Infineon Technologies CY7C1414KV18-250BZCT

Overview

CY7C1414KV18 from Cypress Semiconductor is a 1M × 36, 36-Mbit QDR® II SRAM with two-word burst architecture, 1.8 V core supply, and 1.4–1.8 V I/O supply. It supports concurrent read/write operations at 250 MHz (500 MT/s effective), features separate DDR read/write ports with echo clocks (CQ/CQ), and delivers deterministic 1.5-cycle read latency when DOFF = HIGH. It is used in high-speed network packet buffering and FPGA-based protocol acceleration.

For engineers reviewing the CY7C1414KV18 datasheet, CY7C1414KV18 pinout, CY7C1414KV18 application, or CY7C1414KV18 equivalent, key selection criteria include its 1M × 36 organization, 165-ball FBGA package, dual-clock DDR timing, echo clock support for source-synchronous capture, and DOFF-configurable read latency mode.

Technical Context

The CY7C1414KV18 implements a true dual-port QDR II architecture with physically independent read and write data paths-no bus turnaround required. Its 19-bit address bus latches both read and write addresses on alternating rising edges of K/K clocks, enabling full port independence.

It uses a PLL to align output data with echo clocks CQ/CQ, supporting precise source-synchronous capture at 500 MT/s. The device supports byte-write masking via four BWS signals (BWS0–BWS3), each controlling a 9-bit byte within the 36-bit D[35:0] bus, ensuring partial writes without read-modify-write overhead.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, JEDEC MO-270AC compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1412KV18 and AS7C336000B-250BIN, the CY7C1414KV18 uniquely balances 36-bit native width, 250 MHz reliability, and mature ecosystem support-making it optimal for cost-sensitive, volume-deployed networking hardware where 1M × 36 mapping simplifies address translation and reduces FPGA logic usage.

Availability

CY7C1414KV18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA-based protocol acceleration, telecom baseband processing, and high-speed test equipment requiring stable component supply across multi-year production cycles.

Supply support for CY7C1414KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing predictability.

The QDR® II SRAM product line was developed specifically for deterministic, high-throughput memory access in packet-switched infrastructure-prioritizing concurrent dual-port operation, echo-clock synchronization, and low-latency configurability over density or cost-per-bit.

FAQ

What is the function of the DOFF pin on CY7C1414KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for maximum throughput; when LOW, it selects 1-cycle latency for minimal delay. This setting affects internal pipeline staging but does not alter clock frequencies, timing margins, or pin compatibility.

Can CY7C1414KV18 operate with only a single clock (K) instead of differential K/K?

Yes-CY7C1414KV18 supports single-ended clocking where K is used for all synchronous inputs and Q[35:0] outputs are clocked by K. In this mode, C/C and CQ/CQ are unused, and the device behaves as a single-clock DDR SRAM with simplified timing but reduced skew tolerance.

How does byte write select (BWS) work with the 36-bit data bus?

BWS[3:0] independently enables four 9-bit segments of D[35:0]: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. Each is sampled synchronously with data on the K clock edge; deselected bytes retain prior contents, enabling atomic partial writes without read-modify-write cycles.

Is the 165-ball FBGA package of CY7C1414KV18 compatible with standard reflow profiles?

Yes-the 165-ball FBGA (13 × 15 × 1.4 mm) uses SnAgCu (SAC305) solder balls and complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3. Standard lead-free reflow profiles with peak temperature ≤260°C and time above liquidus 60–150 seconds are fully supported.