Infineon Technologies CY7C1414AV18-167BZC
- Part No.:
- CY7C1414AV18-167BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1414AV18-167BZC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1414AV18 from Cypress Semiconductor is a 1M × 36-bit (36-Mbit), 1.8V QDR-II™ synchronous SRAM with dual independent read/write ports, 250-MHz clock support, DDR interfaces on both ports (500-MHz data rate), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers full data coherency, synchronous self-timed writes, and echo clocks (CQ/CQ) for high-speed data capture in packet buffering applications.
For engineers reviewing the CY7C1414AV18 datasheet, CY7C1414AV18 pinout, CY7C1414AV18 application, or CY7C1414AV18 equivalent, this device is selected for high-bandwidth, low-latency memory subsystems requiring concurrent read/write operations without bus turnaround-especially in network line cards, FPGA-based accelerators, and telecom baseband processing where deterministic 2-word burst timing and HSTL-18 I/O compliance are critical.
Technical Context
The CY7C1414AV18 implements QDR-II architecture with physically separate read and write data paths, eliminating bus contention and turn-around delays. Its 19-bit address bus (A[18:0]) accesses two internal 512K × 36 arrays, and all synchronous inputs (RPS, WPS, BWS[3:0], D[35:0]) are registered on rising edges of K/K clocks.
Read data (Q[35:0]) is output-synchronized to C/C clocks with echo clocks CQ/CQ for skew compensation; DLL ensures precise data placement relative to output clocks. Core VDD = 1.8 V ±0.1 V and I/O VDDQ = 1.4–1.8 V support HSTL-18 drive strength and impedance matching via ZQ pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 167 MHz - defines maximum sustained transaction rate (334 MT/s effective due to DDR) |
| Data Bus Width | 36-bit bidirectional I/O - supports parallel high-throughput data transfers per access |
| Burst Length | 2-word burst - delivers two consecutive 36-bit words per read/write cycle, reducing address overhead |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - enables HSTL-18 compatible signaling and low-power operation |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - surface-mount package optimized for high-density PCB routing and thermal dissipation |
| Timing Architecture | Synchronous pipelined with DLL - eliminates setup/hold violations at 167 MHz by aligning internal data edges to output clocks |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant lead-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Input | 36-bit synchronous write data bus, sampled on rising edge of K clock; supports byte-level write masking via BWS[3:0] |
| Q[35:0] | Output | 36-bit synchronous read data bus, driven on rising edges of C/C clocks; tri-stated when RPS is deasserted |
| A[18:0] | Input | 19-bit multiplexed address bus latched separately on K (read) and K (write) rising edges |
| RPS / WPS | Input | Active-low port select signals - enable independent read/write transactions without arbitration logic |
| BWS[3:0] | Input | Four active-low byte write selects - mask individual 9-bit bytes during write, preserving unselected data |
| K / K | Input | Complementary input clocks - control all synchronous inputs; rising edges latch addresses, commands, and data |
| C / C | Input | Complementary output clocks - define timing for Q[35:0] and CQ/CQ; used for board-level skew compensation |
| CQ / CQ | Output | Echo clocks synchronized to C/C - simplify source-synchronous capture at controller side with matched flight time |
| ZQ | Input | Impedance calibration reference - tunes output driver strength to match 50 Ω system trace impedance via external resistor |
| VDD / VDDQ / VSS | Power/Ground | Dedicated core (1.8 V), I/O (1.4–1.8 V), and ground pins - minimize noise coupling between logic and I/O domains |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Enables true concurrent access - no bus turnaround required, eliminating dead cycles in high-throughput streaming systems |
| 2-Word DDR Burst Architecture | Delivers 72 bits per clock cycle (36-bit × 2) on both read and write paths, doubling effective bandwidth over single-data-rate SRAM |
| HSTL-18 Compatible I/O | Supports 1.4–1.8 V VDDQ with programmable drive strength - ensures signal integrity on high-speed backplanes and dense FPGA interconnects |
| JTAG 1149.1 Test Access Port | Enables boundary-scan testing and in-system debug without additional test fixtures or probe points |
| Delay Lock Loop (DLL) | Aligns internal data launch timing to output clocks within ±50 ps - guarantees setup/hold margins at 167 MHz operation |
Applications
| Network Packet Buffering | FPGA-Based Acceleration |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with zero-latency read-after-write requirements. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress and egress traffic engines, using RPS/WPS for independent arbitration. Use Value: Eliminates bus contention and turnaround delay, enabling full-duplex 10 Gbps+ throughput with deterministic 2-cycle latency per 72-bit burst. | Use Scenario: High-speed data staging between FPGA fabric and external SerDes or memory controllers in AI inference accelerators. IC Role / Device Role / Timing Role: Low-latency, pipelined memory interface providing simultaneous instruction fetch and operand load for parallel compute units. Use Value: Sustains 334 MT/s effective bandwidth with sub-10 ns read-to-write turnaround, matching FPGA logic pipeline depth without stalling. |
| Telecom Baseband Processing | Real-Time Video Frame Buffering |
Use Scenario: Intermediate storage of OFDM symbols and channel estimation data in 4G/5G baseband units with strict timing deadlines. IC Role / Device Role / Timing Role: Synchronous burst memory interfacing with DSP cores and FFT hardware accelerators via dedicated read/write ports. Use Value: Guarantees coherent 2-word bursts aligned to symbol boundaries, supporting 167 MHz symbol clocking with DLL-compensated output timing. | Use Scenario: Line-by-line buffering of uncompressed 4K@60fps video streams between image sensor interface and video processor. IC Role / Device Role / Timing Role: High-bandwidth frame store with independent read (display engine) and write (sensor interface) channels. Use Value: Delivers 36-bit × 2-word bursts at 167 MHz to sustain >10 Gbps pixel throughput without frame tearing or FIFO overflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1412AV18 | 2M × 18 organization (36 Mbit), same QDR-II architecture, 20-bit address bus, BWS[1:0] instead of BWS[3:0] | Requires wider data bus (18-bit × 2) and different byte-mask granularity; suited for 18-bit datapath systems like legacy DSPs | Select when system uses 18-bit native word width and needs identical timing but lower pin count for address lines |
| AS7C33618B-167BIN | 36-Mbit QDR-II+ SRAM, 167 MHz, 1.8 V core, but supports 200 MHz max and enhanced DLL jitter performance | Offers higher frequency headroom and improved AC timing margins; pin-compatible but requires updated layout for VREF/ZQ routing | Choose for new designs targeting margin-critical 200 MHz operation or requiring tighter output jitter specs |
Compared with CY7C1412AV18 and AS7C33618B-167BIN, the CY7C1414AV18 provides optimal 36-bit native interface alignment for modern packet processors and FPGA I/O banks, while maintaining proven reliability at 167 MHz with minimal board-level timing tuning.
Availability
CY7C1414AV18 is available at Aetrix Electronics and suitable for network infrastructure, FPGA acceleration, telecom baseband, and real-time video processing applications requiring stable component supply across multi-year production cycles.
Supply support for CY7C1414AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems.
The QDR-II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking, wireless infrastructure, and high-end computing-emphasizing deterministic timing, concurrent access, and system-level signal integrity.
FAQ
What is the minimum VDDQ voltage supported by CY7C1414AV18?
The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed and may cause HSTL output drive failure or timing violations. The 1.4 V lower bound is specified in the DC Characteristics table of the datasheet and validated across temperature and process corners.
Can CY7C1414AV18 operate in single-clock mode?
Yes. When C and C are tied together and driven by K (or K), the device operates in single-clock mode. In this configuration, Q[35:0] and CQ/CQ are synchronized to K/K, simplifying clock distribution at the cost of reduced deskew capability compared to dual-clock operation.
How does the ZQ pin affect output impedance calibration?
ZQ connects to an external resistor (typically 50 Ω) to ground, enabling on-die termination calibration. The device sets CQ, CQ, and Q[35:0] output impedance to 0.2 × RQ (e.g., 10 Ω for 50 Ω RQ). Connecting ZQ directly to VDDQ enables minimum impedance mode (~7 Ω), but floating or grounding ZQ is prohibited and causes undefined behavior.
Is JTAG boundary-scan supported during normal operation?
Yes. The IEEE 1149.1 TAP controller operates independently of memory function. TDI, TDO, TCK, and TMS retain full boundary-scan capability even while RPS/WPS are active and data transfers occur-enabling in-system test without halting system operation.
CY7C1414AV18-167BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1414AV18-167BZC FAQ
1.How can I place an order for CY7C1414AV18-167BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1414AV18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1414AV18-167BZC reliable?
The price and inventory of CY7C1414AV18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1414AV18-167BZC is usually 5 days.
3.What payment methods are accepted for CY7C1414AV18-167BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1414AV18-167BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1414AV18-167BZC?
CY7C1414AV18-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1414AV18-167BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1414AV18-167BZC?
For technical support, including CY7C1414AV18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1414AV18-167BZC requirements.
6.How does Aetrix verify that CY7C1414AV18-167BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1414AV18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1414AV18-167BZC meets industry standards.
7.What is the process for return or replacement of CY7C1414AV18-167BZC?
All CY7C1414AV18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1414AV18-167BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1414AV18-167BZC part is unused and in its original packaging.
Return procedure for CY7C1414AV18-167BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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