Infineon Technologies CY7C1414KV18-250BZXC

Overview

CY7C1414KV18 from Cypress Semiconductor is a 1M × 36, 36-Mbit QDR® II SRAM with two-word burst architecture, 250 MHz maximum operating frequency (400 Mbps per pin), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, echo clocks (CQ/CQ), and PLL-based DDR timing for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C1414KV18 datasheet, CY7C1414KV18 pinout, CY7C1414KV18 application, or CY7C1414KV18 equivalent, this page delivers verified package mapping (165-ball FBGA), confirmed pin functions (e.g., WPS, RPS, BWS[3:0], D[35:0], Q[35:0]), real-world latency behavior (1.5-cycle read latency with DOFF HIGH), and validated alternatives for depth- or width-matched memory expansion.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write ports sharing a multiplexed 19-bit address bus, with address latching on alternate rising edges of K/K clocks. Its dual DDR interfaces deliver 666 MT/s effective data rate at 250 MHz clock input.

The device uses internal PLL to align CQ/CQ echo clocks with output data timing, enabling precise capture in high-speed SerDes and packet buffer systems. DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency modes, directly affecting pipeline depth in switch fabric controllers.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1414KV18, CY7C1412KV18 trades bus width for simpler routing and lower power per chip but increases component count, while AS7C33618A-250BIN offers higher speed and updated voltage support at the cost of minor timing requalification effort.

Availability

CY7C1414KV18 is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and PCIe-based accelerator caches requiring stable component supply across multi-year production cycles.

Supply support for CY7C1414KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.

CY7C1414KV18 belongs to the QDR II SRAM product line, engineered specifically for concurrent-read/write, low-latency buffering in packet-switched infrastructure where deterministic timing and burst efficiency are critical.

FAQ

What is the function of the DOFF pin on CY7C1414KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for pipelined system integration; when LOW, it provides 1-cycle latency compatible with legacy QDR I timing. This setting directly affects the number of wait states required in the memory controller's read state machine and must be fixed at power-up.

Can CY7C1414KV18 operate with only a single clock source?

Yes - the device supports single-clock-domain operation using only the K clock for both input and output timing (K drives inputs, and K also clocks Q[35:0] outputs). In this mode, C/C and CQ/CQ are unused, simplifying clock tree design but sacrificing deskew capability and limiting maximum achievable bandwidth due to increased flight-time mismatch.

How does byte write select (BWS) work with the 36-bit data bus?

BWS[3:0] controls four independent 9-bit byte lanes: BWS0 for D[8:0], BWS1 for D[17:9], BWS2 for D[26:18], and BWS3 for D[35:27]. Each is active LOW; asserting only BWS1 and BWS2, for example, writes exclusively to bits 9–26 while preserving bits 0–8 and 27–35 - eliminating need for read-modify-write cycles in partial updates.

Is the 165-ball FBGA package lead-free compliant?

Yes - CY7C1414KV18 is offered in both Pb-free (RoHS-compliant) and non-Pb-free packaging variants. The BZXC suffix denotes the lead-free, halogen-free, 165-ball FBGA package with NiPdAu surface finish, qualified per J-STD-020 moisture sensitivity level 3 and JEDEC JESD22-A110 reliability standards.