management
JTAG 1149.1 boundary scan Enables production testability and interconnect verification without additional test fixtures or probe points

Applications

Telecom Line Card Buffering Network Processor Interface

Use Scenario: Storing incoming/outgoing packet headers and payloads in OC-192/STM-64 line interface modules.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory between SERDES and traffic manager ASICs.

Use Value: 666 MT/s per port sustains full-duplex 10 Gbps line rates with zero bus turnaround overhead.

Use Scenario: Acting as instruction/data cache between multi-core network processors and packet classification engines.

IC Role / Device Role / Timing Role: Synchronous pipelined memory with deterministic 1.5-cycle read latency for real-time forwarding decisions.

Use Value: Echo clocks (CQ/CQ) ensure reliable data capture at 333 MHz despite board-level skew across 18-bit buses.

Baseband Processing Memory Test Equipment Pattern Storage

Use Scenario: Holding uplink/downlink channel coefficients and FFT buffers in LTE/5G remote radio units.

IC Role / Device Role / Timing Role: Dual-port SRAM interfacing with FPGA-based DSP pipelines using separate clock domains.

Use Value: Independent K/K and C/C clocks allow optimal timing alignment between ADC/DAC controllers and processing logic.

Use Scenario: Storing high-speed digital stimulus/response patterns in automated test equipment (ATE) channel cards.

IC Role / Device Role / Timing Role: Deterministic-access memory with JTAG boundary scan for post-manufacture interconnect validation.

Use Value: Self-timed writes eliminate external write strobe generation - simplifying pattern generator timing control logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L5 36-Mbit QDR II+, 500 MHz max clock, 1.5 V core, 165-ball FBGA - higher speed but tighter VDDQ tolerance (1.4–1.6 V) Requires stricter power rail regulation; not drop-in due to different BWS pin mapping and no DOFF latency control Select when system demands >333 MHz bandwidth and can accommodate revised power and control logic
ISSI IS61QW25636A-333B 256K × 36 QDR II, 333 MHz, 1.8 V core, 165-ball FBGA - same density class but ×36 organization vs. ×18 Requires wider data bus routing and different address decoding (18-bit A[17:0] vs. 19-bit A[18:0]) Select for applications needing 36-bit native word width and compatible with 256K depth instead of 2 M depth

Compared with IDT72T3615L5 and IS61QW25636A-333B, the CY7C1413KV18-333BZXI offers unique 2 M × 18 depth-width balance, flexible DOFF-configurable latency, and broader VDDQ range - making it optimal for depth-critical telecom buffering where 18-bit bus width aligns with common SerDes lane groupings.

Availability

CY7C1413KV18-333BZXI is available at Aetrix Electronics and suitable for telecom infrastructure, network processor interfacing, baseband processing, and high-speed test equipment requiring stable component supply and long-term obsolescence planning.

Supply support for CY7C1413KV18-333BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with focus on signal integrity and timing precision.

The QDR® II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking and test equipment - emphasizing concurrent access, echo-clock timing robustness, and synchronous self-timed operation.

FAQ

What is the function of the DOFF pin on CY7C1413KV18-333BZXI?

The DOFF (Data Output OFFset) pin controls read latency mode: when asserted HIGH, it configures 1.5-cycle read latency for optimized bandwidth; when LOW, it enables 1-cycle latency for minimal delay. This is implemented via internal pipeline staging and affects timing closure requirements for downstream receivers.

Does CY7C1413KV18-333BZXI support single-ended clocking?

No - the device requires differential clock pairs (K/K and C/C) for proper operation, though only the rising edge of each clock is used. Single-ended drive is not supported; external termination and matched routing for both phases are mandatory to meet setup/hold timing.

How many address bits does CY7C1413KV18-333BZXI require?

It uses 19 address bits (A[18:0]) to access its 2 M × 18 memory array. These are multiplexed for both read and write ports and sampled synchronously on the rising edge of the K clock during active operations.

Can CY7C1413KV18-333BZXI operate with VDDQ = 1.5 V while VDD = 1.8 V?

Yes - the datasheet explicitly permits VDDQ in the range 1.4 V to VDD (1.8 V), so 1.5 V is fully compliant. This allows interoperability with 1.5 V logic families while maintaining 1.8 V core stability, and is commonly used in mixed-voltage FPGA interfaces.

CY7C1413KV18-333BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
333 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1413KV18-333BZXI FAQ

1.How can I place an order for CY7C1413KV18-333BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1413KV18-333BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1413KV18-333BZXI reliable?

The price and inventory of CY7C1413KV18-333BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1413KV18-333BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1413KV18-333BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1413KV18-333BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1413KV18-333BZXI?

CY7C1413KV18-333BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1413KV18-333BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1413KV18-333BZXI?

For technical support, including CY7C1413KV18-333BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1413KV18-333BZXI requirements.

6.How does Aetrix verify that CY7C1413KV18-333BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1413KV18-333BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1413KV18-333BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1413KV18-333BZXI?

All CY7C1413KV18-333BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1413KV18-333BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1413KV18-333BZXI part is unused and in its original packaging.

Return procedure for CY7C1413KV18-333BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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