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Infineon Technologies CY7C1418BV18-250BZXC

Part No.:
CY7C1418BV18-250BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1418BV18-250BZXC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,369

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Product details

Overview

CY7C1418BV18-250BZXC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR-II synchronous pipelined SRAM with 2-word burst architecture, 250 MHz maximum operating frequency, 1.8 V core supply, and HSTL I/O. It delivers 500 MB/s bandwidth via double-data-rate transfers synchronized to echo clocks CQ/CQ, and is used in high-speed packet buffering for network switches and telecom line cards.

For engineers reviewing the CY7C1418BV18-250BZXC datasheet, CY7C1418BV18-250BZXC pinout, CY7C1418BV18-250BZXC application, or CY7C1418BV18-250BZXC equivalent, key selection criteria include DDR-II timing compliance, DLL-enabled 1.5-cycle read latency, 165-ball FBGA (15 × 17 mm) mechanical compatibility, and HSTL-18 I/O voltage tolerance with variable drive strength.

Technical Context

This SRAM implements a synchronous pipelined architecture with dual input clocks (K/K) for address/data capture and dual output clocks (C/C) for data launch, enabling precise DDR timing control. Burst counter logic uses A0 as LSB input to sequence two 18-bit words per access, eliminating external address sequencing logic.

The integrated Delay Lock Loop (DLL) aligns internal data paths to achieve 1.5-cycle read latency at 250 MHz when DOFF = HIGH; disabling DLL via DOFF = LOW reverts operation to DDR-I mode with 1-cycle latency and ≤167 MHz max frequency. Echo clocks CQ/CQ are free-running and phase-aligned to C/C, simplifying system-level data capture without per-device skew compensation.

Key Specifications

ParameterValue and Actual Design Meaning
Density & Organization36 Mbit (2M × 18), supporting 2-word burst reads/writes per address cycle
Max Clock Frequency250 MHz K/K input clock; enables 500 MB/s peak bandwidth via DDR transfers
Read Latency1.5 cycles with DLL enabled (DOFF = HIGH); 1 cycle with DLL disabled (DOFF = LOW)
I/O StandardHSTL Class I (1.4 V–1.8 V VDDQ), with ZQ-pin impedance calibration for ±10% bus matching
Supply Voltages1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ), separate VSS planes for analog/digital isolation
Package165-ball Fine-Pitch BGA (15 mm × 17 mm × 1.4 mm), RoHS-compliant Pb-free option
JTAG SupportIEEE 1149.1-compliant TAP controller for boundary-scan testing and debug

Pinout & Package

165-ball FBGA (15 × 17 × 1.4 mm) with 0.8 mm ball pitch; thermal pad exposed on underside for enhanced heat dissipation in high-throughput memory subsystems.

Pin/TerminalCircuit RoleDesign Meaning
DQ[17:0]Synchronous bidirectional data bus18-bit DDR data path; sampled on K/K rising edges during writes, driven on C/C rising edges during reads
K / KInput clock pairRising edges latch all synchronous inputs (address, R/W, BWS); define access initiation timing
C / COutput clock pairRising edges launch read data; used with CQ/CQ to deskew flight time across multi-SRAM systems
CQ / CQEcho clock outputsFree-running, phase-aligned copies of C/C; enable source-synchronous capture at controller without routing delay matching
BWS[1:0]Byte write selectActive-low signals controlling 9-bit byte writes to DQ[8:0] and DQ[17:9]; support partial-word updates
A[20:0]Address inputs21-bit multiplexed address bus; A0 drives internal burst counter for sequential 18-bit word access
DOFFDLL enable/disableActive-low pin: HIGH enables DDR-II mode (1.5-cycle latency); LOW forces DDR-I mode (1-cycle latency, ≤167 MHz)
ZQImpedance calibration referenceConnects to external 240 Ω resistor to GND; calibrates output driver impedance to 0.2 × RQ = 48 Ω ±10%

Key Features

FeatureDesign Value
2-word burst architectureReduces external address bus toggling by 50% versus single-word SRAMs, lowering system EMI and routing complexity
DLL-assisted timing alignmentEliminates need for board-level trace length matching between clock and data nets in DDR-II mode
HSTL-18 I/O with ZQ calibrationEnsures consistent signal integrity across temperature/voltage corners without manual termination resistor tuning
Configurable DDR-I/DDR-II operationSingle hardware pin (DOFF) selects between 1-cycle latency (legacy compatibility) and 1.5-cycle latency (higher bandwidth)
JTAG 1149.1 test access portEnables in-system verification of interconnects and memory initialization sequences during production test

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC controllers via DDR-II bus.

Use Value: 500 MB/s throughput supports full-duplex 10Gbps line rates with sub-20 ns read latency in DLL-on mode.

Use Scenario: Temporary storage of voice-over-IP (VoIP) payload packets in carrier-grade DSLAMs and OLTs.

IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as jitter buffer and packet reassembly memory.

Use Value: 2M × 18 organization matches standard ATM/PTM cell sizes; HSTL I/O ensures clean signal integrity over backplane traces.

High-Speed Test Equipment MemoryIndustrial Real-Time Control Buffer

Use Scenario: Capturing high-frequency analog-to-digital samples in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic, zero-wait-state access for real-time waveform generation.

Use Value: 250 MHz clock rate enables 4 ns cycle time; DLL synchronization eliminates setup/hold violations at controller interface.

Use Scenario: Holding motion control command sequences in CNC machine tool controllers requiring deterministic execution.

IC Role / Device Role / Timing Role: Deterministic-access memory buffer between FPGA sequencer and servo drive interface.

Use Value: 1.5-cycle latency guarantees predictable 6 ns worst-case read response; 165-ball FBGA fits compact industrial PCB layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C33618B-250BIN36-Mbit (2M × 18), 250 MHz, but uses SSTL-2 I/O (2.5 V) instead of HSTL-18 (1.8 V)Requires level-shifting for 1.8 V system integration; lacks echo clocks (CQ/CQ) and DLLSelect only if existing design uses 2.5 V I/O rails and can tolerate higher power and reduced timing margin
IS61WV102418BLL-250BLI18-Mbit (512K × 36), 250 MHz, asynchronous interface with no DDR or burst capabilityNeeds external address sequencing logic; no echo clocks or DLL; lower density per packageChoose only for legacy designs requiring simple parallel SRAM interface without DDR timing constraints

Compared with AS7C33618B-250BIN and IS61WV102418BLL-250BLI, CY7C1418BV18-250BZXC uniquely delivers DDR-II timing, echo-clock–assisted data capture, and DLL-based latency optimization - critical for 250 MHz system-level timing closure without board-level skew compensation.

Availability

CY7C1418BV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and industrial real-time control buffer applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1418BV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, industrial, and automotive systems, emphasizing signal integrity and timing precision.

CY7C1418BV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in systems where DDR timing predictability and echo-clock–based data capture eliminate board-level routing constraints.

FAQ

What is the function of the DOFF pin on CY7C1418BV18-250BZXC?

The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled HIGH, the device operates in DDR-II mode with 1.5-cycle read latency at up to 250 MHz. When pulled LOW, it reverts to DDR-I mode with 1-cycle latency and a maximum frequency of 167 MHz, simplifying timing closure in less demanding applications.

How does the ZQ pin affect output driver impedance calibration?

The ZQ pin connects to a 240 Ω resistor to ground, enabling on-die calibration of DQ[17:0], CQ, and CQ output drivers to 48 Ω ±10%. This ensures consistent HSTL-18 signal integrity across voltage and temperature variations without external termination resistors, reducing PCB component count and layout sensitivity.

Can CY7C1418BV18-250BZXC operate with only K and K clocks, without C and C?

Yes - in single-clock-domain mode, the device uses K and K for both input sampling and output launching. Read data is driven on the rising edges of K and K instead of C and C, and CQ/CQ are generated relative to K/K. This reduces clock routing complexity but sacrifices the deskewing benefits of dedicated output clocks.

What is the purpose of BWS[1:0] pins in the 2M × 18 configuration?

BWS[1:0] are active-low byte write select signals that enable partial 9-bit writes to the 18-bit data bus: BWS0 controls DQ[8:0], BWS1 controls DQ[17:9]. When one BWS is deasserted, its corresponding 9-bit byte remains unaltered during a write, allowing efficient updates to specific fields within a 18-bit word without read-modify-write overhead.

CY7C1418BV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1418BV18-250BZXC FAQ

1.How can I place an order for CY7C1418BV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1418BV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1418BV18-250BZXC reliable?

The price and inventory of CY7C1418BV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1418BV18-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1418BV18-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1418BV18-250BZXC transactions.

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CY7C1418BV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1418BV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1418BV18-250BZXC?

For technical support, including CY7C1418BV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1418BV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1418BV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1418BV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1418BV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1418BV18-250BZXC?

All CY7C1418BV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1418BV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1418BV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1418BV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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