Infineon Technologies CY7C1418AV18-267BZC

Overview

CY7C1418AV18-267BZC from Cypress Semiconductor is a 36 Mbit (2M × 18) synchronous pipelined DDR II SRAM with two-word burst architecture, 300 MHz K/K clock input, 600 Mbps DDR data transfer rate, and HSTL I/O interface operating at 1.8 V core supply. It serves as high-bandwidth buffer memory in network packet processors requiring precise timing alignment between address, control, and echo-clocked data paths.

For engineers reviewing the CY7C1418AV18-267BZC datasheet, CY7C1418AV18-267BZC pinout, CY7C1418AV18-267BZC application, or CY7C1418AV18-267BZC equivalent, key selection criteria include DDR II burst timing compliance, C/C and CQ/CQ echo clock synchronization, HSTL output drive adjustability, and FBGA-165 package thermal/mechanical compatibility with high-speed PCB routing constraints.

Technical Context

This SRAM implements a synchronous pipelined architecture where all inputs (address, R/W, LD, BWS) are registered on rising edges of K/K clocks, and all outputs (DQ, CQ/CQ) are edge-aligned to C/C clocks. The internal burst counter uses A0 to generate sequential 18-bit word addresses during each access cycle.

It integrates a Delay Lock Loop (DLL) for sub-cycle data placement accuracy and supports both dual-clock (K/K + C/C) and single-clock (K/K only, with C/C strapped high) operation modes. Echo clocks CQ/CQ are free-running, phase-aligned replicas of C/C referenced to device outputs, enabling controller-side deskewing without per-device timing calibration.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm footprint, 1.4 mm height, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with AS7C33618A-20BIN and IS61WV102418BLL-10BLI, CY7C1418AV18-267BZC uniquely delivers 300 MHz DDR II burst operation with integrated DLL and echo clocks - essential for deterministic timing in >1 Gbps memory interfaces where per-pin skew management is impractical.

Availability

CY7C1418AV18-267BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and baseband processing applications requiring stable component supply, long-lifecycle support, and guaranteed Pb-free manufacturing compliance.

Supply support for CY7C1418AV18-267BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

CY7C1418AV18 belongs to Cypress's DDR II SyncBurst SRAM product line, designed specifically for high-throughput, low-latency buffering in networking and wireless infrastructure equipment where deterministic DDR timing and echo-clock–assisted data capture are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1418AV18-267BZC?

The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled LOW, the DLL stops adjusting output timing, resulting in increased data valid window uncertainty and invalidating all timing parameters specified in the datasheet. It is intended only for debug or low-power standby modes-not normal operation.

Can CY7C1418AV18-267BZC operate without external C/C clocks?

Yes - it supports single-clock mode where C and C are strapped HIGH at power-on. In this mode, K/K clocks control both input registration and output timing, and CQ/CQ are generated relative to K/K. All timing parameters remain unchanged, but board-level deskewing capability is lost since echo clocks no longer track C/C flight time variations.

How does ZQ calibration affect signal integrity?

ZQ calibration adjusts the output driver strength of DQ, CQ, and CQ pins to match a 240 Ω external resistor to ground, targeting 50 Ω trace impedance. This minimizes reflections and ensures consistent rise/fall times across temperature and voltage, maintaining <0.3 UI jitter at 600 Mbps - critical for reliable eye opening in high-speed DDR links.

Is CY7C1418AV18-267BZC pin-compatible with CY7C1420AV18-267BZC?

No - although both use the same 165-ball FBGA package, their pinouts differ significantly. CY7C1418AV18-267BZC has DQ[17:0], BWS[1:0], and 21 address lines (A[20:0]), while CY7C1420AV18-267BZC has DQ[35:0], BWS[3:0], and 20 address lines (A[19:0]). Interchangeability would require PCB redesign and firmware changes to accommodate different data width and burst addressing.