Infineon Technologies CY7C1418BV18-250BZXC
- Part No.:
- CY7C1418BV18-250BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1418BV18-250BZXC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,369
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1418BV18-250BZXC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR-II synchronous pipelined SRAM with 2-word burst architecture, 250 MHz maximum operating frequency, 1.8 V core supply, and HSTL I/O. It delivers 500 MB/s bandwidth via double-data-rate transfers synchronized to echo clocks CQ/CQ, and is used in high-speed packet buffering for network switches and telecom line cards.
For engineers reviewing the CY7C1418BV18-250BZXC datasheet, CY7C1418BV18-250BZXC pinout, CY7C1418BV18-250BZXC application, or CY7C1418BV18-250BZXC equivalent, key selection criteria include DDR-II timing compliance, DLL-enabled 1.5-cycle read latency, 165-ball FBGA (15 × 17 mm) mechanical compatibility, and HSTL-18 I/O voltage tolerance with variable drive strength.
Technical Context
This SRAM implements a synchronous pipelined architecture with dual input clocks (K/K) for address/data capture and dual output clocks (C/C) for data launch, enabling precise DDR timing control. Burst counter logic uses A0 as LSB input to sequence two 18-bit words per access, eliminating external address sequencing logic.
The integrated Delay Lock Loop (DLL) aligns internal data paths to achieve 1.5-cycle read latency at 250 MHz when DOFF = HIGH; disabling DLL via DOFF = LOW reverts operation to DDR-I mode with 1-cycle latency and ≤167 MHz max frequency. Echo clocks CQ/CQ are free-running and phase-aligned to C/C, simplifying system-level data capture without per-device skew compensation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 36 Mbit (2M × 18), supporting 2-word burst reads/writes per address cycle |
| Max Clock Frequency | 250 MHz K/K input clock; enables 500 MB/s peak bandwidth via DDR transfers |
| Read Latency | 1.5 cycles with DLL enabled (DOFF = HIGH); 1 cycle with DLL disabled (DOFF = LOW) |
| I/O Standard | HSTL Class I (1.4 V–1.8 V VDDQ), with ZQ-pin impedance calibration for ±10% bus matching |
| Supply Voltages | 1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ), separate VSS planes for analog/digital isolation |
| Package | 165-ball Fine-Pitch BGA (15 mm × 17 mm × 1.4 mm), RoHS-compliant Pb-free option |
| JTAG Support | IEEE 1149.1-compliant TAP controller for boundary-scan testing and debug |
Pinout & Package
165-ball FBGA (15 × 17 × 1.4 mm) with 0.8 mm ball pitch; thermal pad exposed on underside for enhanced heat dissipation in high-throughput memory subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; sampled on K/K rising edges during writes, driven on C/C rising edges during reads |
| K / K | Input clock pair | Rising edges latch all synchronous inputs (address, R/W, BWS); define access initiation timing |
| C / C | Output clock pair | Rising edges launch read data; used with CQ/CQ to deskew flight time across multi-SRAM systems |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of C/C; enable source-synchronous capture at controller without routing delay matching |
| BWS[1:0] | Byte write select | Active-low signals controlling 9-bit byte writes to DQ[8:0] and DQ[17:9]; support partial-word updates |
| A[20:0] | Address inputs | 21-bit multiplexed address bus; A0 drives internal burst counter for sequential 18-bit word access |
| DOFF | DLL enable/disable | Active-low pin: HIGH enables DDR-II mode (1.5-cycle latency); LOW forces DDR-I mode (1-cycle latency, ≤167 MHz) |
| ZQ | Impedance calibration reference | Connects to external 240 Ω resistor to GND; calibrates output driver impedance to 0.2 × RQ = 48 Ω ±10% |
Key Features
| Feature | Design Value |
|---|---|
| 2-word burst architecture | Reduces external address bus toggling by 50% versus single-word SRAMs, lowering system EMI and routing complexity |
| DLL-assisted timing alignment | Eliminates need for board-level trace length matching between clock and data nets in DDR-II mode |
| HSTL-18 I/O with ZQ calibration | Ensures consistent signal integrity across temperature/voltage corners without manual termination resistor tuning |
| Configurable DDR-I/DDR-II operation | Single hardware pin (DOFF) selects between 1-cycle latency (legacy compatibility) and 1.5-cycle latency (higher bandwidth) |
| JTAG 1149.1 test access port | Enables in-system verification of interconnects and memory initialization sequences during production test |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC controllers via DDR-II bus. Use Value: 500 MB/s throughput supports full-duplex 10Gbps line rates with sub-20 ns read latency in DLL-on mode. | Use Scenario: Temporary storage of voice-over-IP (VoIP) payload packets in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as jitter buffer and packet reassembly memory. Use Value: 2M × 18 organization matches standard ATM/PTM cell sizes; HSTL I/O ensures clean signal integrity over backplane traces. |
| High-Speed Test Equipment Memory | Industrial Real-Time Control Buffer |
Use Scenario: Capturing high-frequency analog-to-digital samples in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic, zero-wait-state access for real-time waveform generation. Use Value: 250 MHz clock rate enables 4 ns cycle time; DLL synchronization eliminates setup/hold violations at controller interface. | Use Scenario: Holding motion control command sequences in CNC machine tool controllers requiring deterministic execution. IC Role / Device Role / Timing Role: Deterministic-access memory buffer between FPGA sequencer and servo drive interface. Use Value: 1.5-cycle latency guarantees predictable 6 ns worst-case read response; 165-ball FBGA fits compact industrial PCB layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33618B-250BIN | 36-Mbit (2M × 18), 250 MHz, but uses SSTL-2 I/O (2.5 V) instead of HSTL-18 (1.8 V) | Requires level-shifting for 1.8 V system integration; lacks echo clocks (CQ/CQ) and DLL | Select only if existing design uses 2.5 V I/O rails and can tolerate higher power and reduced timing margin |
| IS61WV102418BLL-250BLI | 18-Mbit (512K × 36), 250 MHz, asynchronous interface with no DDR or burst capability | Needs external address sequencing logic; no echo clocks or DLL; lower density per package | Choose only for legacy designs requiring simple parallel SRAM interface without DDR timing constraints |
Compared with AS7C33618B-250BIN and IS61WV102418BLL-250BLI, CY7C1418BV18-250BZXC uniquely delivers DDR-II timing, echo-clock–assisted data capture, and DLL-based latency optimization - critical for 250 MHz system-level timing closure without board-level skew compensation.
Availability
CY7C1418BV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and industrial real-time control buffer applications requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1418BV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, industrial, and automotive systems, emphasizing signal integrity and timing precision.
CY7C1418BV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in systems where DDR timing predictability and echo-clock–based data capture eliminate board-level routing constraints.
FAQ
What is the function of the DOFF pin on CY7C1418BV18-250BZXC?
The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled HIGH, the device operates in DDR-II mode with 1.5-cycle read latency at up to 250 MHz. When pulled LOW, it reverts to DDR-I mode with 1-cycle latency and a maximum frequency of 167 MHz, simplifying timing closure in less demanding applications.
How does the ZQ pin affect output driver impedance calibration?
The ZQ pin connects to a 240 Ω resistor to ground, enabling on-die calibration of DQ[17:0], CQ, and CQ output drivers to 48 Ω ±10%. This ensures consistent HSTL-18 signal integrity across voltage and temperature variations without external termination resistors, reducing PCB component count and layout sensitivity.
Can CY7C1418BV18-250BZXC operate with only K and K clocks, without C and C?
Yes - in single-clock-domain mode, the device uses K and K for both input sampling and output launching. Read data is driven on the rising edges of K and K instead of C and C, and CQ/CQ are generated relative to K/K. This reduces clock routing complexity but sacrifices the deskewing benefits of dedicated output clocks.
What is the purpose of BWS[1:0] pins in the 2M × 18 configuration?
BWS[1:0] are active-low byte write select signals that enable partial 9-bit writes to the 18-bit data bus: BWS0 controls DQ[8:0], BWS1 controls DQ[17:9]. When one BWS is deasserted, its corresponding 9-bit byte remains unaltered during a write, allowing efficient updates to specific fields within a 18-bit word without read-modify-write overhead.
CY7C1418BV18-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1418BV18-250BZXC FAQ
1.How can I place an order for CY7C1418BV18-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1418BV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1418BV18-250BZXC reliable?
The price and inventory of CY7C1418BV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1418BV18-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1418BV18-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1418BV18-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1418BV18-250BZXC?
CY7C1418BV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1418BV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1418BV18-250BZXC?
For technical support, including CY7C1418BV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1418BV18-250BZXC requirements.
6.How does Aetrix verify that CY7C1418BV18-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1418BV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1418BV18-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1418BV18-250BZXC?
All CY7C1418BV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1418BV18-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1418BV18-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1418BV18-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1418BV18-250BZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

