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Infineon Technologies CY7C1415KV18-300BZI

Part No.:
CY7C1415KV18-300BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1415KV18-300BZI.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,702

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Product details

Overview

CY7C1415KV18 from Cypress Semiconductor is a 1 M × 36, 36-Mbit QDR® II SRAM with four-word burst architecture, 333 MHz clock operation (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, echo clocks (CQ/CQ), and programmable DOFF for 1-cycle or 1.5-cycle read latency-used in high-bandwidth packet buffering in network line cards.

For engineers reviewing the CY7C1415KV18 datasheet, CY7C1415KV18 pinout, CY7C1415KV18 application, or CY7C1415KV18 equivalent, key selection criteria include concurrent read/write throughput, FBGA-165 package compatibility, HSTL-18 I/O drive, JTAG 1149.1 test support, and QDR II timing margining with K/K and C/C dual-clock domains.

Technical Context

The CY7C1415KV18 implements a synchronous pipelined QDR II architecture with independent read and write data paths, eliminating bus turnaround overhead. Its 1 M × 36 organization uses 18 address bits (A[17:0]), four byte write selects (BWS[3:0]), and supports depth expansion via RPS/WPS control.

It employs a PLL for precise data placement and uses echo clocks (CQ/CQ) to align output data capture at the receiver. Read latency is configurable: 1 cycle when DOFF = LOW (QDR I mode), 1.5 cycles when DOFF = HIGH-enabling trade-offs between timing closure and throughput in FPGA-attached memory subsystems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (1 M × 36) - provides 4.5 MB of high-speed buffer space for multi-gigabit packet processing.
Max Clock Frequency333 MHz - enables 666 MT/s DDR data transfers per port, delivering up to 24 Gbps aggregate bandwidth.
Read Latency1 or 1.5 cycles - selectable via DOFF pin; 1-cycle mode simplifies timing in legacy QDR I designs, 1.5-cycle improves setup margin in high-speed systems.
Supply VoltagesVDD = 1.8 V ±0.1 V, VDDQ = 1.4–1.8 V - supports interoperability with 1.5 V or 1.8 V I/O standards without level shifters.
Package165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint compatible with automated PCB assembly and thermal management for telecom modules.
Interface StandardHSTL Class I - ensures signal integrity at 666 MHz with controlled-impedance routing and on-die termination (ZQ calibration).
JTAG SupportIEEE 1149.1 compliant - enables boundary scan testing and in-system programming verification without physical probe access.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Write data inputs36-bit synchronous input bus sampled on rising edge of K/K; supports full-word or byte-selectable writes via BWS[3:0].
Q[35:0]Read data outputs36-bit DDR output bus driven on rising edges of C/C; echo clocks CQ/CQ simplify source-synchronous capture at FPGA receiver.
A[17:0]Address inputs18-bit multiplexed address bus latched on K clock rising edge for both read and write operations.
WPS, RPSPort select controlsActive-low write/read port enables-allows independent depth expansion across multiple devices without external gating logic.
BWS[3:0]Byte write enablesFour active-low signals controlling D[8:0], D[17:9], D[26:18], D[35:27]; enables partial writes without read-modify-write overhead.
K, K, C, C, CQ, CQClock inputs/outputsDual-edge-aligned clocks: K/K drive internal registers; C/C drive outputs; CQ/CQ are delayed copies for receiver deskew.
DOFFLatency mode controlHigh = 1.5-cycle read latency (QDR II mode); Low = 1-cycle latency (QDR I compatibility mode).
ZQImpedance calibrationConnects to external 240 Ω resistor to ground for dynamic HSTL output driver impedance tuning.

Key Features

FeatureDesign Value
Separate read/write portsEnables true concurrent access-no bus arbitration or turnaround delay, critical for full-duplex traffic shaping in switch fabric buffers.
Four-word burst transferReduces effective address bus frequency by 4×, lowering PCB routing complexity and timing closure burden for high-speed interfaces.
Programmable read latencyDOFF pin selects between 1-cycle (QDR I) and 1.5-cycle (QDR II) modes-supports migration path and timing margin optimization.
HSTL-18 I/O with ZQ calibrationEnsures consistent 1.8 V HSTL signaling across voltage/temperature variation, eliminating manual termination resistor selection.
JTAG 1149.1 test accessProvides production-test visibility into internal registers and interconnect integrity without requiring dedicated test pads or debug headers.

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packets in 10G/40G Ethernet switches with zero-latency forwarding requirements.

IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM acting as shared buffer between MAC and switching fabric, synchronized to FPGA logic clocks.

Use Value: Concurrent read/write eliminates contention stalls, enabling deterministic 666 MT/s throughput per port for full-line-rate packet queuing.

Use Scenario: Frame buffering in OTN/SONET framer ASICs where bursty traffic demands predictable latency and jitter-free access.

IC Role / Device Role / Timing Role: Dedicated QDR II memory interfaced to framer's parallel data bus, using CQ/CQ for sub-100 ps skew-controlled capture.

Use Value: Echo clocks reduce timing uncertainty to <15 ps, meeting SONET OC-192 jitter tolerance without complex PCB length matching.

FPGA-Accelerated Compute CacheHigh-Speed Test Equipment Memory

Use Scenario: Off-chip cache for FPGA-based real-time signal processors handling radar pulse compression or beamforming.

IC Role / Device Role / Timing Role: Low-latency memory extension co-timed with FPGA fabric, leveraging DOFF=LOW for 1-cycle reads to minimize pipeline bubbles.

Use Value: 1-cycle latency mode reduces average memory access time by 30% vs. 1.5-cycle mode, improving compute throughput in tight-loop algorithms.

Use Scenario: Pattern memory in automated test equipment (ATE) generating multi-GHz digital stimulus waveforms.

IC Role / Device Role / Timing Role: High-reliability SRAM storing vector sequences, accessed synchronously to precision clock generators with K/K domain isolation.

Use Value: Independent K/K and C/C clock domains prevent metastability during high-frequency pattern switching, ensuring bit-accurate waveform replay.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615036-Mbit QDR II+, 333 MHz, 1.5 V core, LVDS outputs instead of HSTLRequires differential routing and 1.5 V supply only; no ZQ calibration or DOFF latency selectionPrefer when system already uses LVDS infrastructure and needs lower power; avoid if HSTL compatibility or flexible latency is required.
ISSI IS61QW363636-Mbit QDR II, 250 MHz max, 1.8 V core/I/O, same FBGA-165 package but no echo clocks or JTAGLacks CQ/CQ and IEEE 1149.1 support; limited to 250 MHz-reduces bandwidth by 25%Select for cost-sensitive, lower-speed applications where echo clock deskew and production testability are not needed.

Compared with IDT72T36150 and IS61QW3636, CY7C1415KV18 uniquely combines HSTL-18 I/O with ZQ calibration, programmable latency (DOFF), and echo clocks-making it optimal for FPGA-based systems demanding timing margin, signal integrity, and test coverage at 333 MHz.

Availability

CY7C1415KV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA-accelerated compute cache, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for CY7C1415KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR® II SRAM product line was designed specifically for high-bandwidth, low-latency buffering in networking and telecom infrastructure-emphasizing concurrent access, DDR timing robustness, and system-level signal integrity.

FAQ

What is the function of the DOFF pin on CY7C1415KV18?

The DOFF (Data Output Fall-off) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency (standard QDR II operation); when LOW, it reverts to 1-cycle latency (QDR I compatibility). This setting directly affects timing budget allocation for read data valid windows and must be held stable during operation.

Does CY7C1415KV18 support single-ended clocking?

No-CY7C1415KV18 requires differential clock pairs: K/K for input register control and C/C for output register control. The device does not support single-ended clock inputs; using only one leg violates AC timing specifications and may cause metastability or data corruption.

How many byte write select signals does CY7C1415KV18 use, and what do they control?

CY7C1415KV18 uses four byte write select signals: BWS[3:0]. BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Each is active-low and sampled synchronously with K/K to enable partial 9-bit byte writes without disturbing unselected bytes.

Is ZQ calibration mandatory for reliable operation?

Yes-ZQ calibration is required to maintain HSTL output impedance accuracy across voltage and temperature. The device samples the external 240 Ω resistor on power-up and periodically during operation; omitting ZQ connection causes output driver mismatch, leading to signal integrity degradation and potential timing violations above 250 MHz.

CY7C1415KV18-300BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1415KV18-300BZI FAQ

1.How can I place an order for CY7C1415KV18-300BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1415KV18-300BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1415KV18-300BZI reliable?

The price and inventory of CY7C1415KV18-300BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1415KV18-300BZI is usually 5 days.

3.What payment methods are accepted for CY7C1415KV18-300BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1415KV18-300BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1415KV18-300BZI?

CY7C1415KV18-300BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1415KV18-300BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1415KV18-300BZI?

For technical support, including CY7C1415KV18-300BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1415KV18-300BZI requirements.

6.How does Aetrix verify that CY7C1415KV18-300BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1415KV18-300BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1415KV18-300BZI meets industry standards.

7.What is the process for return or replacement of CY7C1415KV18-300BZI?

All CY7C1415KV18-300BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1415KV18-300BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1415KV18-300BZI part is unused and in its original packaging.

Return procedure for CY7C1415KV18-300BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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