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Infineon Technologies CY7C1418KV18-250BZCT

Part No.:
CY7C1418KV18-250BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1418KV18-250BZCT.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,691

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Product details

Overview

CY7C1418KV18-250BZCT from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR II synchronous SRAM with two-word burst architecture, 1.8 V core supply, HSTL I/O, and 250 MHz maximum clock frequency (400 Mbps data rate). It uses dual input clocks (K/K) for precise DDR timing, echo clocks (CQ/CQ) for simplified high-speed data capture, and supports programmable output impedance via ZQ pin. Used in network packet buffers and telecom line cards requiring low-latency, burst-mode memory access.

For engineers reviewing the CY7C1418KV18-250BZCT datasheet, CY7C1418KV18-250BZCT pinout, CY7C1418KV18-250BZCT application, or CY7C1418KV18-250BZCT equivalent, key selection criteria include DDR-II read latency (1.5 cycles with DOFF HIGH), 165-ball FBGA package compatibility, HSTL-18 I/O voltage range (1.4 V to 1.8 V), and JTAG 1149.1 test access support.

Technical Context

This SRAM implements a synchronous pipelined architecture with internal burst counter driven by A0, latching addresses on alternate rising edges of K and K. Read data is registered and driven on rising edges of C and C (or K and K in single-clock mode), synchronized to echo clocks CQ/CQ for deterministic capture at the controller.

The device integrates a PLL for accurate data placement, supports variable-drive HSTL outputs, and enables byte-selectable writes via BWS[1:0] with self-timed internal write circuitry. DOFF pin configures read latency: 1.5-cycle DDR-II mode (DOFF = HIGH) or 1-cycle DDR-I mode (DOFF = LOW).

Key Specifications

ParameterValue and Actual Design Meaning
Density36 Mbit (2M × 18 configuration)
Max Clock Frequency250 MHz - sets maximum sustained bandwidth at 900 MB/s (2 × 18-bit × 250 MHz)
I/O VoltageHSTL-18 compliant (1.4 V to VDD = 1.8 V) - ensures compatibility with 1.5 V or 1.8 V system buses
Read Latency1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - directly impacts pipeline depth and controller timing margin
Package165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count DDR memory modules
Core Supply1.8 V ± 0.1 V - requires dedicated low-noise LDO regulation for stable SRAM operation
JTAG SupportIEEE 1149.1 compliant - enables boundary-scan testing without additional probe points

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
DQ[17:0]Synchronous bidirectional data bus18-bit DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges with echo-clock alignment
K / KDual-phase input clock pairUsed for address/control/data capture; enables precise DDR timing without external phase-shifting circuitry
C / COutput data clock pairDeskews flight time across multiple SRAMs; allows controller to align reads from parallel devices
CQ / CQOutput echo clocksFree-running, phase-locked to C/C; eliminates need for separate strobes per SRAM in high-speed systems
DOFFRead latency mode selectLOW → 1-cycle DDR-I latency; HIGH → 1.5-cycle DDR-II latency - selects timing model for controller design
ZQOutput impedance calibration inputConnects to external 240 Ω resistor to ground; tunes DQ/CQ drive strength to match 60 Ω PCB trace impedance

Key Features

FeatureDesign Value
Two-word burst architectureReduces address bus toggling by 50% versus single-word access - lowers EMI and simplifies routing
Programmable HSTL output driveImpedance calibrated via ZQ pin to match system bus - eliminates external termination resistors
Dual echo clocks (CQ/CQ)Enables source-synchronous data capture without per-device delay tuning - critical for >400 Mbps operation
Configurable read latencyDOFF pin selects between 1-cycle (DDR-I) and 1.5-cycle (DDR-II) modes - allows trade-off between latency and timing margin
Integrated PLLEnsures sub-cycle data placement accuracy across temperature/voltage - avoids external jitter cleaners

Applications

Network Packet BufferTelecom Line Card Memory

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC controllers via DDR-II bus.

Use Value: Two-word burst reduces address bus activity by half, lowering power and routing congestion in dense switch fabrics.

Use Scenario: Holding real-time voice/video payload in TDM-over-IP gateways with strict jitter tolerance.

IC Role / Device Role / Timing Role: Synchronous burst SRAM providing deterministic 1.5-cycle read latency for jitter-sensitive buffering.

Use Value: Echo clocks (CQ/CQ) eliminate inter-device skew, enabling reliable 250 MHz operation across multi-SRAM channel banks.

Industrial PLC Data CacheRadar Signal Processing Buffer

Use Scenario: Temporarily storing sensor fusion results and control loop outputs in deterministic real-time PLCs.

IC Role / Device Role / Timing Role: Burst-access SRAM interfaced to FPGA-based control logic with tight timing closure requirements.

Use Value: DOFF-configurable latency allows optimization for either minimal pipeline depth (DOFF = LOW) or improved setup margin (DOFF = HIGH).

Use Scenario: Capturing high-speed ADC samples from phased-array radar front-ends before FFT processing.

IC Role / Device Role / Timing Role: High-throughput memory buffer synchronizing to FPGA fabric clock domain using C/C and CQ/CQ.

Use Value: 165-ball FBGA package supports dense layout with controlled-impedance routing for <100 ps skew across all 18 DQ lines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C33618A-250BIN36-Mbit DDR I (not DDR II); 1-cycle fixed latency; no echo clocks or ZQ calibrationLimited to simpler controllers without deskew capability; lower max bandwidth (500 MB/s vs 900 MB/s)Select only if legacy DDR-I interface and cost sensitivity outweigh bandwidth/latency needs.
IS45S32800J-25BLISDR SDRAM (not SRAM); 32M × 8 organization; asynchronous refresh; higher latency (CAS=3)Requires DRAM controller with refresh logic; unsuitable for deterministic real-time bufferingUse only where cost-per-bit dominates and timing predictability is non-critical.

Compared with AS7C33618A-250BIN and IS45S32800J-25BLI, CY7C1418KV18-250BZCT delivers deterministic burst latency, echo-clock–assisted data capture, and on-die impedance tuning - essential for high-reliability, high-speed embedded buffering where SDRAM unpredictability or DDR-I bandwidth limits are unacceptable.

Availability

CY7C1418KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, industrial PLC data caches, and radar signal processing buffers requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1418KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on reliability and signal integrity.

CY7C1418KV18 belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency burst buffering in high-speed networking and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1418KV18-250BZCT?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle read latency; when LOW, it reverts to DDR-I mode with 1-cycle latency. This setting directly affects controller timing budget and pipeline depth but does not alter burst length, clocking, or data width.

Can CY7C1418KV18-250BZCT operate without external C and C clocks?

Yes - the device supports single-clock mode where K and K serve as both input and output clocks. In this configuration, read data is driven on K/K edges instead of C/C, and CQ/CQ are generated relative to K. However, deskew capability and maximum timing margin are reduced compared to dual-clock operation.

How is output impedance calibrated using the ZQ pin?

ZQ connects to a 240 Ω resistor to ground, enabling on-die calibration of DQ and CQ output drivers to match 60 Ω transmission lines (0.2 × RQ). This eliminates discrete termination and improves signal integrity. Connecting ZQ to VDDQ enables minimum impedance mode; leaving it unconnected or tied to GND is prohibited.

Is CY7C1418KV18-250BZCT pin-compatible with CY7C1418KV18-333BZCT?

Yes - both share identical 165-ball FBGA package and pinout. The suffix denotes speed grade: -250BZCT supports up to 250 MHz clock (400 Mbps), while -333BZCT supports 333 MHz (666 Mbps). Electrical characteristics (VDD, VDDQ, timing parameters) differ, so controller timing must be validated per speed grade.

CY7C1418KV18-250BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1418KV18-250BZCT FAQ

1.How can I place an order for CY7C1418KV18-250BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1418KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1418KV18-250BZCT reliable?

The price and inventory of CY7C1418KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1418KV18-250BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1418KV18-250BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1418KV18-250BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1418KV18-250BZCT?

CY7C1418KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1418KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1418KV18-250BZCT?

For technical support, including CY7C1418KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1418KV18-250BZCT requirements.

6.How does Aetrix verify that CY7C1418KV18-250BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1418KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1418KV18-250BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1418KV18-250BZCT?

All CY7C1418KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1418KV18-250BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1418KV18-250BZCT part is unused and in its original packaging.

Return procedure for CY7C1418KV18-250BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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