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Infineon Technologies CY7C1418AV18-267BZXC

Part No.:
CY7C1418AV18-267BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1418AV18-267BZXC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

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Product details

Overview

CY7C1418AV18-267BZXC from Cypress Semiconductor is a 36 Mbit (2M × 18) synchronous pipelined DDR II SRAM with two-word burst architecture, 300 MHz K-clock operation, 600 Mbps DDR data transfer rate, and 1.8 V core supply. It serves as high-bandwidth buffer memory in network packet processors requiring low-latency, burst-aligned data access.

For engineers reviewing the CY7C1418AV18-267BZXC datasheet, CY7C1418AV18-267BZXC pinout, CY7C1418AV18-267BZXC application, or CY7C1418AV18-267BZXC equivalent, key selection criteria include DDR II timing compliance, HSTL I/O compatibility, DLL-enabled data placement accuracy, and FBGA-165 mechanical fit for dense routing.

Technical Context

This SRAM implements a synchronous pipelined architecture with dual input clocks (K/K) for address/control latching and dual output clocks (C/C) for data strobing. Its internal burst counter uses A0 to generate sequential 18-bit word addresses on alternate K edges, enabling two-word bursts without external address incrementing.

The device integrates echo clocks (CQ/CQ) synchronized to C/C for source-synchronous data capture, and supports both dual-clock (DDR) and single-clock modes via strap configuration. All writes are internally self-timed, and ZQ pin enables dynamic output impedance tuning to match system bus termination.

Key Specifications

ParameterValue and Actual Design Meaning
Density36 Mbit (2M × 18), enabling 2M-word storage with 18-bit parallel interface
Max Clock Frequency300 MHz K-clock, supporting 600 Mbps effective data rate in DDR mode
I/O VoltageHSTL Class I compliant (VDDQ = 1.8 V, VREF referenced), ensuring signal integrity at high speed
Burst LengthFixed two-word burst, reducing address bus toggling and simplifying controller logic
Package165-ball FBGA (15 × 17 × 1.4 mm), optimized for thermal dissipation and PCB trace density
Core Supply1.8 V ± 0.1 V, minimizing dynamic power while maintaining timing margins
Output DriveVariable-strength HSTL outputs (1.4 V–VDDQ range), allowing fine-tuned slew control

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm footprint, 1.4 mm height, RoHS-compliant Pb-free option available.

Pin/TerminalCircuit RoleDesign Meaning
DQ[17:0]Synchronous bidirectional data18-bit DDR data bus shared for read/write; driven on C/C rising edges during reads, sampled on K/K rising edges during writes
K / KPositive/negative input clockEdge-triggered master clocks for all synchronous inputs (address, R/W, LD, BWS); define pipeline stages
C / CPositive/negative output clockDeskew-capable clocks for read data output; enable board-level flight time compensation across multiple devices
CQ / CQEcho clocks referenced to C/CFree-running source-synchronous clocks aligned to Q[17:0] edges, eliminating need for separate capture logic
LDSynchronous load strobeInitiates each burst transaction on K edge; defines address and R/W direction for the full two-word cycle
BWS[1:0]Byte write select (active LOW)Independent control of D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word writes without read-modify-write overhead
ZQImpedance calibration referenceConnects to external resistor to ground to calibrate output driver strength to 0.2 × RQ, matching PCB trace impedance
DOFFDLL disable controlActive-LOW pin to bypass Delay Lock Loop; used only when DLL-induced jitter outweighs skew correction benefit

Key Features

FeatureDesign Value
Two-word burst architectureReduces external address bus frequency by 50% versus single-word SRAM, easing controller timing closure
Integrated DLL with echo clocks (CQ/CQ)Enables deterministic ±50 ps data-to-clock alignment at 300 MHz, eliminating per-device capture tuning
HSTL Class I I/O with variable driveSupports 1.4–1.8 V output swing and programmable slew rate, matching diverse FPGA/ASIC receiver thresholds
On-chip self-timed writeRemoves external write pulse width constraints; guarantees reliable write completion within one K-cycle window
JTAG 1149.1 test access portEnables boundary scan testing and in-system debug without additional test fixtures or probe points

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM buffer interfacing directly to MAC-layer controllers via DDR HSTL bus.

Use Value: Two-word burst reduces controller address generation overhead; DLL-aligned CQ clocks ensure reliable 600 Mbps header parsing without retiming logic.

Use Scenario: Holding real-time voice sample buffers and signaling tables in TDM-over-packet gateways.

IC Role / Device Role / Timing Role: Synchronous burst memory providing deterministic 300 MHz read/write access to DSP co-processors.

Use Value: Variable-drive HSTL outputs maintain signal integrity across long backplane traces; ZQ calibration adapts to temperature-induced impedance drift.

Industrial PLC Data LoggingTest Equipment Pattern Memory

Use Scenario: Capturing sensor timestamped values at 100 kS/s in deterministic automation controllers.

IC Role / Device Role / Timing Role: Burst-aligned SRAM acting as circular buffer between ADC interface and ARM-based host processor.

Use Value: Single-clock mode simplifies timing integration with microcontroller GPIO; LD-controlled burst ensures atomic sample group writes.

Use Scenario: Storing stimulus/response vectors for high-speed digital pattern generators operating at 300 MHz.

IC Role / Device Role / Timing Role: DDR II SRAM delivering consecutive 18-bit test words synchronized to pattern generator clock domain.

Use Value: C/C deskew capability eliminates inter-device skew across multi-SRAM vector banks; BWS[1:0] enables selective vector patching.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C362000B-20BIN20 ns async access, no DDR interface or DLL; 3.3 V core; SOJ-54 packageLacks burst, echo clocks, and HSTL - suitable only for legacy non-pipelined systemsSelect only if DDR timing and 1.8 V operation are not required and board layout cannot accommodate FBGA
IS61WV102418BLL-10BLI10 ns async access, 1.8 V core, but no DDR, no burst, no echo clocks; 100-pin TQFPLower bandwidth, higher latency, no source-synchronous timing - limited to moderate-speed bufferingChoose when cost sensitivity outweighs performance needs and JTAG/testability is unnecessary

Compared with AS7C362000B-20BIN and IS61WV102418BLL-10BLI, CY7C1418AV18-267BZXC delivers 3× higher effective bandwidth via DDR + burst, eliminates external skew compensation with CQ/CQ, and enables deterministic timing closure in 300 MHz systems - critical for next-gen networking and test equipment.

Availability

CY7C1418AV18-267BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1418AV18-267BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets.

CY7C1418AV18 belongs to the DDR II SyncBurst SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where burst efficiency and source-synchronous timing are mandatory.

FAQ

What is the function of the DOFF pin?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. This bypasses DLL-based data alignment, reverting timing to basic K/K-driven output registration. Use only when DLL-induced jitter exceeds board-level skew benefits - timing parameters shift significantly and require revalidation per the "DLL Off" section of the datasheet.

Can CY7C1418AV18-267BZXC operate without external C and C clocks?

Yes - it supports single-clock mode. Tie C and C HIGH at power-on to configure the device to use K/K for both input sampling and output driving. In this mode, all timing references derive from K/K, eliminating need for separate output clocks but forfeiting C/C deskew capability and echo clock advantages.

How does ZQ calibration affect signal integrity?

ZQ calibration adjusts output driver strength to match the system's data bus characteristic impedance. Connecting ZQ to a precision resistor to ground sets output impedance to 0.2 × RQ, minimizing reflections and improving eye diagram margin. Leaving ZQ unconnected or tied to GND violates specification and causes undefined output behavior.

Is the CY7C1418AV18-267BZXC pin-compatible with CY7C1420AV18?

No - they are not pin-compatible. CY7C1418AV18 (2M × 18) uses DQ[17:0], BWS[1:0], and 21 address bits (A[20:0]), while CY7C1420AV18 (1M × 36) uses DQ[35:0], BWS[3:0], and 20 address bits (A[19:0]). Pin assignments differ significantly in ball map, especially for data, byte selects, and address lines.

CY7C1418AV18-267BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
267 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1418AV18-267BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1418AV18-267BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1418AV18-267BZXC reliable?

The price and inventory of CY7C1418AV18-267BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1418AV18-267BZXC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1418AV18-267BZXC transactions.

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CY7C1418AV18-267BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1418AV18-267BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1418AV18-267BZXC?

For technical support, including CY7C1418AV18-267BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1418AV18-267BZXC requirements.

6.How does Aetrix verify that CY7C1418AV18-267BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1418AV18-267BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1418AV18-267BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1418AV18-267BZXC?

All CY7C1418AV18-267BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1418AV18-267BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1418AV18-267BZXC part is unused and in its original packaging.

Return procedure for CY7C1418AV18-267BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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