Infineon Technologies CY7C1414KV18-300BZXI

Overview

CY7C1414KV18-300BZXI from Cypress Semiconductor is a 1M × 36, 36-Mbit QDR® II SRAM with two-word burst architecture, 300 MHz clock operation (600 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply - deployed in high-bandwidth packet buffering for network line cards and switch fabric interfaces.

For engineers reviewing the CY7C1414KV18-300BZXI datasheet, CY7C1414KV18-300BZXI pinout, CY7C1414KV18-300BZXI application, or CY7C1414KV18-300BZXI equivalent, key selection criteria include concurrent read/write port independence, echo-clock–assisted timing closure at 600 Mbps, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, and FBGA-165 package compatibility with high-density routing constraints.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write ports sharing one multiplexed address bus, with separate K/K clocks for address/data capture and C/C clocks for output timing - enabling true concurrent transactions without bus turnaround. It uses on-chip PLL for precise data placement and supports both single- and dual-clock domain modes.

The device delivers 1M × 36 organization (512K × 36 per internal array), 19-bit address bus, four byte-write selects (BWS[3:0]), and echo clocks (CQ/CQ) synchronized to C/C for source-synchronous data capture - critical for deterministic timing in multi-device memory subsystems operating above 500 Mbps per pin.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1414KV18-250BZXI, the -300BZXI delivers +20% bandwidth at higher power; compared with AS7C336000B-300BIN, it offers proven controller compatibility but lacks dynamic latency features - making it optimal for stable, high-throughput legacy designs.

Availability

CY7C1414KV18-300BZXI is available at Aetrix Electronics and suitable for network line cards, telecom baseband units, high-speed test equipment, and switch fabric interfaces requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1414KV18-300BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1414KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in packet-switched infrastructure where bus turnaround overhead must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C1414KV18-300BZXI?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, the device operates with 1.5-cycle read latency (QDR II mode); when LOW, it uses 1-cycle latency (QDR I–compatible). This setting is sampled synchronously on the rising edge of K and affects all subsequent read operations until changed.

Can CY7C1414KV18-300BZXI operate with only a single clock domain?

Yes - the device supports single-clock mode where K and C are tied together (and K and C likewise), simplifying board layout. In this mode, data is latched and driven using only the K/K pair, and echo clocks (CQ/CQ) derive from K/K instead of C/C. All timing parameters adjust accordingly per the datasheet's single-clock AC table.

How does the BWS[3:0] signal enable partial writes in CY7C1414KV18-300BZXI?

BWS[3:0] controls four independent 9-bit byte lanes within the 36-bit D[35:0] bus. Each BWS bit, when LOW, enables writing to its corresponding byte group (e.g., BWS0 → D[8:0]); HIGH disables that byte. This allows atomic 9-, 18-, or 27-bit updates without reading-modifying-writing the full 36-bit word - preserving data coherency in multi-threaded access scenarios.

Is the 165-ball FBGA package of CY7C1414KV18-300BZXI compatible with standard reflow profiles?

Yes - the Pb-free 165-ball FBGA package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C. Thermal resistance (θ_JA) is 24.5 °C/W, and the 1.4 mm height supports standard pick-and-place and underfill processes used in high-reliability telecom and industrial assemblies.