Infineon Technologies CY7C1415BV18-200BZXC

Overview

CY7C1415BV18 from Cypress Semiconductor is a 1M × 36-bit, 36-Mbit QDR-II SRAM with synchronous pipelined architecture, separate read/write ports, 200 MHz maximum operating frequency (167–300 MHz range), 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It delivers concurrent high-bandwidth data access in network packet buffering and switch fabric memory applications.

For engineers reviewing the CY7C1415BV18 datasheet, CY7C1415BV18 pinout, CY7C1415BV18 application, or CY7C1415BV18 equivalent, key selection criteria include burst depth (4-word), DLL-enabled 1.5-cycle read latency, HSTL-compatible 165-ball FBGA package, and dual-clock DDR timing for simultaneous read/write at 600 MT/s effective data rate.

Technical Context

The CY7C1415BV18 implements QDR-II architecture with fully independent read and write ports sharing a single multiplexed address bus latched on alternating edges of K/K clocks. Its internal 256K × 36 memory array supports 4-word sequential burst transfers per access, eliminating bus turnaround overhead.

It uses dual DDR interfaces: write data sampled on rising edges of K/K, read data driven on rising edges of C/C with echo clocks CQ/CQ for precise capture timing. The integrated Delay Lock Loop (DLL) enables accurate 1.5-cycle read latency at 200 MHz; disabling DLL via DOFF pin reverts to QDR-I mode with 1-cycle latency and ≤167 MHz operation.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Compared with CY7C1415BV18, CY7C1413BV18 trades data width for reduced address pins and simpler byte-write control, while AS7C362000B-200BIN extends operational range and adds burst-mode configurability-both retain QDR-II timing but differ in packaging, thermal specs, and feature set.

Availability

CY7C1415BV18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, telecom line card memory, and high-performance test equipment requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1415BV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, computing, and industrial systems.

The QDR-II SRAM product line targets high-throughput, low-latency memory subsystems in networking and telecom infrastructure where deterministic burst access and concurrent read/write are critical.

FAQ

What is the minimum VDDQ voltage supported by CY7C1415BV18?

The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed and may cause output driver malfunction or timing violations. HSTL Class I compliance requires VDDQ ≥ 1.4 V, and ZQ calibration assumes this range for correct impedance tuning.

Can CY7C1415BV18 operate without an external ZQ resistor?

No - ZQ must be connected either to a precision resistor to ground (for calibrated 0.2×RQ output impedance) or directly to VDDQ (for minimum impedance mode). Leaving ZQ floating or connecting it to VSS violates the absolute maximum ratings and risks output driver damage or undefined behavior.

How does DOFF affect read latency and maximum frequency?

Asserting DOFF disables the DLL, forcing QDR-I timing: read latency drops to 1 cycle but maximum operating frequency is limited to 167 MHz. At 200 MHz, DLL must be enabled to meet AC timing specifications; DOFF is intended only for backward compatibility or low-frequency power-saving modes.

Is CY7C1415BV18 pin-compatible with other devices in the CY7C14xxBV18 family?

No - although all share the same 165-ball FBGA footprint, pin functions differ significantly across configurations (e.g., BWS[3:0] in CY7C1415BV18 vs. NWS[1:0] in CY7C1411BV18, different address widths, and distinct D/Q bus widths). Direct substitution requires PCB redesign and firmware adaptation.