Infineon Technologies CY7C1414KV18-333BZC
- Part No.:
- CY7C1414KV18-333BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1414KV18-333BZC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1414KV18 from Cypress Semiconductor is a 1M × 36, 36-Mbit QDR® II SRAM with two-word burst architecture, 333 MHz clock operation (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply - deployed in high-bandwidth networking line cards for packet buffering and header lookup.
For engineers reviewing the CY7C1414KV18 datasheet, CY7C1414KV18 pinout, CY7C1414KV18 application, or CY7C1414KV18 equivalent, key selection criteria include concurrent read/write port independence, echo-clock–assisted timing closure at 666 MHz, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, and FBGA-165 package compatibility with high-density routing constraints.
Technical Context
This QDR II SRAM implements fully independent synchronous read and write ports sharing a multiplexed address bus, with all inputs latched on rising edges of K/K clocks and outputs registered to C/C clocks. It uses on-chip PLL for precise data placement and supports both dual-clock (K/K + C/C) and single-clock (K-only) modes.
The device delivers true concurrent transactions via separate D[35:0] input and Q[35:0] output buses, eliminating bus turnaround overhead. Depth expansion is enabled by RPS/WPS controls and four byte-write selects (BWS[3:0]), each governing 9-bit subwords within the 36-bit data path.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 333 MHz - enables 666 MT/s DDR throughput per port |
| Read Latency | Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) |
| Burst Length | Fixed two-word burst - delivers 72 bits per access on 36-bit bus |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - RoHS-compliant, thermal-enhanced |
| Interface Standard | HSTL Class I compatible - supports impedance-controlled signaling at 666 MHz |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, JEDEC MO-245 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit parallel input sampled on rising edge of K clock; supports byte-selectable writes via BWS[3:0] |
| Q[35:0] | Synchronous read data output | 36-bit parallel output registered to C/C clocks; tristated when RPS is deasserted |
| RPS / WPS | Port select control | Active-low asynchronous enable for read/write ports - enables independent depth expansion |
| BWS[3:0] | Byte write select | Four independent active-low signals controlling 9-bit subwords; allows partial-word writes without read-modify-write |
| K / K | Input clock pair | Differential clock inputs for address/data capture - only rising edges used; K drives write logic, K drives read logic |
| C / C | Output clock pair | Differential clocks for Q[35:0] output registration - minimizes skew across wide data bus |
| CQ / CQ | Echo clock pair | Free-running copies of C/C - referenced to controller's sampling point to simplify timing margin analysis |
| DOFF | Read latency mode control | Static configuration pin: LOW → 1-cycle latency; HIGH → 1.5-cycle latency - sets internal pipeline depth |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Fully independent data paths eliminate bus turnaround delay - critical for full-duplex packet processing |
| Two-Word Burst Architecture | Guarantees 72-bit data delivery per access - matches typical network header + payload alignment |
| Echo Clocks (CQ/CQ) | Enable deterministic setup/hold timing at receiver - removes flight-time uncertainty in multi-device systems |
| Programmable Read Latency | DOFF pin selects between 1-cycle (low-latency control plane) and 1.5-cycle (higher-frequency timing closure) modes |
| Byte-Write Select (BWS[3:0]) | Four 9-bit write masks allow granular 36-bit word updates - avoids destructive overwrites in shared memory buffers |
Applications
| Network Packet Buffering | Switch Fabric Lookup Tables |
|---|---|
|
Use Scenario: High-speed Ethernet line card buffering packets at 100 Gbps line rate with minimal latency jitter. IC Role / Device Role / Timing Role: Dual-port SRAM serving as ingress/egress FIFO with concurrent read/write access to same memory space. Use Value: Eliminates bus turnaround overhead, enabling sustained 666 MT/s throughput per port - directly supporting wire-speed packet queuing. |
Use Scenario: Layer 2/L3 forwarding table storage in modular chassis switches requiring real-time MAC/IP address resolution. IC Role / Device Role / Timing Role: QDR II SRAM acting as associative memory for parallel CAM-like lookups using pipelined read latency. Use Value: 1.5-cycle latency mode (DOFF = HIGH) ensures timing closure at 333 MHz while maintaining concurrent transaction capability. |
| Telecom Baseband Processing | High-Frequency Trading Systems |
|
Use Scenario: LTE/5G baseband unit storing interleaved IQ samples and FFT coefficients with strict deterministic access timing. IC Role / Device Role / Timing Role: Memory buffer interfacing with FPGA-based DSP engines via HSTL I/O, synchronized to C/C echo clocks. Use Value: CQ/CQ echo clocks align data valid windows to FPGA sampling points - reducing timing margin allocation by ≥150 ps. |
Use Scenario: Ultra-low-latency order matching engine requiring microsecond-level memory access consistency across multiple cores. IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by CPU and FPGA co-processors for real-time market data caching. Use Value: Independent RPS/WPS controls enable lock-free inter-processor communication - avoiding software synchronization bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L5 | 36-Mbit QDR II+, 350 MHz max, 1.5 V core, LVDS I/O - no echo clocks, fixed 1.5-cycle latency | Lacks CQ/CQ timing aids; requires tighter board-level skew control; higher power at 350 MHz | Prefer when system already uses LVDS signaling and echo-clock simplification is not required |
| ISSI IS61WV102436B | 36-Mbit QDR II, 250 MHz max, 1.8 V core, HSTL I/O - no DOFF latency selection, no JTAG | Lower bandwidth ceiling limits use in >100 Gbps systems; lacks programmable latency and boundary scan testability | Choose for cost-sensitive, lower-speed telecom modules where JTAG debug and latency flexibility are noncritical |
Compared with IDT72T3615L5 and IS61WV102436B, CY7C1414KV18 uniquely combines echo-clock timing assistance, DOFF-configurable latency, and JTAG 1149.1 support - making it optimal for high-reliability, timing-critical networking hardware requiring debug visibility and layout margin.
Availability
CY7C1414KV18 is available at Aetrix Electronics and suitable for high-bandwidth networking equipment, telecom infrastructure, and FPGA-accelerated data processing systems requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1414KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
CY7C1414KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in packet-switched infrastructure.
FAQ
What is the function of the DOFF pin on CY7C1414KV18?
The DOFF (Data Output OFFset) pin configures read latency: when held LOW, the device operates with 1-cycle read latency; when HIGH, it uses 1.5-cycle latency. This setting determines internal pipeline depth and directly impacts timing closure margins at 333 MHz - no external configuration register or command is required.
Can CY7C1414KV18 operate with only a single clock signal?
Yes - the device supports single-clock mode where K serves as both input and output clock. In this mode, C and C are unused, and CQ/CQ are derived from K. However, dual-clock mode (K/K + C/C) is required to achieve full timing margin benefits from echo-clock deskewing in multi-device systems.
How does byte write select (BWS[3:0]) work on the 36-bit interface?
BWS[3:0] are four independent active-low signals, each enabling one 9-bit subword of the 36-bit D[35:0] bus: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. Only asserted BWS lines allow corresponding byte writes; unasserted lines preserve existing memory contents.
Is JTAG boundary scan supported, and what standard does it follow?
Yes - CY7C1414KV18 integrates IEEE 1149.1-compliant TAP controller with instruction register, bypass register, and boundary-scan register. It supports mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional ones (IDCODE, CLAMP), enabling full pin-level testability and interconnect verification in dense PCB assemblies.
CY7C1414KV18-333BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 333 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1414KV18-333BZC FAQ
1.How can I place an order for CY7C1414KV18-333BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1414KV18-333BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1414KV18-333BZC reliable?
The price and inventory of CY7C1414KV18-333BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1414KV18-333BZC is usually 5 days.
3.What payment methods are accepted for CY7C1414KV18-333BZC?
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Once your CY7C1414KV18-333BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1414KV18-333BZC?
For technical support, including CY7C1414KV18-333BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1414KV18-333BZC requirements.
6.How does Aetrix verify that CY7C1414KV18-333BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1414KV18-333BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1414KV18-333BZC meets industry standards.
7.What is the process for return or replacement of CY7C1414KV18-333BZC?
All CY7C1414KV18-333BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1414KV18-333BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1414KV18-333BZC part is unused and in its original packaging.
Return procedure for CY7C1414KV18-333BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1414KV18-333BZC Tags

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