Infineon Technologies CY7C1418BV18-267BZXC

Overview

CY7C1418BV18 from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR-II synchronous pipelined SRAM with 267 MHz clock operation, 1.8V core supply, HSTL I/O, and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers 534 Mbps data transfer via double-data-rate interface, supports 2-word burst reads/writes, and uses echo clocks (CQ/CQ) for precise high-speed data capture in networking packet buffers and telecom line cards.

For engineers reviewing the CY7C1418BV18 datasheet, CY7C1418BV18 pinout, CY7C1418BV18 application, or CY7C1418BV18 equivalent, key selection criteria include DDR-II timing compliance, DLL-enabled 1.5-cycle read latency, HSTL-18 I/O drive strength, 2M×18 configuration matching FPGA/ASIC memory interfaces, and FBGA thermal/mechanical compatibility with high-density PCB layouts.

Technical Context

This SRAM implements a synchronous pipelined architecture with dual input clocks (K/K) for address/data capture and dual output clocks (C/C) for data launch, enabling precise DDR timing control. The internal burst counter uses A0 as LSB to sequence two 18-bit words per access, eliminating external address sequencing logic.

It integrates a Delay Lock Loop (DLL) for accurate data placement relative to C/C edges when enabled (DOFF = HIGH), achieving 1.5-cycle read latency at 267 MHz; disabling DLL via DOFF = LOW reverts operation to DDR-I mode with 1-cycle latency and ≤167 MHz max frequency.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR-II SRAM applications.

Compared with IS61WV102418B and MT46V32M18, CY7C1418BV18 uniquely combines 267 MHz DDR-II speed, DLL-based timing precision, and echo-clock–assisted data capture-making it optimal for deterministic, high-throughput packet and signal processing buffers where latency predictability outweighs density or cost trade-offs.

Availability

CY7C1418BV18 is available at Aetrix Electronics and suitable for telecom infrastructure, networking equipment, and industrial real-time control systems requiring stable component supply, long-term lifecycle support, and verified DDR-II timing compliance.

Supply support for CY7C1418BV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

CY7C1418BV18 belongs to Cypress's DDR-II SyncBurst SRAM product line, engineered specifically for deterministic, low-latency buffering in high-speed serial data paths where traditional DRAM timing variability is unacceptable.

FAQ

What is the minimum setup/hold time requirement for R/W relative to K clock?

The R/W signal must meet a 0.4 ns setup time and 0.3 ns hold time relative to the rising edge of K, as specified in the "AC Switching Characteristics" table (page 23, Rev. *D). These values assume standard HSTL-18 loading and 1.8V VDDQ operation, and are critical for reliable burst-type read/write command decoding.

Can CY7C1418BV18 operate without connecting the ZQ pin?

No-ZQ must be connected either to a precision resistor (RQ) to ground for impedance calibration or directly to VDDQ for minimum-impedance mode. Leaving ZQ floating or tying it to GND violates the absolute maximum ratings and causes undefined output drive strength and signal integrity failure.

How does the burst counter behave during consecutive read accesses?

The internal burst counter increments linearly using A0 as its LSB; for each LD assertion, it sequences two 18-bit words from adjacent addresses. Consecutive accesses automatically advance the counter, enabling seamless streaming of 36-bit-wide data without external address increment logic.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes-the 165-ball FBGA (15 × 17 × 1.4 mm) is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C, 60–90 sec above 217°C), provided board layout follows Cypress's recommended pad geometry and thermal relief guidelines.