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Infineon Technologies CY7C1414KV18-250BZXCT

Part No.:
CY7C1414KV18-250BZXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1414KV18-250BZXCT.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,508

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Product details

Overview

CY7C1414KV18-250BZXCT from Cypress Semiconductor is a 1M × 36, 36-Mbit QDR® II SRAM with two-word burst architecture, 250 MHz maximum clock frequency (K/K), 1.8 V core supply, 1.4–1.8 V I/O supply, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers concurrent read/write operations via independent ports, DDR interfaces on both ports (500 Mbps per pin), and echo clocks (CQ/CQ) for high-speed data capture in networking line cards and packet buffers.

For engineers reviewing the CY7C1414KV18-250BZXCT datasheet, CY7C1414KV18-250BZXCT pinout, CY7C1414KV18-250BZXCT application, or CY7C1414KV18-250BZXCT equivalent, key selection criteria include 1M × 36 organization, 250 MHz K-clock timing, DOFF-controlled 1-cycle vs. 1.5-cycle read latency, BWS[3:0] byte write select granularity, and 165-ball FBGA mechanical compatibility with high-density memory subsystems.

Technical Context

This QDR II SRAM implements fully synchronous, pipelined operation with separate K/K input clocks for address/data capture and C/C output clocks for data launch-enabling precise DDR timing without bus turnaround. Its dual-port architecture supports true concurrent read and write transactions to the same memory array, with each access delivering two sequential 36-bit words.

The device integrates an internal PLL for accurate data placement, JTAG 1149.1 boundary scan for testability, and programmable HSTL output drivers. Read latency is configurable via DOFF: LOW yields 1-cycle latency (like QDR I), HIGH enables 1.5-cycle latency optimized for higher-frequency operation with relaxed setup/hold margins.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization1M × 36 (36 Mbit total); enables single-device 36-bit wide data path for packet header + payload storage
Maximum Clock Frequency (K/K)250 MHz; defines maximum sustained transaction rate of 250 million read/write operations per second
Data Rate (per pin)500 Mbps (DDR at 250 MHz); supports 18 Gbps aggregate bandwidth across 36-bit data bus
Read Latency ModeConfigurable via DOFF pin: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts timing closure in FPGA-based controllers
Supply VoltagesVDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5 V or 1.8 V logic families
Package165-ball FBGA (13 × 15 × 1.4 mm); RoHS-compliant, 0.8 mm ball pitch, compatible with standard SMT reflow profiles
Byte Write ControlBWS[3:0] inputs enable independent 9-bit byte masking during writes - preserves untargeted data without read-modify-write overhead

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputsLatched on rising edge of K clock; 36-bit parallel input path for burst writes
Q[35:0]Synchronous read data outputsDriven on rising edges of C/C clocks; tristated when RPS is deasserted
WPS, RPSPort select controlsActive-low enables; decouple read/write port activation for depth expansion or power gating
BWS[3:0]Byte write select inputsEach controls one 9-bit byte (D[8:0], D[17:9], D[26:18], D[35:27]); enables partial-word writes
K, KInput clock pairRising edges latch all synchronous inputs (address, data, control); K used for read address, K for write address
C, COutput clock pairDeskew-capable clocks for Q[35:0] launch; minimize flight-time mismatch across multi-device memory channels
CQ, CQEcho clocksFree-running copies of C/C, synchronized to source; simplify source-synchronous capture in high-speed receivers
DOFFRead latency mode selectHIGH → 1.5-cycle latency (QDR II mode); LOW → 1-cycle latency (QDR I compatibility mode)

Key Features

FeatureDesign Value
Independent read/write portsEliminates bus turnaround delay - enables full-duplex memory access critical for real-time packet buffering
Two-word burst architectureEvery access transfers two consecutive 36-bit words - matches typical network packet header + payload alignment
Configurable read latency (DOFF)Supports migration from QDR I designs (1-cycle) while enabling higher-frequency QDR II operation (1.5-cycle)
Four-byte write masking (BWS[3:0])Enables atomic 9-bit, 18-bit, or 27-bit updates without read-modify-write - reduces controller overhead in protocol processing
JTAG 1149.1 boundary scanProvides IEEE-standard test access for interconnect verification and production test - essential for high-reliability telecom PCBs

Applications

High-Speed Packet BufferingNetwork Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency, concurrent-access buffer between MAC and traffic manager.

Use Value: 36-bit width matches common packet descriptor size; 250 MHz clock supports ≥9 Gbps line-rate buffering with no bus contention.

Use Scenario: Depth-expanded memory subsystem in carrier-grade router line cards requiring >1 Mword capacity.

IC Role / Device Role / Timing Role: One of multiple CY7C1414KV18 devices stacked using WPS/RPS for independent port addressing.

Use Value: Port-select expansion avoids external address demux; BWS[3:0] enables per-byte ECC scrubbing without full-word rewrite.

Telecom Baseband ProcessingFPGA-Based Protocol Acceleration

Use Scenario: Real-time symbol buffering in LTE/5G baseband units handling multi-carrier OFDM streams.

IC Role / Device Role / Timing Role: Low-latency memory for FFT/IFFT result staging and channel estimation coefficient storage.

Use Value: 1.5-cycle latency mode (DOFF=HIGH) meets tight timing budgets at 250 MHz; echo clocks simplify FPGA capture timing.

Use Scenario: Offloading TCP/IP checksum, TLS encryption, or deep packet inspection in SmartNICs.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory tightly coupled to FPGA soft-core processors or custom accelerators.

Use Value: Concurrent read/write enables simultaneous instruction fetch and data update; 165-ball FBGA fits dense FPGA mezzanine layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1414KV18-250AXISame 1M × 36 organization and timing, but in 165-ball FBGA with commercial temperature range (0°C to 70°C) and non-Pb finishTargeted at cost-sensitive industrial systems where extended temperature is not requiredSelect when RoHS exemption applies or Pb-free compliance is not mandated
AS7C33618B-250BIN1M × 36 QDR II+ SRAM with 250 MHz speed, but adds dynamic ODT and enhanced PLL jitter specs; pinout differs (165-ball but signal assignment incompatible)Used in next-gen optical transport where tighter jitter tolerance and on-die termination reduce signal integrity riskChoose only if redesigning PCB layout; not drop-in replaceable due to pin mapping and control signal differences

Compared with CY7C1414KV18-250BZXCT, the -250AXI offers identical functionality in commercial temp grade with legacy finish, while AS7C33618B-250BIN provides higher signal integrity features at the cost of layout redesign - making the BZXCT optimal for existing Pb-free telecom designs requiring guaranteed availability and footprint compatibility.

Availability

CY7C1414KV18-250BZXCT is available at Aetrix Electronics and suitable for high-speed packet buffering, network line card memory, telecom baseband processing, and FPGA-based protocol acceleration requiring stable component supply across extended temperature and Pb-free compliance.

Supply support for CY7C1414KV18-250BZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

The QDR® II SRAM product line targets high-bandwidth, low-latency memory subsystems in packet infrastructure - specifically engineered to eliminate bus turnaround and support concurrent access in ASIC/FPGA-based line cards and switches.

FAQ

What is the function of the DOFF pin on CY7C1414KV18-250BZXCT?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency (standard QDR II operation), optimizing timing margins at 250 MHz; when LOW, it selects 1-cycle latency for backward compatibility with QDR I controllers. This setting directly affects the C/C clock-to-Q[35:0] valid timing and must be fixed at power-up.

How does byte write select (BWS[3:0]) operate in CY7C1414KV18-250BZXCT?

BWS[3:0] are active-low inputs that independently enable writing to four 9-bit byte lanes (D[8:0], D[17:9], D[26:18], D[35:27]). During a write cycle, only bytes with asserted BWS signals are updated; unselected bytes retain prior contents. All BWS signals are sampled synchronously with D[35:0] on the rising edge of K, enabling atomic partial-word writes without read-modify-write sequences.

Can CY7C1414KV18-250BZXCT operate with a single clock domain?

Yes - the device supports single-clock-mode operation where K and C are tied together (and K and C tied together), simplifying system clocking. In this mode, data is launched on Q[35:0] using K/K instead of C/C, and echo clocks CQ/CQ track K/K. However, deskew capability is lost, and timing margins tighten; dual-clock mode is recommended for >200 MHz operation per the datasheet AC specifications.

What is the purpose of the echo clocks CQ and CQ?

CQ and CQ are free-running, source-synchronous echo copies of C and C, respectively, generated internally and output with minimal skew relative to Q[35:0]. They provide a deterministic timing reference for the receiving controller to latch read data, eliminating need for complex board-level trace length matching - critical for reliable 500 Mbps DDR capture in multi-drop memory channels.

CY7C1414KV18-250BZXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1414KV18-250BZXCT FAQ

1.How can I place an order for CY7C1414KV18-250BZXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1414KV18-250BZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1414KV18-250BZXCT reliable?

The price and inventory of CY7C1414KV18-250BZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1414KV18-250BZXCT is usually 5 days.

3.What payment methods are accepted for CY7C1414KV18-250BZXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1414KV18-250BZXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1414KV18-250BZXCT?

CY7C1414KV18-250BZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1414KV18-250BZXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1414KV18-250BZXCT?

For technical support, including CY7C1414KV18-250BZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1414KV18-250BZXCT requirements.

6.How does Aetrix verify that CY7C1414KV18-250BZXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1414KV18-250BZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1414KV18-250BZXCT meets industry standards.

7.What is the process for return or replacement of CY7C1414KV18-250BZXCT?

All CY7C1414KV18-250BZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1414KV18-250BZXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1414KV18-250BZXCT part is unused and in its original packaging.

Return procedure for CY7C1414KV18-250BZXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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