Infineon Technologies CY7C1414AV18-250BZC

Overview

CY7C1414AV18 from Cypress Semiconductor is a 1M × 36-bit, 36-Mbit QDR-II™ SRAM with separate read/write ports, 250 MHz clock operation, DDR interfaces on both ports (500 MT/s effective data rate), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers full data coherency, synchronous self-timed writes, and supports depth expansion via independent port selects - deployed in high-speed network packet buffers and switch fabric memory subsystems.

For engineers reviewing the CY7C1414AV18 datasheet, CY7C1414AV18 pinout, CY7C1414AV18 application, or CY7C1414AV18 equivalent, key selection criteria include its 1.8V core / 1.4V–1.8V I/O supply range, HSTL-compatible variable-drive outputs, JTAG 1149.1 test access, DLL-based timing accuracy, and 2-word burst architecture enabling deterministic latency in pipelined memory systems.

Technical Context

The CY7C1414AV18 implements QDR-II architecture with physically isolated read and write data paths - eliminating bus turnaround overhead and preventing data contention. Its dual-clock domain uses K/K for address/data capture and C/C for output timing, with echo clocks CQ/CQ referenced to C/C to compensate for flight-time skew in multi-device layouts.

All synchronous inputs (RPS, WPS, BWS[3:0], A[18:0], D[35:0]) are registered on rising edges of K or K; all outputs (Q[35:0], CQ, CQ) are edge-aligned to C/C or K/K in single-clock mode. The internal 512K × 36 array is split into two banks, supporting concurrent read/write operations with guaranteed data coherency and no arbitration logic required.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant lead-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with AS7C362000B-250BIN and IS61WV102436BLL-250TQLI, the CY7C1414AV18 provides superior timing control via DLL and echo clocks, finer 8-bit write granularity, and 1.8V core compatibility - critical for modern low-power, high-density switch fabric implementations.

Availability

CY7C1414AV18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, high-speed test equipment memory, and real-time signal processing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for CY7C1414AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.

The QDR-II SRAM product line targets high-throughput, low-latency memory subsystems in packet-switched infrastructure - specifically engineered to replace asynchronous SRAMs and simplify DDR-based buffer design in telecom and datacom equipment.

FAQ

What is the minimum VDDQ voltage supported for CY7C1414AV18 operation?

The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V violates HSTL-18 input thresholds and output drive specifications, risking setup/hold violations and increased bit error rates. The 1.4 V lower bound is validated in AC timing tables and must be maintained across temperature and load conditions.

Can CY7C1414AV18 operate in single-clock mode without C and C inputs?

Yes - when C and C are tied to K and K respectively, the device enters single-clock mode. In this configuration, Q[35:0] and CQ/CQ are driven on rising edges of K/K, eliminating need for separate output clocks but removing flight-time deskew capability. All timing parameters shift to K/K-referenced values per datasheet Table 10.

How does ZQ pin calibration affect output drive strength?

ZQ connects to an external resistor (RQ) to ground, setting output impedance to 0.2×RQ for Q[35:0], CQ, and CQ. For example, a 50 Ω RQ yields 10 Ω driver impedance, matching typical 50 Ω PCB traces. Direct connection to VDDQ enables minimum impedance (~7 Ω), while floating or grounding ZQ causes undefined behavior and timing violations.

Is JTAG boundary scan functional when DOFF is asserted?

Yes - DOFF only disables the internal DLL and does not affect JTAG TAP controller operation. TCK/TMS/TDI/TDO remain fully functional for IEEE 1149.1 compliance testing regardless of DLL state. However, AC timing parameters change when DLL is off, so scan patterns must account for altered propagation delays.